• Title/Summary/Keyword: Multilayered Thin Films

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A Study on the Zone Melting Recrystallization of Sequentially Evaporated InSb Thin Films for Improvement of the Electron Mobility (순차 증착한 InSb 박막의 전자 이동도 향상을 위한 대용융 재결정에 관한 연구)

  • 김병윤;현규택;주승기
    • Journal of the Korean Institute of Telematics and Electronics A
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    • v.30A no.6
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    • pp.31-37
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    • 1993
  • InSb thin films were fabricated by zone melting recrystallization of In/Sb multilayered thin films prepared by sequential evaporation. Unreacted metal phase or dispersed metal precipitates lowered the electron mobility and the electron mobility increased with development of (111) prefered orientation. Properties of the film could be controlled by changing mzximum temperature and scanning speed, and the electron mobility as high as 12, 000 cm $^2$/Vsec could be obtained under the optimized conditions.

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Electrochemical Characterization of Multilayered CdTe/PSS Films Prepared by Electrostatic Self-assembly Method

  • Rabbani, Mohammad Mahbub;Yeum, Jeong Hyun;Kim, Jungsoo;Nam, Dae-Geun;Oh, Weontae
    • Transactions on Electrical and Electronic Materials
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    • v.15 no.5
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    • pp.257-261
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    • 2014
  • Multilayered CdTe/PSS films were prepared by the electrostatic self-assembly method in an aqueous medium. Positively-charged cadmium telluride (CdTe) nanoparticles and anionic polyelectrolyte, poly (sodium 4-styrene sulfonate) (PSS) were assembled alternately in order to build up a multilayered film structure. A linear proportion of absorbance to the number of bilayers suggests that an equal amount of CdTe was adsorbed after each dipping cycle, which resulted in the buildup of a homogenous film. The binding energies of elements (Cd and Te) in multilayered CdTe/PSS film shifted from those of the CdTe nanoparticles in the pure state. This result indicates that the interfacial electron densities were redistributed by the strong electrostatic interaction between the oppositely-charged CdTe and PSS. Electrochemical properties of the multilayered CdTe/PSS films were studied in detail by cyclic voltammetry (CV).

Effects of passivation layer on the thermal deformation behavior of metal film used in semiconductor devices (반도체용 박막재료의 열응력-변형 특성에 미치는 passivation 층의 영향 분석)

  • Choi, Ho-Seong;Lee, Kwang-Ryol;Kwon, Dong-Il
    • Proceedings of the KIEE Conference
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    • 1998.11c
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    • pp.732-734
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    • 1998
  • Metal thin films such as aluminum have been used as interconnects in semiconductor device. Recently, these materials are applied to structural materials in microsensors and microactuators. In this study, we evaluate deformation and strength behavior of aluminum alloy film. Three layer model for thermal deformation of multilayered thin film material is introduced and applied to Si/Al(1%Si)/$SiO_2$ system. Based on beam bending theory and concept of bending strain. elastic and elastic/plastic thermal deformation behaviors of multilayered materials can be estimated. In the case of plastic deformation of ductile layer, strain rate equations based on deformation mechanism map are employed for describe the stress relaxation effect. To experimentally examine deformation of multilayered thin film materials, in-situ laser scanning method is used to measure curvature of specimens during heating and cooling. The thickness of $SiO_2$ layer is varied to estimate third-layer effect of thermal deformation of metal films, and its effect on deformation behavior are discussed.

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Effects of SiO$_2$ Buffer Layer on Properties of ZnO thin films and Characteristics of SAW Devices with a Multilayered Configuration of IDT/ZnO/SiO$_2$/Si (SiO$_2$ 완충층이 ZnO 박막의 물성 및 IDT/ZnO/SiO$_2$/Si 다층막 구조 표면탄성파 소자의 특성에 미치는 영향)

  • Lee, Jin-Bok;Lee, Myeong-Ho;Park, Jin-Seok
    • The Transactions of the Korean Institute of Electrical Engineers C
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    • v.51 no.9
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    • pp.417-422
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    • 2002
  • ZnO thin films were deposited on various substrates, such as Si-(111), SiO$_2$(5000 $\AA$ by thermal CVD)/Si-(100), and SiO$_2$(2000 $\AA$ by RF sputtering)/Si-(100). The (002)-orientation, surface morphology and roughness, and electrical resistivity of deposited films were measured and compared in terms of substrate. Surface acoustic wave(SAW) filters with a multilayered configuration of IDT/ZnO/SiO$_2$/Si were also fabricated and the IDT was obtained using a lift-off method. From the frequency-response characteristics of fabricated devices, the insertion loss and side-lobe rejection were estimated. The experimental results showed that the (002)-oriented growth nature of ZnO films, which played a crucial role of determining the characteristic of SAW device, was strong1y dependent upon the SiO$_2$buffer.

Effect of Seeding Layers on Preparation of PLZT Thin Films by Sol-Gel Method

  • Hirano, Tomio;Kawai, Hiroki;Suzuki, Hisao;Kaneko, Shoji;Wada, Tatsuya
    • The Korean Journal of Ceramics
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    • v.5 no.1
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    • pp.50-54
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    • 1999
  • $(Pb_xLa_{1-x}) (Zr_yTi_{1-y})O_3$ (PLZT) thin films with electrooptic effect are promising for the optical application such as display or light shutter. However, it is difficult to use inexpensive and transparent glass substrates because the conventional process for preparation of PLZT requires temperatures above $600^{\circ}C$. In order to deposit a perovskite PLZT thin films at low processing temperatures through alkoxide route, we have offered several seeding processes which reduce the activation energy for crystallization. In this study, we optimized the stacking structure of multilayered PLZT for obtaining single phase perovskite at lower temperatures. As a result, ferroelectric PLZT thin films with different compositions were successfully prepared at a temperature as low at $500^{\circ}C$.

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Micromachinng and Fabrication of Thin Filmes for MEMS-infrarad Detectors

  • Hoang, Geun-Chang;Yom, Snag-Seop;Park, Heung-Woo;Park, Yun-Kwon;Ju, Byeong-Kwon;Oh, Young-Jei;Lee, Jong-Hoon;Moonkyo Chung;Suh, Sang-Hee
    • The Korean Journal of Ceramics
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    • v.7 no.1
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    • pp.36-40
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    • 2001
  • In order to fabricate uncooled IR sensors for pyroelectric applications, multilayered thin films of Pt/PbTiO$_3$/Pt/Ti/Si$_3$N$_4$/SiO$_2$/Si and thermally isolating membrane structures of square-shaped/cantilevers-shaped microstructures were prepared. Cavity was also fabricated via direct silicon wafer bonding and etching technique. Metallic Pt layer was deposited by ion beam sputtering while PbTiO$_3$ thin films were prepared by sol-gel technique. Micromachining technology was used to fabricate microstructured-membrane detectors. In order to avoid a difficulty of etching active layers, silicon-nitride membrane structure was fabricated through the direct bonding and etching of the silicon wafer. Although multilayered thin film deposition and device fabrications were processed independently, these could b integrated to make IR micro-sensor devices.

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