• Elastomers and Composites
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• v.56 no.3
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• pp.179-186
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• 2021

Carbon-based nanofillers, including nanodiamond (ND) and carbon nanotubes (CNTs), have been employed in epoxy matrixes for improving the toughness, using the tow prepreg method, of epoxy compounds for high pressure tanks. The reinforcing performance was compared with those of commercially available toughening fillers, including carboxyl-terminated butadiene acrylonitrile (CTBN) and block copolymers, such as poly(methyl methacrylate)-b-poly(butyl acrylate)-b-poly(methyl methacrylate) (BA-b-MMA). CTNB improved the mechanical performance at a relatively high filler loading of ~5 phr. Nanosized BA-b-MMA showed improved performance at a lower filler loading of ~2 phr. However, the mechanical properties deteriorated at a higher loading of ~5 phr because of the formation of larger aggregates. ND showed no significant improvement in mechanical properties because of aggregate formation. In contrast, surface-treated ND with epoxidized hydroxyl-terminated polybutadiene considerably improved the mechanical properties, notably the impact strength, because of more uniform dispersion of particles in the epoxy matrix. CNTs noticeably improved the flexural strength and impact strength at a filler loading of 0.5 phr. However, the improvements were lost with further addition of fillers because of CNT aggregation.

• Journal of the Semiconductor & Display Technology
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• v.12 no.1
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• pp.23-28
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• 2013

Epoxy resins are widely used in microelectronics packaging such as printed circuit board and encapsulating for semiconductor manufacturing. Water can diffuse into and through the epoxy matrix systems and moisture absorption at boarding interfaces of matrix resin systems can lead to a hydrolysis at the interfaces resulting in delamination of encapsulating materials. In the study, the changes of diffusion coefficient and moisture content ratio of epoxy resin systems with nano-sized fillers according to the change of liquid type epoxy resins were investigated. RE-304S, RE-310S, RE-810NM and HP-4032D as a epoxy resin, Kayahard AA as a hardener, and 1B2MI as a catalyst were used in these epoxy resin systems. After curing, moisture content ratios were measured with time under the 85 and 85% relative humidity condition using a thermo-hydrostat. The maximum moisture absorption ratio and diffusion coefficient of EMC decrease with the filler content. It can be seen that these decreases are due to the increase of filler surface area and the decrease of moisture through channel with the content of nano-sized filler.

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.20 no.4
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• pp.348-351
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• 2007

Recently, Nanotechnology becomes a major issue in most part of industries. Nanotechnology is expected to develop various application products due to nano material mired composites is improved physical and electrical properties compared to conventional composites materials. Dielectric and insulation materials need to develop and improve like other field about nanotechnology. In this paper, we reported dielectric dispersion by size(no filler, $1.2{\mu}m$, 500 nm, 10 nm), frequencies(60, 120, 1 kHz), and temperatures($30{\sim}170^{\circ}C$). Dielectric constant of composites materials with filler shows higher than composites materials without filler and increased depending on rising temperatures in low frequency region. It was the effect that nano-filler and impurities in composites contributed to electrical conductivity. And dielectric properties depending on temperatures shows to change in low frequency region dramatically We analyzed interfacial polarization in low frequency region($10^{-2}$ Hz) and oriented polarization in high frequency region($10^{-5{\sim}6}$ Hz) on composites materials.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2008.04c
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• pp.73-74
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• 2008

In this paper, we have investigated dispersibility, volume resistivity of nano-composite by solution mixing method. Dispersibility measured by FE-SEM(Field Emission Scanning Electron Microscope. And volume resistivity measured by ASTM D991. To expect interaction used dual filler system. But, dual filler system had influence on polymer complex. So, polymer chain mobility doesn't resist.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2008.06a
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• pp.273-274
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• 2008

For the purpose of practical use of epoxy composite materials, it has been widely known that adding filler is an indispensable condition for cost-effectiveness and reinforcement of mechanical strength. However, dielectric strength of insulators made of epoxy composites rapidly decreases due to interfaces between the epoxy resin and filler particles. In this paper, it is investigated that the electrical properties of epoxy resins as the function of nano-$SiO_2$ content. We obtained that breakdown voltage of 0.4[wt%] specimens is higher than the other $SiO_2$ content.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2010.06a
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• pp.46-46
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• 2010

In this paper, we studied the volume resistivity and the electrical conductivity properties of nano composites to investigate the electrical properties of epoxy composites added nano MgO. The specimens were produced by classifying to 1.0, 3.0, 5.0, 10[wt%] and virgin specimen according to the addition amount of MgO. We measured the volume resistivity of nano filler using the High Resistance Meter(4329A) at the measuring temperature changed to 25, 50, 80, 100, and [$120^{\circ}C$]. As the result, it is confirmed that the volume resistivity was the highest stability and volume resistivity value is $2.6{\times}10^{17}\;[\Omega{\cdot}cm]$ at 3.0[wt%]. And it is confirmed that the electrical conductivity property is sharply increased at low electric filed region and the conductivity current density is rapidly increased at high electric filed region.

• Journal of Electrical Engineering and Technology
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• v.8 no.2
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• pp.345-353
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• 2013

This paper discusses the experimental results in an effort to understand the tracking and erosion resistance of the micro and nano size $Al_2O_3$ filled silicone rubber (SIR) material which has been studied under the AC voltages, with ammonium chloride as a contaminant, as per IEC 60587 test procedures. The characteristic changes in the tracking resistance of the micro and nano size filled specimens were analyzed through leakage current measurement and the eroded masses were used to evaluate the relative erosion and tracking resistance of the composites. The fundamental, third and fifth harmonic of the leakage current during the tracking study were analyzed using moving average current technique. It was observed that the harmonic components of leakage current show good correlation with the tracking and erosion resistance of the material. The thermogravimetry-derivative thermo gravimetric (TG-DTG) studies were performed to understand the thermal degradation of the composites. The physical and chemical studies were carried out by using scanning electron microscope (SEM), Energy Dispersive X-ray analysis (EDAX) and Fourier Transform Infra-red (FTIR) Spectroscopy. The obtained result indicated that the performance of nano filled SIR was better than the micro filled SIR material when the % wt. of filler increased.

• Journal of the Korean Chemical Society
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• v.54 no.5
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• pp.594-602
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• 2010

Since the requirement of the high density integration and thin package technique of semiconductor have been increasing, the main package type of semiconductor will be a chip scale package (CSP). The changes of diffusion coefficient and moisture content ratio of epoxy resin systems according to the change of liquid type epoxy resin and fillers for CSP applications were investigated. The epoxy resins used in this study are RE-304S, RE310S, and HP-4032D, and Kayahard MCD as hardener and 2-methylimidazole as catalyst were used in these epoxy resin systems. The micro-sized and nano-sized spherical type fused silica as filler were used in order to study the moisture absorption properties of these epoxy molding compound (EMC) according to the change of filler size. The temperature of glass transition (Tg) of these EMC was measured using Dynamic Scanning Calorimeter (DSC), and the moisture absorption properties of these EMC according to the change of time were observed at $85^{\circ}C$ and 85% relative humidity condition using a thermo-hygrostat. The diffusion coefficients in these EMC were calculated in terms of modified Crank equation based on Ficks' law. An increase of diffusion coefficient and maximum moisture absorption ratio with Tg in these systems without filler can be observed, which are attributed to the increase of free volume with Tg. In the EMC with filler, the changes of Tg and maximum moisture absorption ratio with the filler content can be hardly observed, however, the diffusion coefficients of these systems with filler content show the outstanding changes according to the filler size. The diffusion via free volume is dominant in the EMC with micro-sized filler; however, the diffusion with the interaction of absorption according the increase of the filler surface area is dominant in the EMC with nano-sized filler.

• Journal of the Society of Disaster Information
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• v.11 no.2
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• pp.235-243
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• 2015

The methods to improve the protection and explosion-proof performance of concrete structures include the backside reinforcement or concrete material property improvement and the addition of structural members or supports to increase the resistance performance, but they are inefficient in terms of economics and structural characteristics. This study is about the basic study on the fiber composite panel cover, and the nano-composite material and adhesive as the filler, to maximize the specific performance of each layer and the protection and explosion-proof performance as the composite panel component by improving the tensile strength, light weight, adhesion and fire-proof performances. The fiber composite panel cover (aramid-polyester ratios of 6:4 and 6.5:3.5) had a 2,348 MPa maximum tensile strength and a 1.8% maximum elongation. The filler that contained the nano-composite material and adhesive had a 4 MPa maximum tensile shear adhesive strength. In addition, the nano-composite filler was 30% lighter than the normal portland cement

• Elastomers and Composites
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• v.42 no.4
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• pp.201-208
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• 2007

In this study, the thermal shrinkage and expansion stresses of filled NR and SBR vulcanizates were measured to investigate the dimensional stability at an elevated temperature. When a rubber sample was held at constant pre-strain, a thermal stress developed upon heating due to the entropic consideration. The peak shrinkage stress of carbon black or silica filled NR decreased with increasing filler content. In SBR compounds, however, the peak shrinkage stress of SBR with 30 phr filler content was higher than that of unfilled compounds. The expansion stress of carbon black filled NR was changed little, but that of filled SBR increased with increasing the filler content. The peak expansion stress of silica filled NR and SBR vulcanizates increased with increasing silica content.