• 제목/요약/키워드: New Form Factor

검색결과 370건 처리시간 0.021초

WLP and New System Packaging Technologies

  • WAKABAYASHI Takeshi
    • 한국마이크로전자및패키징학회:학술대회논문집
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    • 한국마이크로전자및패키징학회 2003년도 기술심포지움 논문집
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    • pp.53-58
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    • 2003
  • The Wafer Level Packaging is one of the most important technologies in the semiconductor industry today. Its primary advantages are its small form factor and low cost potential for manufacturing including test procedure. The CASIO's WLP samples, application example and the structure are shown in Fig.1, 2&3. There are dielectric layer , under bump metal, re-distribution layer, copper post , encapsulation material and terminal solder .The key technologies are 'Electroplating thick copper process' and 'Unique wafer encapsulation process'. These are very effective in getting electrical and mechanical advantages of package. (Fig. 4). CASIO and CMK are developing a new System Packaging technology called the Embedded Wafer Level Package (EWLP) together. The active components (semiconductor chip) in the WLP structure are embedded into the Printed Wiring Board during their manufacturing process. This new technical approach has many advantages that can respond to requirements for future mobile products. The unique feature of this EWLP technology is that it doesn't contain any solder interconnection inside. In addition to improved electrical performance, EWLP can enable the improvement of module reliability. (Fig.5) The CASIO's WLP Technology will become the effective solution of 'KGD problem in System Packaging'. (Fig. 6) The EWLP sample shown in Fig.7 including three chips in the WLP form has almost same structure wi_th SoC's. Also, this module technology are suitable for RF and Analog system applications. (Fig. 8)

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마찰감쇠기가 설치된 건물 응답의 근사해 : 재 고찰 및 새로운 결과 (Approximate solution for a building installed with a friction damper : revisited and new result)

  • 민경원;성지영;이성경
    • 한국소음진동공학회:학술대회논문집
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    • 한국소음진동공학회 2009년도 추계학술대회 논문집
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    • pp.850-854
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    • 2009
  • Approximate analysis for a building installed with a friction damper is revisited to get insight of its dynamic behavior. Energy balance equation is used to have a closed analytical form solution of dynamic magnification factor (DMF) for the building with combined viscous and friction damping. It is found out that DMF is dependent on friction force ratio and resonance frequency. Linear transfer function from input external force to output building displacement is obtained by simplifying DMF equation. Root mean square of building displacement is derived under earthquake-like random excitation. Finally, design of friction damper is proposed by processing target control ratio, damping ratio factor, and friction force in sequence.

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Metastasis-associated Factors Facilitating the Progression of Colorectal Cancer

  • Zhang, Yao-Yao;Chen, Bin;Ding, Yan-Qing
    • Asian Pacific Journal of Cancer Prevention
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    • 제13권6호
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    • pp.2437-2444
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    • 2012
  • Tumor metastasis remains the principal cause of treatment failure and poor prognosis in patients with colorectal cancer. It is a multistage process which includes proteolysis, motility and migration of cells, proliferation in a new site, and neoangiogenesis. A crucial step in the process of intra- and extra-vasation is the activation of proteolytic enzymes capable of degrading the extracellular matrix (ECM). In this stage, urokinase plasminogen activator receptor (uPAR) and matrix metalloproteinases (MMPs) are necessary. Micrometastases need the presence of growth factor and vascular growth factor so that they can form macrometastasis. In addition, cell adhesion molecules (CAMs) and guanine nucleotide exchange factors (GEFs) play important roles in the progression of colorectal cancer and metastatic migration. Further elucidation of the mechanisms of how these molecules contribute will aid in the identification of diagnostic and prognostic markers as well as therapeutic targets for patients with colorectal metastasis.

실험계획법을 이용한 풍력발전기용 블레이드의 설계 (Wind Turbine Blade Design using Design of Experiments)

  • 강기원;이승표;장세명;이장호
    • 한국신재생에너지학회:학술대회논문집
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    • 한국신재생에너지학회 2009년도 추계학술대회 논문집
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    • pp.422-422
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    • 2009
  • This paper describes the structural design of small wind turbine blade by using design of experiments. Blade structure consists of skin, spar and foam. The materials for skin and spar are a kind of Glass/Epoxy and form is polyurethane. It has 7 lay-ups with different ply angle. A factorial design is applied to design the ply angles considering manufacturing constraints and to investigate the safety factor which is calculated by structural analysis. In order to perform the structural analysis, the commercial software ABAQUS is used. Tsai-Wu failure criterion is chosen to compute safety factor. The determination of the significance of effects in the experiments is made through the analysis of variance. The results show that ply angle at skin affects the safety factor of wind turbine blade. And from this result, optimal ply angles of composite blade are achieved.

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Evaluation of performance and seismic parameters of eccentrically braced frames equipped with dual vertical links

  • Mohsenian, Vahid;Nikkhoo, Ali
    • Structural Engineering and Mechanics
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    • 제69권6호
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    • pp.591-605
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    • 2019
  • Investigations on seismic performance of eccentrically braced frames equipped with dual vertical links have received little attention. Therefore, the main goal of this paper is to describe design steps for such frames and evaluate nonlinear performance of this system according to the reliability analysis. In this study, four and eight story frame structures are analyzed and the response modification factors for different intensity and damage levels are derived in a matrix form based on a new approach. According to the obtained results, the system has high ductility and acceptable seismic performance. Moreover, it is concluded that using response modification factor equal to 8 in the design of system provides desirable seismic reliability under the design and maximum probable hazard levels. Due to desirable performance and significant advantages of the dual vertical links, this system can be used as a main lateral load bearing system, in addition to its application for rehabilitation of damaged structures.

뵐플린의 양식사적 관점에서 르네상스와 바로크 복식의 양식비교 (A Study on the Clothing Styles of Renaissance and Baroque Focused on H. $W\"{o}lfflin's$ Methodology)

  • 장성은
    • 복식
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    • 제57권7호
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    • pp.15-29
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    • 2007
  • H. $W\"{o}lfflin's$ methodology created viewpoint of art history which is an essential factor of art, and proposed formal analysis as an academic methodology specific to art history. H. $W\"{o}lfflin's$ expressed the see-form a as the five pair concepts which are summarized by 'linear-painterly' 'the plane-the deep'. 'closed form-open form', 'multiplicity-unity', 'absolute clarity-relative clarity'. His methodology is not only in the field of art and architecture but also clothing because during the same period have a relative tendency of thought, culture, politics and economics each other. As the result of this study were as follows. Renaissance of 16 century, the style of dress was enormous and dignified by body support outfit, hard puffs, slashes, padding and expansive jewels. It make appearance of man and woman absolute clarity because Classicism styles of aesthetic consciousness is geometrically perfect form and symmetry and restrained harmony, magnificent. Baroque of 17 century, the style of dress was vigorous mobility and subtle balance by abundant and free silhouette, soft collar, magnificent ribbon loop and tassel without body support outfit. It make appearance of man and woman comfortable and natural because Baroque styles of aesthetic consciousness is extraordinary degree of originality and creativity that was evident in the devising of new styled.

Adhesive Flip Chip Technology

  • Paik, Kyung-W
    • 한국마이크로전자및패키징학회:학술대회논문집
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    • 한국마이크로전자및패키징학회 2000년도 2nd Korea-Japan Advanceed Semiconductor Packaging Technology Seminar
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    • pp.7-38
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    • 2000
  • Performance, reliability, form factor drive flip chip use. BGAs and CSPs will provide stepping stone to FC DCA .Growing vendor infrastructure - Low cost, high density organic substrates -New generations of fluxes and underfills .Adhesives flip chip technology as a low cost flip chip alternatives -Low cost Au stud or Electroless Ni bumps -Reliable thermal cycling and electrical performance.

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On a Relation to Hilbert's Integral Inequality and a Hilbert-Type Inequality

  • Yang, Bicheng
    • Kyungpook Mathematical Journal
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    • 제49권3호
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    • pp.563-572
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    • 2009
  • In this paper, by introducing some parameters and using the way of weight function, a new integral inequality with a best constant factor is given, which is a relation between Hilbert's integral inequality and a Hilbert-type inequality. As applications, the equivalent form, the reverse forms and some particular inequalities are considered.

On a Hilbert-Type Integral Inequality with a Combination Kernel and Applications

  • Yang, Bicheng
    • Kyungpook Mathematical Journal
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    • 제50권2호
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    • pp.281-288
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    • 2010
  • By introducing some parameters and using the way of weight function and the technic of real analysis and complex analysis, a new Hilbert-type integral inequality with a best constant factor and a combination kernel involving two mean values is given, which is an extension of Hilbert's integral inequality. As applications, the equivalent form and the reverse forms are considered.

말뚝기초의 국제적 설계기준에 관한 고찰 (Study on International Code of Practice for Pile Foundation)

  • 윤길림;권오순;차재선
    • 한국지반공학회:학술대회논문집
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    • 한국지반공학회 1999년도 말뚝기초위원회 워크샵
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    • pp.35-52
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    • 1999
  • This paper addresses on new codes of practice, limit state design; load resistance factored design and Eurocode 7, which have recently been adopted by foundation engineers in North America and European Communities. A brief description of the limit state design concepts and some introductions to Australia and Sweden national code for pile foundation are made on behalf of pile capacity determination. Also, simple closed form solution for rational resistance factor when resistance is log-normally distributed, has been derived for pile foundation.

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