• 제목/요약/키워드: Nano-machining

검색결과 189건 처리시간 0.027초

단결정 다이아몬드공구를 사용한 Cu 도금된 몰드의 미세 구조체 가공특성 (Machining Characteristics of Micro Structure using Single-Crystal Diamond Tool on Cu-plated Mold)

  • 김창의;전은채;제태진;강명창
    • 한국분말재료학회지
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    • 제22권3호
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    • pp.169-174
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    • 2015
  • The optical film for light luminance improvement of BLU that is used in LCD/LED and retro-reflective film is used as luminous sign consist of square and triangular pyramid structure pattern based on V-shape micro prism pattern. In this study, we analyzed machining characteristics of Cu-plated flat mold by shaping with diamond tool. First, cutting conditions were optimizing as V-groove machining for the experiment of micro prism structure mold machining with prism pattern shape, cutting force and roughness. Second, the micro prism structure such as square and triangular pyramid pattern were machined by cross machining method with optimizing cutting conditions. Burr and chip shape were discussed with material properties and machining method.

나노스크래치와 HF 에칭기술을 병용한 Pyrex 7740의 마스크리스 나노 가공 (Maskless Nano-fabrication by using both Nanoscratch and HF Wet Etching Technique)

  • 윤성원;이정우;강충길
    • 한국정밀공학회:학술대회논문집
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    • 한국정밀공학회 2003년도 춘계학술대회 논문집
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    • pp.628-631
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    • 2003
  • This study describes a new mastless nano-fabrication technique of Pyrex 7740 glass using the combination of nanomachining by nano-indenter XP and HF wet etching. First, the surface of a Pyrex 7740 glass specimen was machined by using the nano-machining system, which utilizes the mechanism of the nano-indenter XP. Next, the specimen was etched by HF solution. After the etching process, the convex structure or deeper hole is made because of masking or promotion effect of the affected layer generated by nano-machining. On the basis of this interesting fact. some sample structures were fabricated.

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초소경 엔드밀링을 이용한 미세 가공특성 분석 및 응용가공 (Analysis of Micro Machining Characteristics using End-milling and Its Applications)

  • 최환진;박언석;전은채;제태진;최두선
    • 한국정밀공학회지
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    • 제29권12호
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    • pp.1279-1284
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    • 2012
  • Micro structures which are widely used at various fields are commonly fabricated by lithograph, etching and laser methods. Recently, with the emergence of micro tools and ultra-precision machine tools, fabrication of the micro structures obtained using end-milling are studied. However, there are some problems due to the diameter of the micro end-mill getting smaller below $100{\mu}m$. The micro run-out resulted from miniaturization of end-mills have influence seriously on accuracy of micro structures. The error of run-out with a tooling jig showed a decrease of about $9.3{\mu}m$. Furthermore, micro structures with width of $30{\mu}m$ could be applied through experiments of slot machining obtained using 30 and $50{\mu}m$ end-mill. Also, narrow angle structures with $30^{\circ}$ angle could be applied through analysis of machining acute angle structures. Based on basic experiments, micro fluidics channels and spiral patterns for air bearing were machined.

펨토초 레이저 응용 선택적 어블레이션 연구 (Selective Removal of Thin Film on Glass Using Femtosecond Laser)

  • 유재용;조성학;박정규;윤지욱;황경현;고지 수지오카;홍종욱;허원하;다니얼 뵈머;박준형;세바스찬 잰더
    • 한국레이저가공학회지
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    • 제14권2호
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    • pp.17-23
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    • 2011
  • Active thin films are ubiquitous in the manufacture of all forms of flat panel display (FPD). One of the most widely employed thin films is indium tin oxide (ITO) and metal films used electrically conductive materials in display industries. ITO is widely used for fabrication of LCD, OLED device, and many kinds of optical applications because of transparency in visible range and its high conductivity and metal films are also widely employed as electrodes in various electric and display industries. It is important that removing specific area of layer, such as ITO or metal film on substrate, to fabricate and repair electrode in display industries. In this work, we demonstrate efficient selective ablation process to ITO and aluminum film on glass using a femtosecond laser (${\lambda}p=1025nm$) respectively. The femtosecond laser with wavelength of 1025nm, pulse duration of 400fs, and the repetition rate of 100kHz was used for selectively removing ITO and Al on glass in the air. We can successfully remove the ITO and Al films with various pulse energies using a femtosecond laser.

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빔 쉐이핑을 이용한 펨토초 레이저 ITO 박막 가공 깊이 제어에 대한 연구 (Study of ablation depth control of ITO thin film using a beam shaped femtosecond laser)

  • 김훈영;윤지욱;최원석;;황경현;조성학
    • 한국레이저가공학회지
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    • 제17권1호
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    • pp.1-6
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    • 2014
  • Indium tin oxide (ITO) is an important transparent conducting oxide (TCO). ITO films have been widely used as transparent electrodes in optoelectronic devices such as organic light-emitting devices (OLED) because of their high electrical conductivity and high transmission in the visible wavelength. Finding ways to control ITO micromachining depth is important role in the fabrication and assembly of display field. This study presented the depth control of ITO patterns on glass substrate using a femtosecond laser and slit. In the proposed approach, a gaussian beam was transformed into a quasi-flat top beam by slit. In addition, pattern of square type shaped by slit were fabricated on the surfaces of ITO films using femtosecond laser pulse irradiation, under 1030nm, single pulse. Using femtosecond laser and slit, we selectively controlled forming depth and removed the ITO thin films with thickness 145nm on glass substrates. In particular, we studied the effect of pulse number on the ablation of ITO. Clean removal of the ITO layer was observed when the 6 pulse number at $2.8TW/cm^2$. Furthermore, the morphologies and fabricated depth were characterized using a optical microscope, atomic force microscope (AFM), and energy dispersive X-ray spectroscopy (EDS).

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힘 및 변위 감지기구를 적용한 초정밀 가공시스템 개발 (Development of an Ultra Precision Machining System Using a Force and Displacement Sensing Module)

  • 방진혁;권기환;조남규
    • 한국정밀공학회지
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    • 제22권12호
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    • pp.42-50
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    • 2005
  • This paper presents an ultra precision machining system using a high sensitive force sensing module to measure machining forces and penetration displacement in a tip-based nanopatterning. The force sensing module utilizes a leaf spring mechanism and a capacitive displacement sensor and it has been designed to provide a measuring range from 80 ${\mu}N$ to 8 N. This force sensing module is mounted on a PZT driven in-feed motion stage with 1 nm resolution. The sample can be moved by X-Y scanning motion stage with 5 nm resolution. In nano indentation experiments and patterning experiments, the machining forces were controlled and monitored by the force sensing module. Then, the patterned samples were measured by AFM. Experimental results demonstrated that the developed system can be used as an effective device in nano indentation and nanopatterning operation.

미소가공을 위한 마이크로 밀링머신 개발 (The Development of Micro Milling Machine for Micro Machining)

  • 황준
    • 한국공작기계학회:학술대회논문집
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    • 한국공작기계학회 2005년도 춘계학술대회 논문집
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    • pp.278-281
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    • 2005
  • Today, manufacturing capability at the micro or nano scale production field is requested strongly in view of parts and product miniaturization. Miniaturized parts and products will introduce lots of benefits in terms of high precision functionality and low energy consumption. This paper presents the results of micro milling machine tool development for micro machining process. Finite element analysis has been performed to know the relationship between design dimensional variables and structural stiffness in terms of static, dynamic, thermal aspects. Performance evaluation through machining has been tested and discussed for achievable machining characteristics.

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마이크로 채널의 가공성에 관한 연구 (A Study on the Machinability of Micro-Channel)

  • 홍민성;김종민
    • 한국공작기계학회논문집
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    • 제17권2호
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    • pp.51-57
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    • 2008
  • Recently, the manufacturer of microscopic structures along with the development of technology to produce electronics, communication and semiconductors allows various components to be smaller in size, with higher precision. Therefore, preoccupancy of micro/nano-level machining technology in order to product micro/nano-components and parts is key issue in the field of manufacturing. In this study, machinability of micro machining was studied through the machining of aluminum, brass and steel workpiece. Inspection of the cutting force variation patterns of large numbers of micro machining indicated that characteristics of the workpiece. Surface roughness prediction methods were developed by considering the variation of the static part of the feed direction cutting force. The accuracy of the proposed approaches were tested with experimental data and the agreement between the predictions and actual observations are addressed.

나노스크래치와 KOH 에칭 기술을 병용한 Si (100) 패턴제작 (Pattern Fabrication on Si (100) Surface by Using Both Nanoscratch and KOH Etching Technique)

  • 윤성원;이정우;강충길
    • 한국소성가공학회:학술대회논문집
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    • 한국소성가공학회 2003년도 춘계학술대회논문집
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    • pp.448-451
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    • 2003
  • This study describes a new maskless nano-fabrication technique of Si (100) using the combination of nanometer-scale mechanical forming by nano-indenter XP and KOH wet etching. First the surface of a Si (100) specimen was machined by using the nano-machining system, which utilizes the mechanism of the nano-indenter XP. Next, the specimen was etched by KOH solution. After the etching process, the convex structure or deeper hole is made because of masking or promotion effect of the affected layer generated by nano-machining. On the basis of this interesting fact, some sample structures were fabricated.

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Internal modification in transparent materials using plasma formation induced by a femtosecond laser

  • Park, Jung-Kyu;Yoon, Ji-Wook;Cho, Sung-Hak
    • 한국레이저가공학회지
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    • 제15권1호
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    • pp.15-19
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    • 2012
  • The fabrication of internal diffraction gratings with photoinduced refractive index modification in transparent materials was demonstrated using low-density plasma formation excited by a femtosecond (130 fs) Ti: sapphire laser (${\lambda}_p$=800 nm). The refractive index modifications with diameters ranging from $1{\mu}m$ to $3{\mu}m$ were photoinduced after plasma formation occurred upon irradiation with peak intensities of more than $2.0{\times}10^{13}W/cm^2$. The graded refractive index profile was fabricated to be a symmetric around from the center of the point at which low-density plasma occurred.

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