• Smart Structures and Systems
• /
• v.6 no.5_6
• /
• pp.689-709
• /
• 2010

In this paper, a low cost, low power but multifunctional wireless sensor node is presented for the impedance-based SHM using piezoelectric sensors. Firstly, a miniaturized impedance measuring chip device is utilized for low cost and low power structural excitation/sensing. Then, structural damage detection/sensor self-diagnosis algorithms are embedded on the on-board microcontroller. This sensor node uses the power harvested from the solar energy to measure and analyze the impedance data. Simultaneously it monitors temperature on the structure near the piezoelectric sensor and battery power consumption. The wireless sensor node is based on the TinyOS platform for operation, and users can take MATLAB$^{(R)}$ interface for the control of the sensor node through serial communication. In order to validate the performance of this multifunctional wireless impedance sensor node, a series of experimental studies have been carried out for detecting loose bolts and crack damages on lab-scale steel structural members as well as on real steel bridge and building structures. It has been found that the proposed sensor nodes can be effectively used for local wireless health monitoring of structural components and for constructing a low-cost and multifunctional SHM system as "place and forget" wireless sensors.

• Journal of Biomedical Engineering Research
• /
• v.26 no.4
• /
• pp.243-249
• /
• 2005

The number of people who have lost limbs due to amputation has increased due to various accidents and diseases. Numerous attempts have been made to provide these people with prosthetic devices. These devices are often controlled using myoelectric signals. Although the success of fitting myoelectric signals (EMG) for single device control is apparent, extension of this control to more than one device has been difficult. The lack of success can be attributed to inadequate multifunctional control strategies. Therefore, the objective of this study was to develop multifunctional myoelectric control strategies that can generate a number of output control signals. We demonstrated the feasibility of a neural network classification control method that could generate 12 functions using three EMG channels. The results of evaluating this control strategy suggested that the neural network pattern classification method could be a potential control method to support reliability and convenience in operation. In order to make this artificial neural network control technique a successful control scheme for each amputee who may have different conditions, more investigation of a careful selection of the number of EMG channels, pre-determined contractile motions, and feature values that are estimated from the EMG signals is needed.

• Bulletin of the Korean Chemical Society
• /
• v.34 no.5
• /
• pp.1355-1360
• /
• 2013

We have developed a new multifunctional material, 4,4',4"-tris(4-naphthalen-2-yl-phenyl)amine (2-TNPA), which can be used as a blue-emitting and hole-transporting material in organic light-emitting diodes (OLEDs), as well as a donor material in organic solar cells (OSCs) and an active material in organic thin-film transistors (OTFTs). The OLED device doped with 3% 2-TNPA shows a maximum current efficiency of 3.0 $cdA^{-1}$ and an external quantum efficiency of 3.0%. 2-TNPA is a more efficient hole-transporting material than 4,4'-bis[N-(naphthyl-N-phenylamino)]biphenyl (NPD). Furthermore, 2-TNPA shows a power-conversion efficiency of 0.39% in OSC and a field-effect mobility of $3.2{\times}10^{-4}cm^2V^{-1}s^{-1}$ in OTFTs.

• Journal of Mechanical Science and Technology
• /
• v.20 no.4
• /
• pp.505-512
• /
• 2006

This paper presents an integrated multifunctional sensor based on MEMS technology, which can be used or embedded in mobile devices for environmental monitoring. An absolute pressure sensor, a temperature sensor and a humidity sensor are integrated in one silicon chip of which the size is $5mm\times5mm$. The pressure sensor uses a bulk-micromachined diaphragm structure with the piezoresistors. For temperature sensing, a silicon temperature sensor based on the spreading-resistance principle is designed and fabricated. The humidity sensor is a capacitive humidity sensor which has the polyimide film and interdigitated capacitance electrodes. The different piezoresistive orientation is used for the pressure and temperature sensor to avoid the interference between sensors. Each sensor shows good sensor characteristics except for the humidity sensor. However, the linearity and hysteresis of the humidity sensor can be improved by selecting the proper polymer materials and structures.

• Journal of the Microelectronics and Packaging Society
• /
• v.22 no.2
• /
• pp.11-19
• /
• 2015

Since CMOS device scaling has stalled, three-dimensional (3-D) integration allows extending Moore's law to ever high density, higher functionality, higher performance, and more diversed materials and devices to be integrated with lower cost. 3-D integration has many benefits such as increased multi-functionality, increased performance, increased data bandwidth, reduced power, small form factor, reduced packaging volume, because it vertically stacks multiple materials, technologies, and functional components such as processor, memory, sensors, logic, analog, and power ICs into one stacked chip. Anticipated applications start with memory, handheld devices, and high-performance computers and especially extend to multifunctional convengence systems such as cloud networking for internet of things, exascale computing for big data server, electrical vehicle system for future automotive, radioactivity safety system, energy harvesting system and, wireless implantable medical system by flexible heterogeneous integrations involving CMOS, MEMS, sensors and photonic circuits. However, heterogeneous integration of different functional devices has many technical challenges owing to various types of size, thickness, and substrate of different functional devices, because they were fabricated by different technologies. This paper describes new 3-D heterogeneous integration technologies of chip self-assembling stacking and 3-D heterogeneous opto-electronics integration, backside TSV fabrication developed by Tohoku University for multifunctional convergence systems. The paper introduce a high speed sensing, highly parallel processing image sensor system comprising a 3-D stacked image sensor with extremely fast signal sensing and processing speed and a 3-D stacked microprocessor with a self-test and self-repair function for autonomous driving assist fabricated by 3-D heterogeneous integration technologies.

• Journal of the Korean Ceramic Society
• /
• v.55 no.3
• /
• pp.203-223
• /
• 2018

The development of two-dimensional graphene layers has recently attracted considerable attention because of its tremendous application in various research fields. Semi-metal materials have received significant attention because of their excellent biocompatibility as well as distinct physical, chemical, and mechanical properties. Taking into account the technical importance of graphene in various fields, such as complementary metal-oxide-semiconductor technology, energy-harvesting and -storage devices, biotechnology, electronics, light-emitting diodes, and wearable and flexible applications, it is considered to be a multifunctional component. In this regard, material scientists and researchers have primarily focused on two typical problems: i) direct growth and ii) low-temperature growth of graphene. In this review, we have considered only cold growth of graphene. The review is divided into five sections. Sections 1 and 2 explain the typical characteristics of graphene with a short history and the growth methods adopted, respectively. Graphene's direct growth at low temperatures on a required substrate with a well-established application is then precisely discussed in Sections 3 and 4. Finally, a summary of the review along with future challenges is described in Section 5.

• Journal of the Korean Society of Manufacturing Technology Engineers
• /
• v.25 no.4
• /
• pp.266-270
• /
• 2016

We present a useful and practical manufacturing technique that enables the structural conversion of delicate as-grown nanostructures to more beneficial and robust thin-film frameworks through controlled mechanical rolling. Functional nanostructures such as carbon nanotubes grown through chemical vapor deposition in a vertically aligned and very loosely packed manner, and thus difficult to manipulate for subsequent uses, can be prepared in an array of thin blades by patterning the growth catalyst layer. They can then be toppled as dominos through precisely controlled mechanical rolling. The nanostructures formulated to horizontally aligned thin films are much more favorable for device applications typically based on thin-film configuration. The proposed technique may broaden the functionality and applicability of as-grown nanostructures by converting them into thin-film frameworks that are easier to handle and more durable and favorable for fabricating thin-film devices for electronics, sensors, and other applications.

• Journal of the Korean Crystal Growth and Crystal Technology
• /
• v.16 no.1
• /
• pp.12-19
• /
• 2006

Metalorganic chemical vapor deposition (MOCYD) techniques have been applied to fabricate semiconducting ZnO thin films and nanostructures, which are promising for novel optoelectronic device applications using their unique multifunctional properties. The growth and characterization of ZnO thin films on Si and $SiO_2$ substrates by MOCYD as fundamental study to realize ZnO nanostructures was carried out. The precise control of initial nucleation processes was found to be a key issue for realizing high quality epitaxial layers on the substrates. In addition, fabrication and characterization of ZnO nanodots with low-dimensional characteristics have been investigated to establish nanostructure blocks for ZnO-based nanoscale device application. Systematic realization of self- and artificially-controlled ZnO nanodots on $SiO_2/Si$ substrates was proposed and successfully demonstrated utilizing MOCYD in addition with a focused ion beam technique.

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
• /
• v.30 no.6
• /
• pp.387-392
• /
• 2017

A high-performing all-transparent photodetector was created by configuring a $MoO_x$/NiO/ZnO/ITO structure on a glass substrate. The ITO bottom layer was applied as a back contact. To achieve the transparent p/n junction, p-type NiO was coated on the n-type ZnO layer. Reactive sputtering was used to spontaneously form the ZnO or NiO layer. In order to improve the transparent photodetector performance, the functional $MoO_x$ window layer was used. Optically, the $MoO_x$ window provided a refractive index layer (n=1.39) lower than that of NiO (n=2), increasing the absorption of the incident light wavelengths (${\lambda}s$). Moreover, the $MoO_x$ window can provide a lower sheet resistance to improve the carrier collection for the photoresponses. The $MoO_x$/NiO/ZnO/ITO device showed significantly better photoresponses of 877.05 (at ${\lambda}$=460nm), 87.30 (${\lambda}$=520 nm), and 30.38 (${\lambda}$=620 nm), compared to 197.28 (${\lambda}$=460 nm), 51.74 (${\lambda}$=520 nm) and 25.30 (${\lambda}$=620 nm) of the NiO/ZnO/ITO device. We demonstrated the high-performing transparent photodetector by using the multifunctional $MoO_x$ window layer.

• Proceedings of the Korean Institute of Information and Commucation Sciences Conference
• /
• 2015.10a
• /
• pp.530-532
• /
• 2015

Nowadays, it is animately studied on IoT(Internet of Things) on the strength of development of the short-range communications technology and smart device. In this paper, it made a interface board which is capable of short-range communications networks based on embedded linux and Android OS (operating system). and we also made a IoT sensor module and device driver module. This devices are easily separated and changed and also simply embodied in IoT, and It was implemented using the Android app that allows you to control the sensors.