• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.29 no.6
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• pp.370-375
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• 2016

In this paper, we investigated the electrical properties of crystalline silicon solar cell fabricated with Ni/Cu/Ag plating. The laser process was used to ablate silicon nitride layer as well as to form the selective emitter. Phosphoric acid layer was spin-coated to prevent damage caused by laser and formed selective emitter during laser process. As a result, the contact resistance was decreased by lower sheet resistance in electrode region. Low sheet resistance was obtained by increasing laser current, but efficiency and open circuit voltage were decreased by damage on the wafer surface. KOH treatment was used to remove the laser damage on the silicon surface prior to metalization of the front electrode by Ni/Cu/Ag plating. Ni and Cu were plated for each 4 minutes and 16 minutes and very thin layer of Ag with $1{\mu}m$ thickness was plated onto Ni/Cu electrode for 30 seconds to prevent oxidation of the electrode. The silicon solar cells with KOH treatment showed the 0.2% improved efficiency compared to those without treatment.

• Journal of Korea Foundry Society
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• v.23 no.1
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• pp.30-39
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• 2003

Porous hybrid preforms were fabricated by reactive sintering using the compacts consisting of SiC particles, Fe and Al powders. Squeeze casting processing was employed to produce the composite in which the matrix phase is Al-Si7Mg. The microstructural change and wear resistance of the composites were investigated in terms of an amount of SiC particles. The wear loss was increased with increasing the contact pressure in the alloy containing SiC particles coated with Cu. The most drastic change was found to the specimen tested at 2.5 MPa of contact pressure. Concerning the alloys containing SiC particles coated with Ni-P, a drastic increase in the wear loss exhibited at 2 MPa of contact pressure in those alloys containing 4 and 8 wt. % of SiC particles coated with Ni-P. In the alloy containing 16 wt. % a proportional increase in wear loss was observed to the change of contact pressure. With respecting to the sliding velocity, the wear loss of the alloy containing SiC particles coated with Cu increased at the initial stage of wear process and then decreased. Similar result was found in the alloys containing SiC particles coated with Ni-P. On the basis of the present results obtained, it was found that wear resistance of the alloys tested was improved to show in the order of the alloy reinforced by coated SiC particles > by uncoated SiC particles > by intermetallic compound without SiC particles.

• Journal of the Korean Magnetics Society
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• v.13 no.2
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• pp.47-52
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• 2003

Ferromagnetic tunnel junctions were fabricated by dc magnetron sputtering and plasma oxidation process. The local transport properties of the ferromagnetic tunnel junctions were studied using contact-mode Atomic Force Microscopy (AFM) and the local current-voltage analysis. Tunnel junctions with the structure of sub./Ta/Cu/Ta/NiFe/Cu/Mn$\_$75/Ir$\_$25//Co$\_$70/Fe$\_$30//Al-oxide were prepared on thermally oxidized Si wafers. Al-oxide layers were formed with microwave excited plasma using radial line slot antenna (RLSA) for 5 and 7 sec. Kr gas was used as the inert gas mixed with $O_2$ gas for the plasma oxidization. No correlation between topography and current image was observed while they were measured simultaneously. The local current distribution was well identified with the distribution of local barrier height. Assuming the gaussian distribution of the local barrier height, the ferromagnetic tunnel junction with longer oxidation time was well fitted with the experimental results. As contrast, in the case of the shorter time oxidation junction, the current mainly flow through the low barrier height area for its insufficient oxygen. Such leakage current might result in the decrease of tunnel magnetoresistance (TMR) ratio.

• Proceedings of the KWS Conference
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• 2009.11a
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• pp.66-66
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• 2009

Various alloy system, such as Cu-Sn-Ti, Cu-Ag-Ti, and Ni-B-Cr-based alloy are used for the brazing of diamond grits. However, the problem of the adhesion strength between the diamond grits and the brazed alloy is presented. The adhesion strength between the diamond grits and the melting filler alloy is predicted by the contact angle, thereby, instead of diamond grit, the study on the wettability between the graphite and the brazing alloy has been indirectly executed. In this study, Cu-13Sn-12Ti filler alloy was manufactured, and the contact angles, the shear strengths and the interfacial area between the graphites(diamond grits) and braze matrix were investigated. The contact angle was decreased on increasing holding time and temperature. The results of shear strength of the graphite joints brazed filler alloys were observed that the joints applied Cu-13Sn-12Ti alloy at brazing temperature 940 $^{\circ}C$ was very sound condition indicating the shear tensile value of 23.8 MPa because of existing the widest carbide(TiC) reaction layers. The micrograph of wettability of the diamond grit brazed filler alloys were observed that the brazement applied Cu-13Sn-12Ti alloy at brazing temperature $990^{\circ}C$ was very sound condition because of existing a few TiC grains in the vicinity of the TiC layers.

• Journal of Welding and Joining
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• v.28 no.3
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• pp.49-58
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• 2010

Various alloy system, such as Cu-Sn-Ti, Cu-Ag-Ti, and Ni-B-Cr-based alloy are used for the brazing of diamond grits. However, the problem of the adhesion strength between the diamond grits and the brazed alloy is presented. The adhesion strength between the diamond grits and the melting filler alloy is predicted by the contact angle, thereby, instead of diamond grit, the study on the wettability between the graphite and the brazing alloy has been indirectly executed. In this study, Cu-13Sn-12Ti filler alloy was manufactured, and the contact angles, the shear strengths and the interfacial area between the graphites (diamond grits) and braze matrix were investigated. The contact angle was decreased on increasing holding time and temperature. The results of shear strength of the graphite joints brazed filler alloys were observed that the joints applied Cu-13Sn-12Ti alloy at brazing temperature $940^{\circ}C$ was very sound condition indicating the shear tensile value of 23.8 MPa because of existing the widest carbide(TiC) reaction layers. The micrograph of wettability of the diamond grit brazed filler alloys were observed that the brazement applied Cu-13Sn-12Ti alloy at brazing temperature $990^{\circ}C$ was very sound condition because of existing a few TiC grains in the vicinity of the TiC layers.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 1988.10a
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• pp.112-114
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• 1988

W/WC-Cu/Ag contacts of 60wt%-40wt% base and contacts with additives(Ni, Co, C) of 1wt% below were prepared by a press-sinter-infiltrate process to compare with their physical properties and arc erosion characteristics. In physical properties, electrical conductivity of contacts with additive is lower than that of base contacts but hardness is higher. The results of arc test show that the erosion rate of contact with -0.1wt% Ni is decreased.

• Transactions of the Korean Society of Machine Tool Engineers
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• v.16 no.6
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• pp.193-200
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• 2007

Micro forming is a suited technology to manufacture very small metallic parts(several $mm{\sim}{\mu}m$). Al5083 superplastic alloy with very small grains has a great advantage in achieving micro deformation under low stress due to its relatively low strength at a specific high temperature range. Micro forming of $Zr_{62}Cu_{17}Ni_{13}Al_8$ bulk Metallic glass(BMG) as a candidate material for this developing process are feasible at a relatively low stress in the supercooled liquid state without any crystallization during hot deformation. In this study, the micro formability of Al5083 superplastic alloy and bulk metallic glass, $Zr_{62}Cu_{17}Ni_{13}Al_8$, was investigated with the specially designed micro vibration forming system using pyramid-shape, V-shape and U-shape micro die pattern. With these dies, micro vibration forming was conducted by varying the applied load, time. Micro formability was estimated by comparing the hight of formed shape using non-contact surface profiler system. The vibration load effect to metal flow in the micro die and improve the micro formability of Al5083 superplastic alloy and $Zr_{62}Cu_{17}Ni_{13}Al_8$ bulk Metallic glass(BMG).

• Bulletin of the Korean Chemical Society
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• v.34 no.5
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• pp.1513-1520
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• 2013

Novel chitosan (CS) based membrane networks were developed by solution casting and followed by crosslinking with different crosslinkers such as glutaraldehyde, urea-formaldehyde, and thiourea-formaldehyde. The developed membrane networks were designated as CS-GA, CS-UF and CS-TF. Crosslinking reaction of CS membranes was confirmed by Fourier transform infrared spectroscopy. Membrane rigidity and compactness were studied by the differential scanning calorimetry. The surface morphology of CS membranes was characterized by scanning electron microscopy. The sorption behaviour with respect to contact time, initial pH and initial metal ion concentration were investigated. The maximum adsorption capacity of CS-GA, CS-UF and CS-TF sorbents was found to be 1.03, 1.2 and 1.18 mM/g for $Cu^{2+}$ and 1.48, 1.55 and 2.18 mM/g for $Ni^{2+}$ respectively. Swelling experiments have been performed on the membrane networks at $30^{\circ}C$. Desorption studies were performed in acid media and EDTA and it was found that the membranes are reusable for the metal ion removal for three cycles. The developed membranes could be successfully used for the separation of $Cu^{2+}$ and $Ni^{2+}$ metal ions from aqueous solutions.

• Journal of the Optical Society of Korea
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• v.19 no.3
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• pp.217-221
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• 2015

Developing a metallization that has low cost and high efficiency is essential in solar-cell industries, to replace expensive silver-based metallization. Ni/Cu two-step metallization is one way to reduce the cost of solar cells, because the price of copper is about 100 times less than that of silver. Alkaline electroless plating was used for depositing nickel seed layers on the front electrode area. Prior to the nickel deposition process, 2% HF solution was used to remove native oxide, which disturbs uniform nickel plating. In the subsequent step, a nickel sintering process was carried out in $N_2$ gas atmosphere; however, copper was plated by light-induced plating (LIP). Plated nickel has different properties under different bath conditions because nickel electroless plating is a completely chemical process. In this paper, plating bath conditions such as pH and temperature were varied, and the metal layer's structure was analyzed to investigate the adhesion of Ni/Cu metallization. Average adhesion values in the range of 0.2-0.49 N/mm were achieved for samples with no nickel sintering process.

• Current Photovoltaic Research
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• v.11 no.2
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• pp.39-43
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• 2023

Carrier-selective contacts (CSCs) solar cells are considerably attractive on highly efficient crystalline silicon heterojunction (SHJ) solar cells due to their advantages of high thermal tolerance and the simple fabrication process. CSCs solar cells require a hole selective contact (HSC) layer that selectively collects only holes. In order to selectively collect holes, it must have a work function characteristic of 5.0 eV or more when contacted with n-type Si. The VO_x, NiO_x, and CuI_x thin films were fabricated and analyzed respectively to confirm their potential usage as a hole-selective contact (HSC) layer. All thin films showed characteristics of band-gap engergy > 3.0 eV, work function > 5.0 eV and minority carrier lifetime > 1.5 ms.