• Journal of the Korean Society of Manufacturing Process Engineers
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• v.19 no.10
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• pp.8-15
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• 2020

The diffusion cell method is the main technique employed for the in vitro diffusion test of transdermal drug delivery preparations. Most existing transdermal diffusion devices use a water bath heating structure and direct current motor magnetic stirrer. However, these devices are confronted with problems, such as large volume, incompatible vertical and horizontal diffusion cells, few diffusion cell sets, and poor reliability. To overcome these deficiencies, the system adopts a dry heating method and uses a rotating magnetic field generated by the electromagnetic stirrer to drive the magnetic stirrer. Accordingly, the resulting device is characterized by a simple structure and small volume, convenient operation, compatible vertical and horizontal diffusion cells, and numerous diffusion cell sets. The reliability and practicability of the system is verified by the in vitro percutaneous permeability test of the bisoprolol patch.

• Bulletin of the Korean Chemical Society
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• v.20 no.3
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• pp.307-313
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• 1999

2,4-Di-(2'-vinyloxyethoxy)benzylidenemalononitrile (la), methyl 2,4-di-(2'-vinyloxyethoxy)benzylidenecyanoacetate (lb), 3,4-di-(2'-vinyloxyethoxy)benzylidene malononitrile (2a), methyl 3,4-di-(2'-vinyloxyethoxy)benzylidenecyanoacetate (2b), 2,5-di-(2'-vinyloxyethoxy)benzylidenemalononitrile (3a), methyl 2,5-di-(2'-vinyloxyethoxy)benzylidenecyanoacetate (3b), 2,3-di-(2'-vinyloxyethoxy)benzylidenemalononitrile (4a), and methyl 2,3-di-(2'-vinyloxyethoxy)benzylidenecyanoacetate (4b) were prepared by the condensation of 2,4-di-(2'-vinyloxyethoxy)benzaldehyde, 3,4-di-(2'-vinyloxyethoxy)benzaldehyde, 2,5-di-(2'-vinyloxyethoxy) benzaldehyde, and 2,3-di-(2'-vinyloxyethoxy)benzaldehyde with malononitrile or methyl cyanoacetate, respectively. Trifunctional divinyl ether monomers 1-4 were polymerized readily with boron trifluoride etherate as a cationic initiator to give optically transparent swelling poly(vinyl ethers) 5-8 havina oxybenzylidenemalononitrile and oxycyanocinnamate, which is presumably effective chromophore for second-order nonlinear optical applications. Polymers 5-8 were not soluble in common organic solvents such as acetone and DMSO due to crosslinking. Polymers 5-8 showed a thermal stability up to 300 ℃ in TGA thermograms, which is acceptable for electrooptic device applications.

• Electronics and Telecommunications Trends
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• v.39 no.3
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• pp.98-106
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• 2024

Advanced packaging is emerging as a core technology owing to the increasing demand for multifunctional and highly integrated semiconductors to achieve low power and high performance following digital transformation. It may allow to overcome current limitations of semiconductor process miniaturization and enables single packaging of individual devices. The introduction of advanced packaging facilitates the integration of various chips into one device, and it is emerging as a competitive edge in the industry with high added value, possibly replacing traditional packaging that focuses on electrical connections and the protection of semiconductor devices.

• Journal of the Microelectronics and Packaging Society
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• v.23 no.2
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• pp.57-63
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• 2016

We developed a flexible and micro-thick electromagnetic interference (EMI) shielding nanofabric layer that also functions as a water resisting and heat sinking material. Electrospinning followed by a simple heat treatment process was carried on to produce the EMI-shielding Ni/C hybrid nanofibers. The ambient oxygen partial pressure ($pO_2$ = 0.1, 0.7, 1.3 Torr) applied during the heat treatment was varied in order to optimize the effectiveness of EMI-shielding by modifying the size and crystallinity of the magnetic Ni nanoparticles distributed throughout the C nanofibers. Permittivity and permeability of the nanofibers under the electromagnetic (EM) wave frequency range of 300 MHz~1 GHz were measured, which implied the EMI-shielding effectiveness (SE) optimization at $pO_2$ = 0.7 Torr during the heat treatment. The materials' heat diffusivity for both in-plane direction and vertical direction was measured to confirm the anisotropic thermal diffusivity that can effectively deliver and sink the local heat produced during device operations. Also, the nanofibers were aged at room temperature in oxygen ambient for water resisting function.

• Proceedings of the Korean Vacuum Society Conference
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• 2013.02a
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• pp.161-161
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• 2013

Two-dimensional electron gas (2DEG) has been investigated at the heterointerface between two insulating dielectric perovskite oxides, $LaAlO_3$ (LAO)/$SrTiO_3$ (STO). Properties of the 2DEG have attracted an enormous interest in condensed matter physics due to multifunctional properties such as the coexistence of ferromagnetism and superconductivity, as well as the high electron mobility. Here, we have grown $Ta_2O_5$ thin films using pulsed laser deposition on $SrTiO_3$ substrate to investigate the electric properties of the $Ta_2O_5$/STO heterointerface. Our research reveal that the non-polar $Ta_2O_5$/$TiO_2$ heterointerface favors the formation of 2DEG similar to that at the LAO/STO heterointerface. The metallic behavior was found in this heterointerface with the current about $10{\sim}100{\mu}A$ at 5 V by using conventional I-V measurements, when the $Ta_20_5$ film thickness reaches over critical thickness, $d_c{\simeq}2uc$. The finding that electrons was localized at $Ta_2O_5$/STO heterointerface have attracted to be strong and new candidate for nanoscale oxide device applications.

• Journal of the Korea Furniture Society
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• v.27 no.4
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• pp.318-324
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• 2016

Recently, pedestrians suffered inconveniences with moving on the next building due to the high-rise buildings. So, the number of passageways is increasing for convenience of pedestrians. Currently, people are paying attention to building energy saving. We anticipated that It increases the cooling load of the building and building energy by a passageway. We chose a passageway for a subject because people are paying attention to building energy saving lately. The purpose of this study was to analyze the indoor thermal environment according to the passageway. We measured temperature of building with passageway using a multifunctional device in order to progress the study. On analysis based on investigation, finishing material and glass area of passageway have an effect on indoor thermal environment. The result shows that the cooling load of building alter depending on characteristic of passageway.

• Medical Lasers
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• v.9 no.2
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• pp.110-118
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• 2020

The non-ablative fractional dual laser is equipped with two types of lasers, 1550 nm and 1927 nm in one device, and was approved by the United States Food and Drug Administration in 2013. The advantages of the non-ablative fractional laser (NAFL) include fewer side effects such as erythema, edema, post-laser pigmentation, and scab formation. Thus, the NAFL is preferred by both practitioners and consumers because it is convenient and safe for use. The 1550 nm erbium glass and 1927 nm thulium lasers are representative NAFLs that have been developed separately and are often used as a single-wavelength laser with proven clinical efficacy in various indications. The 1550 nm wavelength laser penetrates the dermis layer and the 1927 nm wavelength laser is effective for epidermal lesions. Therefore, targeting the skin layer can be easily achieved with both the 1550 and 1927 nm lasers, respectively, or in combination. Clinically, the 1550 nm laser is effective in the treatment of mild to moderate sagging and wrinkles, scars, and resurfacing. The 1927 nm laser improves skin texture and treats skin pigmentation and wounds. It can also be used for drug delivery. The selection and utilization rate of NAFL has been increasing in recent times, due to changes in lifestyle patterns and the need for beauty treatments with fewer side effects and short downtime. In this study, we present a plan for safe and effective laser therapy through a review of literature. Clinical applications of the multifunctional NAFL are also described.

• Korean journal of communication and information
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• v.74
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• pp.72-108
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• 2015

The more mobile technology evolves, the more users are trapped in mobile technology by being encouraging the replacement with state-of-the-art technology. However, the use of device is not entirely determined by technology's attributes itself. The meaning of smartness can be varied by 'how users accept and perceive immediate spatial perception from reality to mobile space' without recognizing the boundaries between them. This study focuses on the analysis of 'smart usage' for smartphone and this is verified the concept of 'smart usage' by the second-order measurement model. The result show that the concept organization of 'smart usage' had been differentiated and elicited by the six factors - 'multifunctional use readiness', 'administrative efficiency', 'embedded media', 'device connectivity', 'user-friendly optimization', and 'external connectivity(being connected). According to the conceptual factors, 'smart usage' can be explained in an individual's autonomous ability to control a mobile interface and to utilize a wide range of applications of smartphones.

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.37 no.4
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• pp.420-426
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• 2024

This study proposes an innovative methodology for developing flexible printed circuit boards (FPCBs) capable of conforming to three-dimensional shapes, meeting the increasing demand for electronic circuits in diverse and complex product designs. By integrating a traditional flat plate-based fabrication process with a subsequent three-dimensional thermal deformation technique, we have successfully demonstrated an FPCB that maintains stable electrical characteristics despite significant shape deformations. Using a modified polyimide substrate along with Ag flake-based conductive ink, we identified optimized process variables that enable substrate thermal deformation at lower temperatures (~130℃) and enhance the stretchability of the conductive ink (ε ~30%). The application of this novel FPCB in a prototype 3D-shaped sensor device, incorporating photosensors and temperature sensors, illustrates its potential for creating multifunctional, shape-adaptable electronic devices. The sensor can detect external light sources and measure ambient temperature, demonstrating stable operation even after transitioning from a planar to a three-dimensional configuration. This research lays the foundation for next-generation FPCBs that can be seamlessly integrated into various products, ushering in a new era of electronic device design and functionality.

• Journal of the Microelectronics and Packaging Society
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• v.17 no.4
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• pp.1-9
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• 2010

Three-dimensional (3-D) integration is an emerging technology, which vertically stacks and interconnects multiple materials, technologies, and functional components such as processor, memory, sensors, logic, analog, and power ICs into one stacked chip to form highly integrated micro-nano systems. Since CMOS device scaling has stalled, 3D integration technology allows extending Moore's law to ever high density, higher functionality, higher performance, and more diversed materials and devices to be integrated with lower cost. The potential benefits of 3D integration can vary depending on approach; increased multifunctionality, increased performance, increased data bandwidth, reduced power, small form factor, reduced packaging volume, increased yield and reliability, flexible heterogeneous integration, and reduced overall costs. It is expected that the semiconductor industry's paradiam will be shift to a new industry-fusing technology era that will offer tremendous global opportunities for expanded use of 3D based technologies in highly integrated systems. Anticipated applications start with memory, handheld devices, and high-performance computers and extend to high-density multifunctional heterogeneous integration of IT-NT-BT systems. This paper attempts to introduce new 3D integration technologies of the chip self-assembling stacking and 3D heterogeneous opto-electronics integration for realizng the super-chip.