• Proceedings of the Korean Society for Noise and Vibration Engineering Conference
• /
• 1998.04a
• /
• pp.302-307
• /
• 1998

In the production of semiconductor wafer, optical and electron microscopes, ion-beam, laser device must maintain their alignments within a sub-micrometer. This equipment requires a vibration free environment to provide its proper function. Especially, lithography and inspection devices, which have sub-nanometer class high accuracy and resolution, have come to necessity for producing more improved giga and tera class semiconductor wafers. This high technology equipments require very strict environmental vibration standard, vibration criteria, in proportion to the accuracy of the manufacturing, inspecting devices. The vibration criteria of high sensitive equipment should be represented in the form of exactness and accuracy, because this is used as basic data for the design of building structure and structural dynamics of equipment. The study on the evaluation of the factors affecting the permissible vibration criteria is required to design the efficient isolation system of the semiconductor manufacturing of equipment. This paper deals with the properties of the effected factor for vibration criteria of high sensitive equipment.

• Proceedings of the KIEE Conference
• /
• 2006.10c
• /
• pp.597-599
• /
• 2006

In this paper, we propose an artificial intelligence method to compensate the nonlinearity error which occurs in the heterodyne laser interferometer. Some superior properties such as long measurement range, ultra-precise resolution and various system set-up lead the laser interferometer to be a practical displacement measurement apparatus in various industry and research area. In ultra-precise measurement such as nanometer or subnanometer scale, however, the accuracy is limited by the nonlinearity error caused by the optical parts. The feedforward neural network trained by back-propagation with a capacitive sensor as a reference signal minimizes the nonlinearity error and we demonstrate the effectiveness of our proppsed algorithm through some experimental results.

• Proceedings of the Korean Society of Precision Engineering Conference
• /
• 2001.04a
• /
• pp.950-955
• /
• 2001

For the development of an ultra-precision CNC polishing system including on-machine measurement system, we study a corrective polishing algorithm. We analyze and test the unit removal profiles for a ball type polishing tool. Using these results we calculate dwell time distributions and residual errors for a target removal shape. We use the polishing simulation method and feed rate calculation method for the dwell time calculation. We test corrective polishing algorithm with an optical glass. The target removal shape is a sine wave that has amplitude 0.3 micro meters. We find this polishing process has a machining resolution of nanometer order and is effective for sub-micrometer order machining. This result will be used for the software development of the CNC polishing system.

• Proceedings of the Korean Society for Technology of Plasticity Conference
• /
• 2006.05a
• /
• pp.86-90
• /
• 2006

Nanoimprint lithography (NIL) is a novel method to fabricate nanometer scale patterns. It is a simple process with low cost, high throughput and high resolution. NIL process creates patterns by the mechanical deformation of imprint resist and physical contact process. This physical contact process causes the stiction between the resist and the stamp. Stiction becomes a key issue especially in the stamps including narrow pattern size and wide area during NIL process development. The antistiction layer coating using fluorocarbon is very effective to prevent this problem and ensure successful NIL. In this paper, the concept of antistiction coating is explained and different preparation methods for nanoimprinting are briefly discussed.

• Transactions of the Korean Society of Machine Tool Engineers
• /
• v.11 no.5
• /
• pp.65-72
• /
• 2002

In this study, actuator, sensor, guide, power transmission element and control method are considered for ultra-precision positioning apparatus. Through previous process, single plane X-Y stage with ultra-precision positioning is manufactured. Global stage for the purpose of materialization with robust system, is combined by using AC servo motor and ball screw and rolling guide. And ultra-precision positioning system is developed by micro stage with elastic hinge type and piezo element. global servo and micro servo for the purpose of materialization positioning accuracy with nm(nanometer) are controlled simultaneously by using incremental encoder and laser interferometer as displacement measurement sensor. Through previous process, ultra-precision positioning system(100mm stroke and $\pm$ l0nm positioning accuracy) with single plane X-Y stage are materialized.

• International Journal of Precision Engineering and Manufacturing
• /
• v.9 no.1
• /
• pp.34-38
• /
• 2008

The surface texture of a product is generally produced by etching or sandblasting. However, these techniques have problems related to repeatability and environmental pollution. Since current milling machines can produce small parts at the micrometer or nanometer level, the resolution of milling exceeds the manufactured dimensions of the surface texture produced by etching or sand-blasting. A method for generating surface texture by milling is proposed and demonstrated. The proposed method was demonstrated by actual milling using a three- or five-axis control machine, and the machined surface texture was measured with an interferometer to allow comparison with the designed shape. The measurement results demonstrate that the proposed method can generate a wide-area surface texture with good machining repeatability.

• Journal of the Semiconductor & Display Technology
• /
• v.2 no.2
• /
• pp.25-30
• /
• 2003

In the case of a vibration sensitive equipment, it require a vibration free environment to provide its proper function. Especially, lithography and inspection device, which have sub-nanometer class high accuracy and resolution, have come to necessity for producing more improved Giga Class semi conductor wafers. This high technology equipments require very strict environmental vibration criteria in proportion to the accuracy of the manufacturing. In this paper, the dynamic analysis and modal test were performed to evaluate the dynamic properties of the constructing clean room structure. Based on these results, a structural dynamic modification(SDM) were required to satisfiy the vibration allowable limit for pression machine. Therefore, in order to improve the dynamic stiffness of clean room structure, the VSD system which can control the force applied on structure, were adopted and its utility were proved from dynamic test results of the improved structure after a modification work.

• Proceedings of the KIEE Conference
• /
• 2006.04a
• /
• pp.234-236
• /
• 2006

Because of its long measurement range and ultra-precise resolution. the heterodyne laser interferometer systems are very common in various industry area such as semiconductor manufacturing. However the periodical nonlinearity property caused from frequency mixing is an obstacle to improve the high measurement accuracy in nanometer scale. In this paper to minimize the effect of nonlinearity, we propose an adaptive nonlinearity compensation algorithm. We first compute compensation parameters using least square (LS) with the capacitance displacement sensor as a reference input. We then update the parameters with recursive LS (RLS) while the values are optimized to modify the elliptical phase into circular one. Through comparison with some experimental results of laser system, we demonstrate the effectiveness of our proposed algorithm.

• Journal of the Korean Society for Precision Engineering
• /
• v.19 no.1
• /
• pp.99-106
• /
• 2002

For the development of a ultra-precision CNC polishing system including on-machine measurement system, we study a corrective polishing algorithm. We calculated unit removal profiles for various flat type polishing tools and polishing tool positions. Using these results we simulate the corrective polishing process based on dwell time control. We calculate dwell time distributions and residual error of the polishing simulation method and the FFT calculation method. We test corrective polishing algorithm with an optical glass. The target removal shape is a sine wave that has amplitude 0.3 micro meters. We find this polishing process has a machining resolution of nanometer order and is effective for sub-micrometer order machining. This result will be used for the software development of the CNC polishing system.

• Proceedings of the Korean Society of Precision Engineering Conference
• /
• 2002.10a
• /
• pp.128-131
• /
• 2002

Three Dimensional measuring system using optical interference is greatly needed for semiconductor surface or optical surface. The application of this system are : MEMS product, semiconductor surfaces, optical components, precise machined surface, etc. In this paper, Interferometry based measurement system is introduced, which is nondestructive and noncontact inspection system. This system have relatively many advantage, compared with AFM/STM, SEM, Stylus, etc. The developed system can measure the surface topography with high precision and resolution, and with few seconds. And the associated software algorithm is also developed for the ultra precision 3D measuring surface. Various samples that is measured using this system is showed in the latter of this paper.