• 한국소성가공학회:학술대회논문집
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• 한국소성가공학회 2006년도 춘계학술대회 논문집
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• pp.105-108
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• 2006

It has been issued to fabricate nano-scale patterns with large-scale in the field of digital display. Also, large-scale fabrication technology of nano pattern is very important not only for the field of digital display but also for the most of applications of the nano-scale patterns in the view of the productivity. Among the fabrication technologies, UV nano imprinting process is suitable for replicating polymeric nano-scale patterns. However, in case of conventional UV nano imprinting process using flat mold, it is not easy to replicate large areal nano patterns. Because there are several problems such as releasing, uniformity of the replica, mold fabrication and so on. In this study, to overcome the limitation of the conventional UV nano imprinting process, we proposed a continuous UV nano imprinting process using a pattern roll stamper. A pattern roll stamper that has nano-scale patterns was fabricated by attaching thin metal stamper to a roll base. A continuous UV nano imprinting system was designed and constructed. As practical examples of the process, various nano patterns with pattern size of 500, 150 and 50nm were fabricated. Finally, geometrical properties of imprinted nano patterns were measured and analyzed.

• 소성∙가공
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• 제20권1호
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• pp.23-28
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• 2011

For the fabrication of nano patterned products manufacturing a nano patterned mold is needed in advance. The nano patterned stamper was fabricated by electroforming the AAO master with nickel. The surface of nickel-plated stamper had nano-patterned holes with the diameter of 73 nm and the depth of 83 nm. Hot embossing was used for forming P3HT sheet and the process factors of hot embossing were closer as pressure, temperature and time. In the present paper hot embossing experiments were performed to find the main process conditions to affect the replication ratio of nano patterns on surface of P3HT sheet. As a result, main contributing factors for the replication ratio of hot embossed pattern could be sequentially enumerated as pressure, temperature and time.

• 한국정밀공학회:학술대회논문집
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• 한국정밀공학회 2003년도 춘계학술대회 논문집
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• pp.632-635
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• 2003

As a process technology of nano pattern with a new conception for economic and practical technology of alternative nano process. process technologies such as Embossing, Imprinting. Molding and Inking are beginning to make its appearance. Among these alternative processes, nano mold process is a process that is of benefit to mass production and keeps excellency of reproduction and high quality of parts. In this study, we experienced micro precision machining technology of nano stamper for the injection mold of optical disk with big capacity. Especially, Flatness and uniformity are important for nano stamper with global area, for the purpose of developing polishing technology of micro precision of Back polishing only being used for nano stamper, we carried out a basic study to secure flatness standards

• 정보저장시스템학회논문집
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• 제1권2호
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• pp.192-196
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• 2005

In this paper, we investigated the possibility of replicating patterned media by nano-injection molding process with a metallic nano-stamper. The original nano-master was fabricated by E-beam lithography and ICP etching process. The metallic nano-stamper was fabricated using a nanoimprint lithography and nano-electroforming process. The nano-patterned substrate was replicated using a nano-injection molding process without additional etching process. In nano-injection molding process, since the solidified layer, generated during the polymer filling, deteriorates transcribability of nano patterns by preventing the polymer melt from filling the nano cavities, an injection-mold system was constructed to actively control the stamper surface temperature using MEMS heater and sensors. The replicated polymeric patterns using nano-injection molding process were as small as 50 nm in diameter, 150 nm in pitch, and 50 nm in depth. The replicated polymeric patterns can be applied to high density patterned media.

• 한국전기전자재료학회:학술대회논문집
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• 한국전기전자재료학회 2007년도 추계학술대회 논문집
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• pp.416-417
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• 2007

MmSH injection molding method to fabricate light guiding plate with nano-sized pattern was developed. A stamper was fabricated through photolithography, dry etching, and electroplating processes. While the stamper with nano-sized pattern in mold was kept at $180^{\circ}C$ during injection process, that was cooled down to $90^{\circ}C$ quickly after the injection process. The nano-sized pattern on light guiding plate processed by MmSH injection molding method was well transferred from stamper compared to that processed by conventional injection molding process.

• 소성∙가공
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• 제14권7호
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• pp.624-627
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• 2005

In this paper, we investigated the possibility of replicating patterned media by nano-injection molding process with a metallic nano-stamper. The original nano-master was fabricated by I-beam lithography and ICP etching process. The metallic nano-stamper was fabricated using a nanoimprint lithography and nano-electroforming process. Finally, the nano-patterned substrate was replicated using a nano-injection molding process without additional etching process. The replicated patterns using nano-injection molding process were as small as 50nm in diameter, 150nm in pitch, and 50nm in depth.

• 한국소성가공학회:학술대회논문집
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• 한국소성가공학회 2005년도 춘계학술대회 논문집
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• pp.60-63
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• 2005

In this paper, we investigated the possibility of replicating patterned media by nano-injection molding process with a metallic nano-stamper. The original nano-master was fabricated by E-beam lithography and ICP etching process. The metallic nano-stamper was fabricated using a nanoimprint lithography and nano-electroforming process. Finally, the nano-patterned substrate was replicated using a nano-injection molding process without additional etching process. The replicated patterns using nano-injection molding process were as small as 50 nm in diameter, 150 nm in pitch, and 50 nm in depth.

• 한국소성가공학회:학술대회논문집
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• 한국소성가공학회 2006년도 춘계학술대회 논문집
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• pp.81-85
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• 2006

In this study, we have been examined nano Injection Molding process which can improve transcription of 100nm-level pattern. We changed the various parameter (temperature of injection mold, clamp force, temperature of nozzle) which can be influence for improving transcription. And we measured and analyzed shapes of 100nm-level pattern by Automic Force Microscope for proving transcription. We made the Blu-ray Disc sample for proving transcription. And we measured HF-Signal and jitter. As a result, when the temperature of mold is more than $120^{\circ}C$ and the clamp force is more than 10 ton, We reached over 95 percent of transcription compared with stamper pattern. And we reached in-spec. value for HF-Signal and Jitter. Then we reached over 95 percent of transcription compared with stamper pattern.

• 한국정밀공학회:학술대회논문집
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• 한국정밀공학회 2005년도 추계학술대회 논문집
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• pp.698-701
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• 2005

We have investigated experimentally a nano patterning using electron beam lithography for the nickel stamper fabrication. Recently, DVD and Blu-ray disk(BD) have nano-scale patterns in order to increase the storage density. Specially, BD has 100nm-scale patterns which are generally fabricated by electron beam lithography. In this paper, we found optimum condition of electron-beam lithography for 100nm-scale patterning. We controlled various conditions of EHP(acceleration voltage), beam current, dose and aperture size in order to obtain optimum conditions. We used 100nm-thick PMMA layer on a silicon wafer as photoresist. We found that EHP was the most dominant factor in electron-beam lithography.

• 한국금형공학회:학술대회논문집
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• 한국금형공학회 2008년도 하계 학술대회
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• pp.35-38
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• 2008

A pattern master and a Ni stamper for 50nm class of patterns are fabricated through e-beam lithography and Ni electroforming process. A model pattern set is designed, which is based on unit patterns of 50nm, 100nm, 150nm and 200nm in length and 50nm in width. The e-beam process is optimized to fabricate designed patterns with some parameters including dose, accelerating voltage, focal distance and developing time. For Ni electroforming to fabricate Ni stamper, a seed layer, a conducting layer, is deposited first on the pattern master fabricated by an e-beam lithography process. Ni, Ti/Ni and Cr are first tested to find optimal seed layer process. Currently the best result is obtained when adopting Cr deposited to be 100nm thick with continuous tilting motion of the master substrate during the deposition process.