• Journal of Magnetics
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• v.2 no.3
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• pp.86-92
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• 1997

An artificially modulated magnetic Co/Pd multilayer is one of the promising candidates for high density magneto-optic (MO) recording media in the wavelength of a blue laser beam, due to large Kerr rotation angle. However, since the Co/Pd multilayer is a non-equilibrium state in terms of free energy and MO recording is a kind of thermal recording which is conducted around Curie temperature (Tc) of the recording media, the assessment of the thermal stability in the Co/Pd multilayer is crucially important both for basic research and applications. As the parameter of the thermal stability in this research, effective interdiffusion coefficients (Deff) perpendicular to the interface of the Co/Pd multilayers are measured in terms of Ar sputtering pressure and heat treatment temperature. From the results of the research, we find out that the magnetic exchange energy between Co and Pd sublayers strongly affects Deff of the Co/Pd multilayers. This discovery will provide the understanding of the magnetic exchange energy in the effective interdiffusion process of a magnetic multilayer structure and suggest the operating temperature range for MO recording in the Co/Pd multilayer for the basic research and applications, respectively.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2007.06a
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• pp.397-397
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• 2007

Multilayer transparent electrodes, having a much lower electrical resistance than the widely used transparent conducting oxide electrodes, were prepared by using radio frequency magnetron sputtering. The multilayer structure consisted of five layers, indium tin oxided(ITO)/zinc oxide(ZnO)/Ag/oxide(ZnO)/ITO. With about 50nm thick ITO films, the multilayer showed a high optical transmittance in the visible range of the spectrum and had color neutrality. The electrical and optical properties of ITO/ZnO/Ag/ZnO/ITO multilayer were changed mainly by Ag film properties, which were affected by the deposition process of the upper layer. Especially ZnO layer was improved to adhesion of Ag and ITO. A high quality transparent electrode, having a resistance as low as and a high optical transmittance of 91% at 550nm, was obtained. It could satisfy the requirement for the flexible OLED and LCD.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2005.05a
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• pp.127-130
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• 2005

The properties of phosphorus doped ZnO multilayer thin films deposited on (001) sapphire substrates by pulsed laser deposition (PLD) were investigated by using annealing treatment at various annealing temperature after deposition. The phosphorus doped ZnO multilayer was composed of phosphorus doped ZnO layer and two pure ZnO layers on sapphire substrate. The structural. electrical and optical properties of the ZnOthin films were measured by X-ray diffraction (XRD). Hall measurements and photoluminescence (PL). As the annealing temperature optimized. the electrical properties of the ZnO multilayer showed a electron concentration of $1.56{\times}10^{16}/cm^3$, a resistivity of 17.97 ${\Omega}cm$. It was observed the electrical property of the film was changed by dopant activation effect as thermal annealing process

• International conference on construction engineering and project management
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• 2020.12a
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• pp.23-29
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• 2020

Multilayer sub-contracting is a significant practice among the world, including Hong Kong. When a principal contractor secured a project from a developer, the specific jobs will usually be breaking down and sub-contractors with the lowest bid [1]. The adoption of multilayer sub-contracting has been a controversy issue which is considered as a two-side blade. While certain studies have been carried out to examine both the contributions, damages and improvements for multi-layer subcontracting, the construction industry and researchers are still waiting for a solid measure to enhance the system. Hence, this research attempts to study the advantages, disadvantages, conducts a comparison between single and multilayer sub-contracting and measures of current Hong Kong construction industry based on literature review, questionnaire and in-depth interviews. To achieve the objectives, Analytic Hierarchy Process (AHP) and total weighted score methods are adopted to examine and rank the criterion. The findings of this study provide a good basis for understanding the major reasons and problems caused by the adoption of multilayer sub-contracting. Besides, the identified safety perspective explores a new perspective regarding to issues of multi-layer subcontracting, which will serve as a solid foundation for further research to enhance safety performance. Finally, the findings of measurements towards improvement of multilayer sub-contracting will also provide a solidsolution for construction industry.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2004.04b
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• pp.34-37
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• 2004

Recently advancing mobile communication tools and I.T industry, semiconductor device is requested more integrated, faster operation time and more scaled-down. Because of these reasons semiconductor device is requested multilayer interconnection. For the multilayer interconnection chemical mechanical polishing (CMP) becomes one of the most useful process in semiconductor manufacturing process. In this experiment, we focus on understand the characterize and improve the CMP technology by control of slurry flow rate. Consequently, we obtain that optimal flow rate of slurry is 170ml/min, since optimal conditions are less chemical flow and performance high with good selectivity to Ta. If we apply this results to copper CMP process. it is thought that we will be able to obtain better yield.

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.20 no.2
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• pp.118-123
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• 2007

The purpose of this work was to investigate the design and fabrication process effects on electrical properties in high capacitance multilayer ceramic capacitor (MLCC) with nickel electrode. Dielectric breakdown voltage and insulation resistance value were decreased with increasing stack layer number, but dielectric constant and capacitance were increased. With increasing green sheet thickness, dielectric breakdown voltage, C-V and I-V properties were also increased. The major reasons of the effects were thought to be the defects generated extrinsically during fabrication process and interfacial reactions formed between nickel electrode and dielectric layer. These investigations clearly showed the influence of both green sheet thick ness and stack layer number on the electrical properties in fabricating the MLCC.

• Journal of the Semiconductor & Display Technology
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• v.9 no.4
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• pp.93-97
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• 2010

Fast incipient fault diagnosis is becoming one of the key requirements for economical and optimal process operation management in high-tech industries. Artificial neural networks have been used to detect faults for a number of years and shown to be highly successful in this application area. This paper presents a novel test technique for fault detection and classification for module process of TFT-LCD manufacture using support vector machines (SVMs). In order to evaluate SVMs, this paper examines the performance of the proposed method by comparing it with that of multilayer perception, one of the artificial neural network techniques, based on real benchmarking data.

• Journal of the Korean institute of surface engineering
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• v.32 no.3
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• pp.289-296
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• 1999

The integration of the LSI has been greatly improved and the circuit patters on the LSI are becoming finer line and pitch. The high-density electronic packaging technology is improved. In order to realize the high-density packaging technology, the density of the circuit wiring of the printed circuit boards have also been more dense. The build-up process multilayer printed circuit board technology have a lot of vias, possibilities of the finer conductor wirings and have a freedom of capabilities of wiring design. The build-up process printed circuit boards have the wiring rules which are the pattern width: $100-20\mu\textrm{m}$, the via hole diameter: $100-50\mu\textrm{m}$. There three kinds of build-up processes as far materials and hole drilling. In this paper, the recent technology trends of the build-up printed circuit board technologies are described.

• Journal of the Korean Society of Manufacturing Process Engineers
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• v.21 no.4
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• pp.107-113
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• 2022

At present, it is possible to manufacture electrodes down to several micrometers (~ ㎛) using inkjet printing technology owing to the development of precision ejection heads. Inkjet printing technology is also used in the manufacturing of bio-sensors, electronic sensors, and flexible displays. To reduce the difference between the electrode design/simulation performance and actual printing pattern performance, it is necessary to analyze and optimize the processable area of the ink material, which is a fluid. In this study, process optimization was conducted to manufacture an IDE pattern and fabricate an impedance sensor. A total of 25 IDE patterns were produced, with five for each lamination process. Electrode line width and height changes were measured by stacking the designed IDE pattern with a nanoparticle-based conductive ink multilayer. Furthermore, the optimal process area for securing a performance close to the design result was analyzed through impedance and capacitance. It was observed that the increase in the height of stack layer 4 was the lowest at 4.106%, and the increase in capacitance was measured to be the highest at 44.08%. The proposed stacking process pattern, which is optimized in terms of uniformity, reproducibility, and performance, can be efficiently applied to bio-applications such as biomaterial sensing with an impedance sensor.

• Journal of the Korean institute of surface engineering
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• v.45 no.1
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• pp.20-24
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• 2012

Multilayer passivation film on OLED with organic/inorganic hybrid structure as to diminish the thermal stress and expansion was researched to protect device from the direct damage of $O_2$ and $H_2O$ and improve life time characteristics. Red OLED doped with 1 vol.% Rubrene in $Alq_3$ was used as a basic device. The films consist of ITO(150 nm)/ELM200_HIL(50 nm)/ELM002_HTL(30 nm)/$Alq_3$: 1 vol.% Rubrene(30 nm)/$Alq_3$(30 nm) and LiF(0.7 nm)/Al(100 nm) which were formed in that order. Using LiF/$SiN_x$ as a buffer layer was determined because it significantly improved life time characteristics without suffering damage in the process of forming passivation film. Multilayer passivation film on buffer layer didn't produce much change in current efficiency, while the half life time at 1,000 $cd/m^2$ of OLED/LiF/$SiN_x$/E1/$SiN_x$ was 710 hours which showed about 1.5 times longer than OLED/LiF/$SiN_x$/E1 with 498 hours. futhermore, OLED/LiF/$SiN_x$/E1/$SiN_x$/E1/$SiN_x$ with 1301 hours showed about twice than OLED/LiF/$SiN_x$/E1/$SiN_x$ which demonstrated that superior characteristics of life time was obtained in multilayer passivation film. Through the above result, it was suggested using LiF/$SiN_x$ as a buffer layer could reduce the damage from the difference of thermal expansion coefficient in OLED with protective films, and epoxy layer in multilayer passivation film could function like a buffer between $SiN_x$ inorganic layers with relatively large thermal stress.