• 제목/요약/키워드: NIL (nanoimprint lithography)

검색결과 87건 처리시간 0.028초

대면적 UV 임프린팅 공정에서 잔류층 두께 예측 (Prediction of Residual Layer Thickness of Large-area UV Imprinting Process)

  • 김국원
    • 반도체디스플레이기술학회지
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    • 제12권2호
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    • pp.79-84
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    • 2013
  • Nanoimprint lithography (NIL) is the next generation photolithography process in which the photoresist is dispensed onto the substrate in its liquid form and then imprinted and cured into a desired pattern instead of using traditional optical system. There have been considerable attentions on NIL due to its potential abilities that enable cost-effective and high-throughput nanofabrication to the display device and semiconductor industry. Although one of the current major research trends of NIL is large-area patterning, the technical difficulties to keep the uniformity of the residual layer become severer as the imprinting area increases more and more. In this paper, with the rolling type imprinting process, a mold, placed upon the $2^{nd}$ generation TFT-LCD glass sized substrate($370{\times}470mm^2$), is rolled by a rubber roller to achieve a uniform residual layer. The prediction of residual layer thickness of the photoresist by rolling of the rubber roller is crucial to design the rolling type imprinting process, determine the rubber roller operation conditions-mpressing force & feeding speed, operate smoothly the following etching process, and so forth. First, using the elasticity theory of contact problem and the empirical equation of rubber hardness, the contact length between rubber roller and mold is calculated with consideration of the shape and hardness of rubber roller and the pressing force to rubber roller. Next, using the squeeze flow theory to photoresist flow, the residual layer thickness of the photoresist is calculated with information of the viscosity and initial layer thickness of photoresist, the shape of mold pattern, feeding speed of rubber roller, and the contact length between rubber roller and mold previously calculated. Last, the effects of rubber roller operation conditions, impressing force & feeding speed, on the residual layer thickness are analyzed with consideration of the shape and hardness of rubber roller.

Characteristics of hybrid mask mold for combined nanoimprint and photolithography technique

  • MOON KANSHUN;CHOI BANGLIM;PARK IN-SUNG;HONG SUNSHUM;YANG KIHYUN;LEE HEON;AHN JINHO
    • 한국반도체및디스플레이장비학회:학술대회논문집
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    • 한국반도체및디스플레이장비학회 2005년도 추계 학술대회
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    • pp.147-150
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    • 2005
  • We process a novel approach cal led combined nanoimprint and photolithography (CNP) to greatly simplify the fabrication in conventional nanoimprint lithography (NIL). In this study, a novel HMM with anti-sticking $SiO_2$ layer is introduced to improve the quality of transferred pattern. The surface property was investigated using contact angle measurement and spectrophotometer. Replicate pattern with CNP using HMM showed complete pattern transfer without defect.

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극대면적 UV-NIL 공정에서의 균일 가압 시스템 개발 (The Development of Uniform Pressurizing System for Extremely Large Area UV-NIL)

  • 최원호;신윤혁;여민구;임홍재;신동훈;장시열;정재일;이기성;임시형
    • 대한기계학회:학술대회논문집
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    • 대한기계학회 2008년도 추계학술대회A
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    • pp.1917-1921
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    • 2008
  • Ultraviolet-nanoimprint lithography (UV-NIL) is promising technology for cost effectively defining micro/nano scale structure at room temperature and low pressure. In addition, this technology is fascinating because of it's possibility for high-throughput patterning without complex processes. However, to acquire good micro/nano patterns using this technology, there are some challenges such as uniformity and fidelity of patterns, etc. In this paper, we have focused on uniform contact mechanism and performed contact mechanics analysis. The dimension of the flexible sheet to get adequate uniform contact area has been obtained from contact mechanics simulation. Based on this analysis, we have made a uniform pressurizing device and confirmed its uniform pressurized zone using a pressure sensing paper.

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불화 함유 다이아몬드 상 탄소 스탬프를 사용하는 UV 나노 임프린트 리소그래피 (UV-Nanoimprint Lithography Using Fluorine Doped Diamond-Like Carbon Stamp)

  • 정준호;알툰알리;나종주;최대근;김기돈;최준혁;이응숙
    • 한국소성가공학회:학술대회논문집
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    • 한국소성가공학회 2006년도 춘계학술대회 논문집
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    • pp.109-112
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    • 2006
  • A fluorine-doped diamond-like carbon (F-DLC) stamp which has high contact angle, high UV-transmittance and sufficient hardness, was fabricated using the following direct etching method: F-DLC is deposited on a quartz substrate using DC and RF magnetron sputtering, PMMA is spin coated and patterned using e-beam lithography and finally, $O_2$ plasma etching is performed to transfer the line patterns having 100 nm line width, 100 nm line space and 70 nm line depth on F-DLC. The optimum fluorine concentration was determined after performing several pre-experiments. The stamp was applied successfully to UV-NIL without being coated with an anti-adhesion layer.

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UV 나노임프린트 리소그래피를 위한 불화 함유 다이아몬드 상 탄소 스탬프의 제작 (Fabrication of Fluorine Doped Diamond-Like Carbon Stamp for UV-Nanoimprint Lithography)

  • 알툰 알리;정준호;나종주;최대근;김기돈;이응숙
    • 한국정밀공학회:학술대회논문집
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    • 한국정밀공학회 2006년도 춘계학술대회 논문집
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    • pp.145-146
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    • 2006
  • A fluorine-doped diamond-like carbon (F-DLC) stamp which has high contact angle, high UV-transmittance and sufficient hardness, was fabricated using the following direct etching method: F-DLC is deposited on a quartz substrate using DC and RF magnetron sputtering, PMMA is spin coated and patterned using e-beam lithography and finally, O2 plasma etching is performed to transfer the line patterns having 100 nm line width, 100 nm line space and 70 nm line depth on F-DLC. The optimum fluorine concentration was determined after performing several pre-experiments. The stamp was applied successfully to UV-NIL without being coated with an anti-adhesion layer.

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Nanoscale Fluoropolymer Pattern Fabrication by Capillary Force Lithography for Selective Deposition of Copper

  • 백장미;이린;성명모
    • 한국진공학회:학술대회논문집
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    • 한국진공학회 2012년도 제43회 하계 정기 학술대회 초록집
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    • pp.369-369
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    • 2012
  • The present work deals with selective deposition of copper on fluoropolymers patterned silicon (111) surfaces. The pattern of fluoropolymer was fabricated by nanoimprint lithography (NIL) and plasma reactive ion etching (RIE) was used to remove the residuals layers. Copper was electrochemically deposited in bare Si regions which were not covered with fluoropolymers. The patterns of fluoropolymers and copper have been investigated by scanning electron microscopy (SEM). In this work, we used two deposition methods. One is galvanic displacement method and another is electrodeposition. Selective deposition works in both cases and it shows applicability to other materials. By optimization of the deposition conditions can be achieved therefore this process represents a simple approach for a direct high resolution patterning of silicon surfaces.

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