• Journal of Surface Science and Engineering
• /
• v.38 no.2
• /
• pp.55-59
• /
• 2005

ITO/Ni/ITO thin films were deposited on the PET by RF magnetron sputtering. Dependance of the process parameters such as deposition pressure, positions of Ni layer, on the transmittance, reflectance and sheet resistance of ITO/Ni/ITO film were investigated. When the Ni layer is placed at the center of ITO and deposition pressure is low, ITO/Ni/ITO films showed better optical and electrical properties. At these conditions, the transmittance, reflectance and sheet resistance of the ITO film were $90\%,\;0.38\%$ and $185\Omega/\Box$ respectively.

• Journal of the Korean Magnetics Society
• /
• v.4 no.3
• /
• pp.239-243
• /
• 1994

$NiFe/TbCo/Si_3N_4$ thin films were fabricated, which can be employed as dualOongitudinal and transverse) biased magnetoresistive elements utilizing surface magnetic exchange at the interface of NiFe/TbCo films. When Tb area percent was 36 % and substrate bias was not applied, magnetic exchange fields of 100~180 Oe were obtained. The thicknesses of NiFe, TbCo and $Si_3N_4$(Protective layer) were $470\;{\AA},\;2400\;{\AA}\;and\;600\;{\AA}$, respectively. Magnetoresistance ratio of 1.45 % was obtained using NiFe films fabricated with 1000 W power and 2.5 mTorr of Ar pressure. The MR ratio of microstructured elements was reduced to 1.31 % and the MR response curves were shown not to saturate due to demagnetizing fields of the elements. When elements were fabricated with $36^{\circ}$ of misalignment with respect to the exchange field direction using films having 150 Oe exchange field, MR response curve was shifted by 85 Oe, and the operating point of the device shifted to the linear region of the response. Also, the Barkhausen noise was eiminated due to longitudinal bias field originating from the exchange field.

• The Transactions of the Korean Institute of Electrical Engineers C
• /
• v.50 no.1
• /
• pp.11-16
• /
• 2001

CuNi alloy films are deposited by co-sputtering of dual targets (Cu and Ni, respectively). Effects of the co-sputtering conditions, such as powers applied to the targets, deposition pressures, and substrate temperatures, on the structural and electrical properties of deposited films are systematically investigated. The composition ratio of Ni/Cu is almost linearly decreased by increasing the DC power applied to the Cu target from 25.6 W to 69.7 W with the RF power applied to the Ni target unchanged(140 W). it is noted that the chamber pressure during deposition and the film thickness give rise to a change of the Ni/Cu ratio within the films deposited. The former may be due to a higher sputtering yield of Cu atom and the latter due to the re-sputtering phenomenon of Cu atoms on the surface of deposited film. The film deposited at higher pressures or at lower substrate temperatures have a smaller crystallite size, a higher electrical resistivity, and much more voids. This may be attributed to a lower surface mobility of sputtered atoms over the substrate.

• Journal of the Korean Vacuum Society
• /
• v.10 no.2
• /
• pp.201-206
• /
• 2001

The evolution of textures in Fe-Ni alloy thin films fabricated by PVD using a sputtering method was investigated with parameters such as deposition time and chemical composition. The textures of the as-deposited films were characterized by fibre-type. In Invar alloy(Fe-36.5 wt%Ni) thin film, the <110>//ND fibre texture as a starting component changed to the <210>//ND fibre texture with increasing deposition time. In Permalloy(Fe-81 wt%Ni) thin film, a mixture of the <221>//ND and <311>//ND fibres developed at the early stage of deposition, and then transformed to the <210>//ND fibre with increasing deposition time. These texture changes were discussed in terms of relationship with the microstructural evolution of the films.

• Journal of Sensor Science and Technology
• /
• v.18 no.5
• /
• pp.343-348
• /
• 2009

$NiO{\cdot}(Co_{0.25}Mn_{0.75})_2O_3$(Mn-Ni-Co) and $Ba_{0.5}Sr_{0.5}TiO_3$(BST) thick films were screen printed on Pt patterned alumina substrate to investigate the effects of sintering temperature on humidity and temperature sensing properties of ceramic sensors. A raise in sintering temperature increased resistance and B constant of the Mn-Ni-Co temperature sensor. This may have derived from the synergic effects of the reduction in charge carriers caused by the substitution of Co for Mn as well as the formation of microcracks from the difference in thermal expansion coefficients. Dependence of resistance on humidity of the Mn-Ni-Co temperature sensor, however, was not found. BST films sintered at temperatures in the range of $1100^{\circ}C$ to $1150^{\circ}C$ showed excellent humidity sensing properties. The BST humidity sensor was faster in its response than the Mn-Ni-Co temperature sensor. The humidity sensor, however, proved to be unstable under various temperatures, suggesting a need for a temperature stabilizing device. In contrast, the Mn-Ni-Co temperature sensor was stable under humid conditions.

• Journal of Magnetics
• /
• v.7 no.3
• /
• pp.94-97
• /
• 2002

The dependence on nickel oxide thickness and a ferromagnetic layer thickness in unidirectional and isotropic exchange-coupled NiO/NiFe(Fe) bilayer films was investigated by magnetic force microscopy to better understand the relation between magnetic domain structure and exchange biasing at microscopic length scales. As the NiO thickness increased, the domain structure of unidirectional biased films formed smaller and more complex in-plane domains. By contrast, for the isotropically coupled films, large domains generally formed with increasing NiO thickness including a cross type domain with out-of plane magnetization orientation. The density of the cross domain is proportional to exchange biasing field, and the fact that the domain mainly originated from the strongest exchange coupled region was confirmed by imaging in an applied external field during a magnetization cycle.

• Journal of Electrical Engineering and Technology
• /
• v.2 no.4
• /
• pp.525-531
• /
• 2007

Ni(75 wt.%)-Cr(20 wt.%)-Al(3 wt.%)-Mn(4 wt.%)-Si(1 wt.%) alloy thin films were prepared using the DC magnetron sputtering process by varying the sputtering conditions such as power, pressure, substrate temperature, and post-deposition annealing temperature in order to fabricate a precision thin film resistor. For all the thin film resistors, sheet resistance, temperature coefficient of resistance (TCR), and crystallinity were analyzed and the effects of sputtering conditions on their properties were also investigated. The oxygen content and TCR of Ni-Cr-Al-Mn-Si resistors were decreased by increasing the sputtering pressure. Their sheet resistance, TCR, and crystallinity were enhanced by elevating the substrate temperature. In addition, the annealing of the resistor thin films in air at a temperature higher than $300^{\circ}C$ lead to a remarkable rise in their sheet resistance and TCR. This may be attributed to the improved formation of NiO layer on the surface of the resistor thin film at an elevated temperature.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
• /
• 2001.07a
• /
• pp.725-728
• /
• 2001

We have fabricated thin films using the DC/RF magnetron sputtering of 74wt%Ni-l8wt%Cr-4wt%Al-4wt%Cu alloy target and studied the effect of the process parameters on the electrical properties for low TCR(Temperature Coefficient of Resistance) films. In sputtering process, pressure, power and substrate temperature, are varied as controllable parameter. The films are annealed to 400$^{\circ}C$ in air and nitrogen atmosphere. The sheet resistance, TCR of the films increases with increasing annealing temperature. It abruptly increased as annealing temperature increased over 300$^{\circ}C$ in air atmosphere. From XRD, it is found that these results are due to the existence of NiO on film surface formed by annealing. As a results of them, TCR can be controlled by variation of sputter process parameter and annealing of thin film.

• Korean Journal of Chemical Engineering
• /
• v.35 no.12
• /
• pp.2474-2479
• /
• 2018

Plasma-enhanced atomic layer deposition (PEALD) is well-known for fabricating conformal and uniform films with a well-controlled thickness at the atomic level over any type of supporting substrate. We prepared nickel oxide (NiO) thin films via PEALD using bis(ethylcyclopentadienyl)-nickel ($Ni(EtCp)_2$) and $O_2$ plasma. To optimize the PEALD process, the effects of parameters such as the precursor pulsing time, purging time, $O_2$ plasma exposure time, and power were examined. The optimal PEALD process has a wide deposition-temperature range of $100-325^{\circ}C$ and a growth rate of $0.037{\pm}0.002nm$ per cycle. The NiO films deposited on a silicon substrate with a high aspect ratio exhibited excellent conformality and high linearity with respect to the number of PEALD cycles, without nucleation delay.

• Journal of Surface Science and Engineering
• /
• v.30 no.1
• /
• pp.33-43
• /
• 1997

The effects of process parameters substrate such as substrate current and substrate temperature on the corrosion resistance of ion plated TiN film were investigated. TiN fims were deposited on speed steel on which Ti or Ni hed been previously evaporated. Dense TiN films could be obtained under higher substrate current(1A) and substrate temperature($500^{\circ}C$), whereas TiN films deposited with lower substances current(0.5A) and substrate temperature($300^{\circ}C$) showed porous structure. The corrosion resistances of high speed steel was considerably increased when dense TiN films had been formed on it. The effect of Ti and Ni interlayer on the increase of the corrosion resistance was also significant with dense TiN films, while there was little effect of interlayer on the corrosion resistance when TiN films were porous. the effect of interlayer on the corrosion resistance was more outstanding with Ti then with Ni, because Ti reacts more easily with oxygen to form an oxide layer, and it also shows higher resistance against chlorine containing corrosion media.