• Design & Manufacturing
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• 제8권2호
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• pp.41-45
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• 2014

Automated polishing apparatus based on the research have been developed. The research is improvement of polishing process for surface quality and uniformity improvement of preform injection mold core. Surface quality of preform core have influence on ejecting and product quality after injection molding. Thus, the current being made by hand to automate the polishing process, the surface of the preform to improve the quality and uniformity improvement. First made a division by analyzing manual process a step-by-step. And draw a mechanism for converting mechanical movement. Automated polishing apparatus for preform core was developed, through which shortens production time and were able to secure the safety of the worker.

• 한국전기전자재료학회:학술대회논문집
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• 한국전기전자재료학회 2006년도 추계학술대회 논문집 Vol.19
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• pp.376-377
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• 2006

Chemical Mechanical Planarization (CMP) has emerged as an enabling technology for the manufacturing of multi-level metal interconnects used in high-density Integrated Circuits (IC). Recently, multi-level structures have been also widely used m the MEMS device such as micro engines, pressure sensors, micromechanical fluid pumps, micro mirrors and micro lenses. Especially, among the thin films available in IC technologies, polysilicon has probably found the widest range of uses in silicon technology based MEMS. This paper presents the characteristic of polysilicon CMP for multi-level MEMS structures. Two-step CMP process verifies that is possible to decrease dishing amount with two type of slurries characteristics. This approach is attractive because two-step CMP process can be decreased dishing amount considerably more then just one CMP process.

• 한국전기전자재료학회:학술대회논문집
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• 한국전기전자재료학회 1999년도 춘계학술대회 논문집
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• pp.251-254
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• 1999

A new multi-seeding process for the growth of YBa$_2$Cu$_3$Oxx single crystals was developed. This process introduces an additional heating step to peritectic temperature and a subsequent slow cooling step to the growth temperature following the point when the crystals contacted. The crystal growth was resumed thereafter. The results obtained with this new process were compared with those of the conventional growth process, in which materials were only kept at the growth temperature. It was observed that the liquid phase between crystals were almost completely eliminated, but that Y2ll grains were grown during this new process. There was no significant improvement in trapped magnetic field over the conventional process, which is believed to be due to the cracks generated during the oxygen heat treatment or to the growth of YBa$_2$Cu$_3$Ox grains.

• Corrosion Science and Technology
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• 제23권1호
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• pp.11-19
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• 2024

A Fe-Ni Bainitic steel as a weathering steel application was developed by combining its excellent mechanical properties and corrosion resistance in maritime environments. Nickel concentration (0.4-3 wt%) and inverted austempering multi-step (IAM) process were primary determinants of the microstructure of the Fe-Ni Bainitic steel. The initial austempering steel was performed at 300 ℃ for 600 seconds to obtain a partly bainitic transformation. The steel was heated again for 1800 s at 450 ℃. The microstructure was comprised of ferrite, a blocky martensite/austenite island, and a homogeneous lath-shape bainite structure with widths ranging from 4.67 to 6.89 ㎛. The maximum strength, 1480 MPa, was obtained with 3 wt% nickel. In this study, corrosion behavior was investigated utilizing potentiodynamic and electrochemical impedance spectroscopy (EIS) tests. A higher nickel content in Fe-Ni Bainitic steel refined the grain size, improved the bainite fraction, lowered the corrosion rate to 0.0257 mmpy, and increased the charge transfer of film resistance to 1369 Ω.

• 제어로봇시스템학회:학술대회논문집
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• 제어로봇시스템학회 1997년도 한국자동제어학술회의논문집; 한국전력공사 서울연수원; 17-18 Oct. 1997
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• pp.672-675
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• 1997

This paper proposes a structure of the control system for the step & scan exposure tool. The step & scan exposure tool is used for the manufacturing process of the semiconductor DRAM memory of giga bit. The control system employs the VME bus instead of the conventional ISA bus so that all control signals and data can be managed separately by the 4 VME-PCs for fast and fault-free flow of signals for multi-tasking. A high speed I/O card is equipped for the real-time monitoring and control of the sub module equipment. Then all the subsystems are integrated and aligned for the operation of the step & scan exposure tool with the VME bus and, I/O card.

• 한국기계가공학회지
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• 제8권3호
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• pp.38-45
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• 2009

Recently, LCD Backlight Unit is being replaced from cold cathode fluorescent lamp(CCFL) to external electrode fluorescent lamp(EEFL) because the EEFL has high energy efficiency and long life. Also, it can reduce energy consumption and weight. So far, external electrode ring for EEFL is produced by sheet metal press forming process. Therefore it had low precision and much material loss. To solve these problems, Multi-Forming process that has five step forming process was invented. However, low productivity is another barrier. Product speed that is controlled by the rotational speed cannot be increased due to the unsatisfied design specification. The reason is that the gap between rolled two edge parts of the sheet plate is tightly inspected. Regarding this factor, the understanding of forming behavior to each process is inevitable. This paper describes the CAE analysis of the multi-forming process by PAM-STAMP.

• 한국소성가공학회:학술대회논문집
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• 한국소성가공학회 2009년도 추계학술대회 논문집
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• pp.254-258
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• 2009

In this paper, the low frequency vibration forming system is developed for micro-patterns formation on the metal substrate. many researchers have studied about micro-forming technologies such as micro deep drawing, press forming, forging, extrusion etc. for the formation of precise micro-patterns on the surface of metal substrates, multi-step forming process must be used to improve qualifies of the deformed patterns. Since the low frequency vibration forming system could easily deform the surface of metal substrates, several steps of multi-step forming process should be removed by using the low frequency vibration forming system. In order to find optimal process conditions, we have carried out low frequency vibration forming process with varying the vibration frequency from 110Hz to 500Hz.

• 한국소성가공학회:학술대회논문집
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• 한국소성가공학회 2003년도 춘계학술대회논문집
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• pp.278-282
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• 2003

There is a strong industrial demands for the development of light-vehicle to improve fuel efficiency. It is more effective to reduce weight of the parts directly driven by an automobile engine. So the saving in weight of wheels which is operated by an automobile engine improve fuel efficiency more than other parts. There are many step of sheet metal forming in fabricating automotive wheel, so that it is difficult to design process and tools of multi-stage stamping. Traditionally, design process and tools have depended on the experience of skilled workers and it has done by trial and error methods. However, it needs too much costs and time. Taguchi methods has an advantage of the number of required experiments and reliability compared with trial and error method. In this study, Taguchi methods and response surface methods are applied to design process and tools of automotive wheel. As a result, the principal variables are selected and process conditions are optimized.

• Korean Chemical Engineering Research
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• 제45권2호
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• pp.190-196
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• 2007

본 연구에서는 전기화학적 처리공정을 이용하여 전극판 종류에 따른 질산성 질소의 농도별 제거효율을 살펴보았고, 여기서 선정된 전극으로 운전조건(pH 변화, 전류밀도, 환원제, 교차전류)을 변화시켜 질산성 질소 제거효율, 에너지소모량에 따른 최적운전조건을 평가하였다. 또한 단일공정에 의한 처리가 아닌 다단계 전기화학적 처리를 통한 질산성 질소 제거 실험을 진행하였다. 100 mg $NO_3^{-}$ -N/L 농도로 실험한 결과에서 동일 전극인 경우 Zn-Zn 전극판, 불용성 산화전극 백금(Pt)인 경우 Pt-Ti 전극에서 높은 질산성 질소 제거효율을 나타내었다. 150 mg $NO_3^{-}$ -N/L에서 Zn-Zn 전극판인 경우 pH 조절없이 전기분해한 결과 70~85%, 불용성 산화전극인 백금(Pt)인 경우 Pt-Ti 전극에서 40~50%의 질산성 질소 제거효율을 나타내었다. 그리고 고농도인 500, 1,000 mg $NO_3^{-}$ -N/L 질산성 질소 제거 실험결과, 농도가 증가할수록 제거효율은 감소하는 경향을 보이지만 에너지 소모량에 대한 질소 제거효율은 증가하였다. 다단계 전기화학적 처리 실험결과, Test 4 조건을 최적의 조건으로 선정하였으며 그 이유는 다음과 같다. 첫 번째, 1단계에서 소모된 Zn 양극의 대부분을 2단계 이후 공정에서 회수하였고, 두 번째, 2단계 이후에서는 불용성 백금을 산화전극으로 사용함으로써 전극 소모 가능성을 줄였으며, 마지막으로 Zn을 환원전극으로 사용함으로써 Zn의 재이용 가능성을 높였다. 따라서, 질소를 함유한 표면처리 폐수 처리에 전기화학적 공정이 적용될 수 있을 것으로 판단된다.

• 소성∙가공
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• 제21권2호
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• pp.101-106
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• 2012

Generally, rapid cure reaction of LED encapsulation silicone resin causes serious defects in cured resin products such as warpage, residual bubbles, and reduced wettablility. In order to prevent residual bubbles in silicone resin, the step cure process was examined in the present paper. Three kinds of step cure processes were applied, and bubble-free phenomenon was observed. Most of the bubbles were removed under $70^{\circ}C$, the minimum temperature for activating cure reaction. In addition, degree of cure(DOC) and temperature distribution were predicted by using FEM analysis of heat transfer. It was concluded that maintaining cure temperature which provide a DOC under 0.5~0.6 effectively reduces residual bubbles.