• 한국정밀공학회:학술대회논문집
• /
• 한국정밀공학회 2010년도 춘계학술대회 논문집
• /
• pp.529-530
• /
• 2010

• 한국전기전자재료학회논문지
• /
• 제18권9호
• /
• pp.787-792
• /
• 2005

Chemical mechanical polishing(CMP) has become the process of choice for modem semiconductor devices to achieve both local and global planarization. CMP is a complex process which depends on numerous variables such as macro, micro and nano-geometry of pad, relative velocity between pad and wafer stiffness and dampening characteristics of pad, slurry, pH, chemical components of slurry, abrasive concentration, abrasive size, abrasive shape, etc. Especially, an oxidizer of chemical components is very important remove a target material in metal CMP process. This paper introduces the effect of oxidizer such as $H_2O_2,\;Fe(NO_3)_3\;and\;KIO_3$ in slurry for tungsten which is used in via or/and plug. Finally the duplex reacting mechanism of $oxidizer(H_2O_2)$ through adding the $catalyst(Fe(NO_3)_3)$ could acquire the sufficient removal rate in tungsten CMP.

• 한국분말재료학회지
• /
• 제29권1호
• /
• pp.47-55
• /
• 2022

Tungsten carbide is widely used in carbide tools. However, its production process generates a significant number of end-of-life products and by-products. Therefore, it is necessary to develop efficient recycling methods and investigate the remanufacturing of tungsten carbide using recycled materials. Herein, we have recovered 99.9% of the tungsten in cemented carbide hard scrap as tungsten oxide via an alkali leaching process. Subsequently, using the recovered tungsten oxide as a starting material, tungsten carbide has been produced by employing a self-propagating high-temperature synthesis (SHS) method. SHS is advantageous as it reduces the reaction time and is energy-efficient. Tungsten carbide with a carbon content of 6.18 wt % and a particle size of 116 nm has been successfully synthesized by optimizing the SHS process parameters, pulverization, and mixing. In this study, a series of processes for the high-efficiency recycling and quality improvement of tungsten-based materials have been developed.

• 한국진공학회지
• /
• 제18권3호
• /
• pp.203-207
• /
• 2009

반도체 공정에서 기존 금속배선으로 사용되던 Al을 대체하여 사용되는 금속배선으로는 Cu가 그 대안으로 인식되고 있다. 이는 비저항값이 Al ($2.66{\mu}{\Omega}$-cm)보다 Cu ($1.67{\mu}{\Omega}$-cm)가 더 작아 RC 지연 시간 (RC delay time)을 극복하기 때문이다. 그러나 Cu의 녹는점은 $1085^{\circ}C$로 높지만 저온에서 쉽게 Si기판과 반응하는 특성을 가지고 있고, 또한 Si과의 접착력이 좋이 않는 것으로 알려져 있다. 이러한 이유로 Cu와 Si과의 반응을 방지하고 접착력을 높이기 위하여 확산방지막의 연구가 꾸준히 진행되고 있다. 본 연구그룹에서는 Cu의 확산을 방지하기 위하여 W-C-N의 확산방지막에 대하여 연구하여 왔다. 지금까지 보고된 연구 결과에 의하면 W-C-N (tungsten-carbon-nitrogen) 확산방지막은 고온에서도 Cu와 Si과의 확산을 효과적으로 방지하는 것으로 보고되었다. 이 논문에서는 W-C-N 확산방지막에 질소(N) 비율을 다르게 증착하여 지금까지 진행한 연구 결과를 기반으로 새로이 Cu의 전자거동현상(Electromigration)에 대하여 연구하였고, 고온 열처리 과정에서 박막의 표면강도 (Surface hardness)를 Nano-Indenter system을 이용하여 연구하였다. 이러한 연구를 통하여 박막내 질소가 포함된 W-C-N 확산방지막이 Cu의 전자거동에 더 안정적이며, 고온 열처리 과정에서도 표면 강도가 더 안정한 연구 결과를 획득하였다.

• 한국정밀공학회:학술대회논문집
• /
• 한국정밀공학회 2007년도 추계학술대회 논문집
• /
• pp.215-216
• /
• 2007

• Nuclear Engineering and Technology
• /
• 제53권12호
• /
• pp.4142-4149
• /
• 2021

In the radiation protection application, the metal-polymer composites have been developed for their radiation shielding properties. In this research, the elastomer composites doped by 10 ㎛ and 100nm size of lead, bismuth and tungsten particles as filler with 30 and 60 wt percentages were prepared. To survey the shielding properties of the polymer composites using gamma-ray emitted from 152Eu and 137Cs sources, the gamma flux was measured by using NaI(Tl) detector, then the linear attenuation coefficient was calculated. Also, the Monte Carlo simulation (MCs) method was used. The results showed a direct relationship between the linear attenuation coefficients of the absorbent and filler ratio. Also, the decrease in the particle size of the shielding material in each weight percentage improved the radiation shielding features. When the dimension of the particles was in the order of nano-size, more attenuation was achieved. At low energies used for medical diagnostic X-ray applications due to the predominance of the photoelectric effect, bismuth and lead were suitable selection as filler.

• 한국전기전자재료학회:학술대회논문집
• /
• 한국전기전자재료학회 2006년도 하계학술대회 논문집 Vol.7
• /
• pp.114-115
• /
• 2006

반도체 기술이 초고집적화 되어감에 따라 공정에서 선폭이 줄어들고, 박막을 다층으로 제조하는 것이 중요하게 되었다. 이와 같은 제조 공정 하에서는 Si 기판과 금속 박막간의 확산이 커다란 문제로 부각되어 왔다. 특히 Cu는 높은 확산성에 의하여 Si 기판과 접합에서 많은 확산에 의한 문제가 발생하게 되며. 또한 선폭이 줄어듦에 따라 고열이 발생하여 실리콘으로 spiking이 발생하게 된다. 이를 방지하기 위하여 우리는 3개의 화합물로 구성된 Tungsten-Carbon-Nitrogen (W-C-N) 확산방지막을 사용하였다. 실험은 물리적 기상 증착법 (PVD)으로 질소비율을 변화하며 확산방지막을 증착하였고, 이를 여러 온도에서 열처리하여 X-ray Diffraction 분석을 하였다.

• 대한방사선기술학회지:방사선기술과학
• /
• 제46권6호
• /
• pp.519-526
• /
• 2023

This study was intended to evaluate the shielding rate of radiation shields manufactured using 3D printers that have recently been used in various fields by comparing them with existing shields made of lead, and to find out their applicability through experiments. A 3D printer shield made of tungsten filament 1 mm, 2 mm, 4 mm shield, RNS-TX (nanotungsten) 1.1 mm, lead 0.2 mmPb, and 1mmPb were exposed to ^99mTc, ¹⁸F, and ²⁰¹TI for 15, 30, 45 minutes, and 60 minutes after measuring cumulative dose three times. Based on this, the shielding rate of each shield was calculated based on the dose in the absence of the shield. In addition, ^99mTc, ¹⁸F, and ²⁰¹TI were located 100 cm away from the phantom in which the OSLD nano Dot device was inserted, and if there was no shield for 60 minutes, the dose of thyroid was measured using 1.0 mm of lead shield, 1.1 mm of RNS-TX shield, and 2 mm of tungsten shield made by 3D printer. The use of shields during radiation shielding emitted from open radiation sources all resulted in a reduction in dose. The radiation dose emitted from the radionuclides under the experiment was all reduced when the shield was used. This study has been confirmed that tungsten is a material that can replace lead due to its excellent performance and efficiency as shield, and that it even shows the possibility of manufacturing a customized shield using 3D printer.

• Tribology and Lubricants
• /
• 제17권3호
• /
• pp.191-197
• /
• 2001

Nano adhesion and friction characteristics between SPM(scanning electron microscope) tips and flat plates of different materials were experimentally studied. Tests were performed to measure adhesion and friction in AFM(atomic force microscope) and LFM(lateral force microscope) modes in different conditions of relative humidity. Three different Si$_3$N$_4$ tips (rdaii : 15nm, 22nm and 50 nm) and three different flat plates of Si-wafer(100), W-DLC(tungsten-incorporated diamond-like carbon) and DLC were used. Results generally showed that adhesion and friction increased with the tip radius, and W-DLC and DLC surfaces were superior to Si-wafer. But the adhesion force of Si-wafer showed non linearity with the tip radius while W-DLC and DLC surfaces showed good correlation to the “JKR model”. It was found that high adhesion force between Si-wafer and a large radius of tip was caused by a capillary action due to the condensed water.

• 한국분말재료학회지
• /
• 제18권4호
• /
• pp.332-339
• /
• 2011

Cemented tungsten carbide has been used in cutting tools and die materials, and is an important industrial material. When the particle size is reduced to ultrafine, the hardness and other mechanical properties are improved remarkably. Ultrafine cemented carbide with high toughness and hardness is now widely used. The objective of this study is synthesis of nanostructured WC-Co powders by liquid phase method of tungstate. The precursor powders were obtained by freezen-drying of aqueous solution of soluble salts, such as ammonium metatungstate, cobalt nitrate. the final compositions were WC-10Co. In the case of liquid phase method, it can be observed synthesis of WC-10Co. The properties of powder produced at various temperature, were estimated from the SEM, BET and C/S analyser.