• Title/Summary/Keyword: Multilayer process

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Pallet speed control in a sintering plant using neural networks (신경회로망을 이용한 소결기 팰릿 속도 제어)

  • Jang, Min;Cho, Sung-Jun
    • Proceedings of the Korea Inteligent Information System Society Conference
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    • 1999.03a
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    • pp.261-270
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    • 1999
  • Sintering transforms powdered ore into lumped ore so that the latter can be used in a blast furnace. The powdered or combined with coke and other materials is loaded into a container and moved along by a pallet while the ignited coke burns. The speed by which the pallet moves determines how much sintering takes place. Since the process is complicated and lacks an accurate mathematical model, human operators manually control the speed by monitoring various factors in the plant. In this paper, we propose a neural network-based pallet speed controller which copies human operator knowledge. Actual process data were collected from a sintering plant for eight months and preprocessed to remove noisy and inconsistent data. A multilayer perceptron was trained using a back-propagation learning algorithm. In on-line testing at the sinter plant, the proposed model reliably controlled pallet speed during normal operation without the help of human operators. Moreover, the quality and productivity was as good as with human operators.

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A study on AR, HR coating simulations for the high power laser diode (고출력 laser diode를 위한 AR, HR coating simulation에 관한 연구)

  • 류정선;윤영섭
    • Electrical & Electronic Materials
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    • v.9 no.5
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    • pp.498-505
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    • 1996
  • In the present work, we have developed the simulator to optimize the process conditions of the AR(antireflection) and HR(high-reflection) coatings for the high power laser diode. The simulator can run on the PC. After making the simple optical model, we establish the Maxwell equations for the model by the operator conversion. By using the Mathematica, we derive a matrix for the multilayer system by applying the equations to the model and optimize the AR and HR coating process conditions by obtaining the reflection rate from the matrix. We also prove the validity of the simulator by comparing the simulation with the characteristics of the laser diode which is AR and HR coated according to the optimized conditions.

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Influence of Laminating and Sintering Condition on Permittivity and Shrinkage During LTCC Process (LTCC 공정 중 적층 및 소결이 유전율과 회로 형상에 미치는 영향)

  • Jeong, M.S.;Hwang, S.H.;Chung, H.W.;Rhim, S.H.;Oh, S.I.
    • Transactions of Materials Processing
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    • v.16 no.5 s.95
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    • pp.396-400
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    • 2007
  • LTCC(Low Temperature Co-fired Ceramic) which offers a good performance to produce multilayer structures with electronic circuits and components has emerged as an attractive technology in the electronic packaging industry. In LTCC module fabrication process, the lamination and the sintering are very important processes and affect the electrical characteristics of the final products because the processes change the permittivity of ceramics and the dimension of the circuit patterns which have influences on electronic properties. This paper discusses the influence of lamination pressure and sintering temperature on the permittivity and the dimensional change of LTCC products. In the present investigation, it is shown that the permittivity increases along with increasing of the lamination pressure and the sintering temperature.

Fabrication of Infrared Filters for Three-Dimensional CMOS Image Sensor Applications

  • Lee, Myung Bok
    • Transactions on Electrical and Electronic Materials
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    • v.18 no.6
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    • pp.341-344
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    • 2017
  • Infrared (IR) filters were developed to implement integrated three-dimensional (3D) image sensors that are capable of obtaining both color image and depth information at the same time. The combination of light filters applicable to the 3D image sensor is composed of a modified IR cut filter mounted on the objective lens module and on-chip filters such as IR pass filters and color filters. The IR cut filters were fabricated by inorganic $SiO_2/TiO_2$ multilayered thin-film deposition using RF magnetron sputtering. On-chip IR pass filters were synthetized by dissolving various pigments and dyes in organic solvents and by subsequent patterning with photolithography. The fabrication process of the filters is fairly compatible with the complementary metal oxide semiconductor (CMOS) process. Thus, the IR cut filter and IR pass filter combined with conventional color filters are considered successfully applicable to 3D image sensors.

Fabrication of Organic Photovoltaics Using Transparent Conductive Films Based on Graphene and Metal Grid

  • Kim, Sung Man;Walker, Bright;Seo, Jung Hwa;Kang, Seong Jun
    • Proceedings of the Korean Vacuum Society Conference
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    • 2014.02a
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    • pp.441-441
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    • 2014
  • The characteristics of hybrid conductive films based on multilayer graphene and silver grid have been investigated for the high-performance and flexible organic solar cells. The hybrid conductive films have been prepared on glass and polyethylene terephthalate (PET) substrates using conventional photolithography process and transfer process of graphene. The optical and electrical properties of prepared conductive films show transmittance of 87% at 550nm and sheet resistance of $28{\Omega}/square$. The electromechanical properties were also investigated in detail to confirm the flexibility of the hybrid films. OSCs have been fabricated on the hybrid conductive films based on graphene and silver grid on glass substrate. The power conversion efficiency of 2.38%, a fill factor of 51%, an open circuit voltage of 0.58V and a short circuit current of $8.05mA/cm^2$ were obtained from the device on glass substrate. The PCE was enhanced 11% compared with OSCs on the MLG films without silver grid.

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An LTCC Linear Delay Filter Design with Interdigital Stripline Structure

  • Hwang, Hee-Yong;Kim, Seok-Jin;Kim, Hyeong-Seok
    • KIEE International Transactions on Electrophysics and Applications
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    • v.4C no.6
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    • pp.300-305
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    • 2004
  • In this paper, new design equations based on the pole-zero analysis for multi-layered interdigital stripline linear group delay bandpass filter with tap input ports are presented. As a design example, a four-pole group delay filter with center frequency of 2.14GHz, bandwidth of 160MHz, and group delay variation of $\pm$0.1nS for LTCC technology or multilayered PCB technology is designed. In the design process, it is not necessary to simulate the entire structure, as the simulation of half structures is sufficient. Good results can be attained after the optimizing process was performed three times using the proposed equations and a commercial EM simulator.

Characterization of Hydrazine Solution Processed Multi-layered CuInSe2 Thin Films (하이드라진 용액법으로 형성된 CuInSe2 다층 박막 분석)

  • Chung, Choong-Heui
    • Journal of the Korean institute of surface engineering
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    • v.48 no.4
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    • pp.169-173
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    • 2015
  • $CuInSe_2$ thin films which have been widely used for thin solar cells as a light absorber were prepared by hydrazine solution processing, and their microstructural properties were investigated. Hydrazine $CuInSe_2$ precursor solutions were prepared by dissolving $Cu_2S$, S, $In_2Se_3$ and Se powder in hydrazine solvent. Multilayer $CuInSe_2$ chalcopyrite phase thin films were prepared by repeating spin-coating process using the precursor solution. Unfortunately, the presence of the interfaces between each $CuInSe_2$ layer formed by multi-layer coating impeded grain growth across the interface. Here, by doing simple interface engineering to solve the limited grain growth issue, the large grained (${\sim}1{\mu}m$) $CuInSe_2$ thin films were obtained.

Lamination of LTCC Sheet Using Binder Film (Binder Film을 이용한 LTCC Sheet 적층)

  • Shin, Hyo-Soon;Choi, Yong-Seok;Park, Eun-Tae
    • Journal of the Korean Ceramic Society
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    • v.43 no.4 s.287
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    • pp.253-258
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    • 2006
  • In the lamination process of multi-layer ceramic modules, the occurrence of delamination comes into repeatedly. To completely improve the lamination process of LTCC sheets, a binder film was introduced between the layers. The binder film did not originate the delamination until the thickness under $40{\mu}m$. After lamination, the thickness of the binder film was determined by the infilteraion of binder by the pressure, and after the bake-out, was dependent on the decomposition of binder resin. Any detectable defect was not observed in the multilayer structure with Ag inner electrodes.

Investigation of Giant Magnetoresistance in Vacuum-Annealed NiFe/Ag Discontinuous Multilayers

  • Park, Chang-Min;Kim, Young-Eok;Shin, Kyung-Ho
    • Journal of Magnetics
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    • v.2 no.2
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    • pp.50-54
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    • 1997
  • The vacuum-annealed Ni80Fe20/Ag discontinuous multilayers were found to show giant magnetoresistive behaviors comparable to those of corresponding multilayers annealed at atmospheric pressure in a mixture of H2 and Ar. This vacuum-annealing process will offer potential advantages, enabling a continuous batch process from the deposition to the annealing. Their giant magnetoresistive behaviors were attributed to the magnetostatic coupling that are induced at the edges of the discontinuous magnetic grains. We also present our results about the multilayer patterned into a basic device for the magnetic field sensor.

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Electro-Magnetic Properties & Manufacturing Process of (NiCuZn)-Ferrites for Multilayer chip inductor by Wet Process (습식합성법을 이용한 칩인덕터용 (NiCuZn)-Ferrites의 제조공정과 전자기적 특성)

  • 허은광;김정식
    • Proceedings of the International Microelectronics And Packaging Society Conference
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    • 2002.05a
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    • pp.165-168
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    • 2002
  • 본 연구에서는 칩인덕터 코어 소재로 사용되는 (NiCuZn)-ferrite를 습식합성법을 이용하여 나노크기의 초미세 분말을 합성하였으며, 합성된 (ZiCuZn)-ferrite 의 제조공정 및 전파기적 특성에 관하여 고찰하였다. 조성은 (N $i_{0.4-x}$C $u_{x}$Z $n_{0.6}$)$_{1+w}$ (F $e_2$ $O_4$)$_{1-w}$에서 x의 값을 0.05~0.25 범위로 변화시켰으며, w 값은 0.03으로 고정하였다. 소결은 8$50^{\circ}C$에서 9$50^{\circ}C$의 범위에서 진행하였다. 나노크기의(NiCuZn)-ferrite를 사용함으로서 시약급 원료로 제조된 것보다 소결온도를 낮출 수 있었고, 밀도가 높은 페라이트 소결체를 얻을 수 있었다. 또한 초투자율, 품질계수 등 전자기적 특성이 우수하게 나타났다. 그 밖에 습식합성법으로 합성한 (NiCuZn)-ferrite 의 결정성, 미세구조 등을 XRD, SEM 을 이용하여 고찰하였다.하였다.다.

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