• Journal of Powder Materials
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• v.14 no.3 s.62
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• pp.202-207
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• 2007

Novel polymer mold process for fabrication of microcomponents using metal nanopowders was developed and experimentally optimized. Polymer mold for forming green components was produced by using a hard master mold and polydimethylsiloxane (PDMS). In the preparation of metallic powder premix for the green components without any defect, 90 wt.% 17-4PH statinless steel nanopowders and 10 wt.% organic binder were mixed by a ball milling process. The green components with very clear gear shape were formed by filling the powder premix into the PDMS soft mold in surrounding at about $100^{\circ}C$. Cold isostatic pressing (CIP) was very potent process to decrease a porosity in the sintered microcomponent. The microgear fabricated by the improved process showed a good dimension tolerance of about 1.2%.

• Proceedings of the Korean Vacuum Society Conference
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• 2012.08a
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• pp.393-393
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• 2012

Optically active nanostructures such as subwavelength moth-eye antireflective structures or surface enhanced Raman spectroscopy (SERS) active structures have been demonstrated to provide the effective suppression of unwanted reflections as in subwavelength structure (SWS) or effective enhancement of selective signals as in SERS. While various nanopatterning techniques such as photolithography, electron-beam lithography, wafer level nanoimprinting lithography, and interference lithography can be employed to fabricate these nanostructures, roll-to-roll (R2R) nanoimprinting is gaining interests due to its low cost, continuous, and scalable process. R2R nanoimprinting requires a master to produce a stamp that can be wrapped around a quartz roller for repeated nanoimprinting process. Among many possibilities, two different types of mask can be employed to fabricate optically active nanostructures. One is self-assembled Au nanoparticles on Si substrate by depositing Au film with sputtering followed by annealing process. The other is monolayer silica particles dissolved in ethanol spread on the wafer by spin-coating method. The process is optimized by considering the density of Au and silica nano particles, depth and shape of the patterns. The depth of the pattern can be controlled with dry etch process using reactive ion etching (RIE) with the mixture of SF6 and CHF3. The resultant nanostructures are characterized for their reflectance using UV-Vis-NIR spectrophotometer (Agilent technology, Cary 5000) and for surface morphology using scanning electron microscope (SEM, JEOL JSM-7100F). Once optimized, these optically active nanostructures can be used to replicate with roll-to-roll process or soft lithography for various applications including displays, solar cells, and biosensors.

• Polymer(Korea)
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• v.30 no.5
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• pp.407-411
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• 2006

The SiC-based ceramic nanopatterns were prepared by placing polydimethylsiloxane (PDMS) mold from DVD master on the spincoated polyvinylsilaeane (PVS) or allylhydridopolycaybosilane (AHPCS) as ceramic precursors to fabricate line pattern via UV-nanoimprint lithography (UV-NIL), and subsequent pyrolysis at $800^{\circ}C$ in nitrogen atmosphere. As the dimensional change of polymeric and ceramic patterns was comparatively investigated by AFM and SEM, the shrinkage in height was 38.5% for PVS derived pattern and 24.1% for AHPCS derived pattern while the shrinkage in width was 18.8% for PVS and 16.7% for AHPCS. It indicates that higher ceramic yield of the ceramic precursor resulted in less shrinkage, and the strong adhesion between the substrate and the pattern caused anisotropic shrinkage. This preliminary work suggests that NIL is a promissing route for fabricating ceramic MEMS devices, with the development on the shrinkage control.

• Transactions of the Korean Society of Mechanical Engineers A
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• v.35 no.9
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• pp.1015-1020
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• 2011

Nanoimprint lithography has been actively investigated. This method can replicate a nanopatterned master stamp onto a thin polymer film on a silicon substrate and so on. In this study, a square-shaped hollow piezoelectric actuator is presented, which is newly developed. This actuator is used for driving a nanoscale stamp in nanoimprint lithography instead of a conventional electric motor. The fabricated prototype actuator has 95 layers and side lengths of 23 mm and 18 mm for the outer and inner squares, respectively. By adopting a novel process instead of the conventional forming process for fabricating a one-layer actuator, the one-layer is composed of four rectangular segments produced by sawing a ceramic film with a thickness of 0.3 mm. The basic characteristics on displacement and generation force of the fabricated prototype actuator are experimentally investigated. Furthermore, the displacement characteristics obtained by using a PI controller are tested and discussed.

• Proceedings of the Optical Society of Korea Conference
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• 2006.07a
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• pp.197-198
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• 2006

본 연구에서 개발하는 성형렌즈는 그림1과 같이 한쪽 면이 비구면인 평볼록 형상이다. Glass렌즈의 고온압축성형을 위해서는 초정밀 가공기술로 제작된 성형Mold가 필요하며, Mold재질에 따른 성형기술의 확립이 필수적이다. 또한, 성형Mold의 표면과 융착반응이 없는 Glass소재가 요구된다. 본 실험을 위한 성형Mold는 코발트(Co) 함량 0.5 %의 초경합금(WC; 일본, Everloy社, 002K)을 초정밀 연삭가공하여 제작하였다. Glass소재는 전이점(Transformation Point; Tg) $572\;^{\circ}C$,항복점(Yielding Point; At) $630\;^{\circ}C$의 열적 특성을 갖는 K-BK7(일본, Sumita社)을 사용하였으며, d선에서 굴절률 및 아베수는 각각 1.51633, 64.1이다. 비구면 Glass렌즈 성형은 GMP(Glass Molding Press; 일본, Sumitomo社, Nano Press-S)장비를 사용하여 성형온도 $625\;^{\circ}C$, 서냉온도 $550\;^{\circ}C$로 고정하고 성형압력를 200-800 N 범위에서 변화시켰다. 표 1에 성형변수로 사용한 서냉속도와 서냉전환온도 조건을 나타낸다. 표1과 같이 각 서냉조건별로5장의 렌즈를 성형 후 특성값이 평균치에 가까운 3장을 선별하여 그 특성을 비교하였다. 각 조건에 따른 성형렌즈의 형상정도(일본, Panasonic社, UA3P, 자유곡면형상측정기), 두께(일본, Mitutoyo社, MDC-25M, 마이크로메터), 굴절률(일본, Shimatus社, KPR-200, 정밀굴절률측정기) 및 MTF[해상도](독일, Trioptics社, Image Master HR, MTF-Field)를 측정하여 각각의 광학적 특성을 비교 평가하였다. 비구면 Glass렌즈 성형장비와 형상측정기를 그림 2, 3에 각각 나타낸다.

• Korean Journal of Materials Research
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• v.15 no.9
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• pp.589-593
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• 2005

Nanoimprinting lithography (NIL) is known as a suitable technique for fabricating nano and micro structures of high definition. Hot embossing is one of NIL techniques and can imprint on thin films and bulk polymers. Key issues of hot embossing are time and expense needed to produce a stamp withstanding a high temperature and pressure. Fabrication of a metal stamp such as an electroplated nickel is cost intensive and time consuming. A ceramic stamp made by silicon is easy to break when the pressure is applied. In this paper, a plastic stamp using a high temperature epoxy was fabricated and tested. The plastic stamp was relatively inexpensive, rapid to produce and durable enough to withstanding multiple hot embossing cycles. The merits of low viscosity epoxy solutions were a fast degassing and a rapid filling the microstructures. The hot embossing process with plastic stamp was performed on PMMA substrates. The hot embossing was conducted at 12.6 bar, $120^{\circ}C$ and 10 minutes. An imprinted PMMA wafer was almost same value of the plastic stamp after 10 times embossing. Entire fabrication process from silicon master to plastic stamp was completed within 12 hours.