• 대한전기학회:학술대회논문집
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• 대한전기학회 2004년도 추계학술대회 논문집 전기물성,응용부문
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• pp.271-274
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• 2004

Microarray-based DNA chips provide an architecture for multi-analyte sensing. In this paper, we report a new approach for DNA chip microarray fabrication. Multifunctional DNA chip microarray was made by immobilizing many kinds of biomaterials on transducers (particles). DNA chip microarray was prepared by randomly distributing a mixture of the particles on a chip pattern containing thousands of m-scale sites. The particles occupied a different sites from site to site. The particles were arranged on the chip pattern by the random fluidic self-assembly (RFSA) method, using a hydrophobic interaction for assembly.

• 한국전기전자재료학회:학술대회논문집
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• 한국전기전자재료학회 2006년도 하계학술대회 논문집 Vol.7
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• pp.404-405
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• 2006

Microarray-based DNA chips provide an architecture for multi-analyte sensing. In this paper, we report a new approach for DNA chip microarray fabrication. Multifunctional DNA chip microarray was made by immobilizing many kinds of biomaterials on transducers (particles). DNA chip microarray was prepared by randomly distributing a mixture of the particles on a chip pattern containing thousands of m-scale sites. The particles occupied a different sites from site to site. The particles were arranged on the chip pattern by the random fluidic self-assembly (RFSA) method, using a hydrophobic interaction for assembly.

• 한국정보통신학회논문지
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• 제2권1호
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• pp.147-156
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• 1998

본 논문에서는 다치 논리를 이용한 연산기를 설계하였다. 다치 논리를 구현하기 위해서 전류모드 CMOS 회로를 이용하였으며 이진 전압모드 신호를 다치 전류모드 신호로 바꾸어 주는 인코더와 연산 결과인 다치 전류모드 신호를 이진 전압모드 신호로 바꾸어 주는 디코오더를 사용하여 기존의 이진 시스템에 적용할 수 있도록 하였으며, 승산기 설계시 부분곱 수를 줄이기 위하여 기존의 Booth 알고리즘을 확장한 4진 SD수 부분곱 발생 알고리즘을 사용하였다. 제안된 회로는 SPICE 시뮬레이션 및 FPGA Chip을 이용한 하드웨어 에뮬레이션으로 그 유효함을 확인하였다

• 한국공작기계학회논문집
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• 제14권6호
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• pp.110-116
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• 2005

A single-piece-machined-part has superior characteristics to an assembly of several pieces of part especially for aircraft components. It is necessary to develop high efficient 'multi-head router machine' for machining a large size single-piece-part on a large scale. In this type machine, many cutting chips are generated. These chips should be removed automatically f3r productivity and part precision. In this study, the design evaluation of the cutting chip collecting apparatus for 'multi-head router machine' was complemented using performance test and finite element analysis.

• 대한전기학회논문지:전기물성ㆍ응용부문C
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• 제53권8호
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• pp.443-446
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• 2004

In this paper, a multi-band ceramic chip antenna for WLAN(Wireless LAN) applications is designed. The design target is to obtain 0 dBi of coverage gain with omni directional radiation pattern. The antenna is fabricated using Low Temperature Co-fired Ceramic(LTCC) technology. The size of the chip antenna is $2.2{\times}9.65{\times}1.02$mm. The measured antenna gain is 1 dBi at 2.44 GHz and 0.5 dBi at 5.5 GHz. The omni directional radiation pattern for the two operating bands is obtained. The measured bandwidth(S11=-10 dB) are 90 MHz at 2.44 GHz and 1280 MHz at 5.5 GHz respectively

• Biotechnology and Bioprocess Engineering:BBE
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• 제9권2호
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• pp.76-85
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• 2004

Biodevices composed of biomolecular layer have been developed in various fields such as medical diagnosis, pharmaceutical screening, electronic device, photonic device, environmental pollution detection device, and etc. The biomolecules such as protein, DNA and pigment, and cells have been used to construct the biodevices such as biomolecular diode, biostorage device, bioelectroluminescence device, protein chip, DNA chip, and cell chip. Substantial interest has focused upon thin film fabrication or the formation of biomaterials mono- or multi-layers on the solid surfaces to construct the biodevices. Based on the development of nanotechnology, nanoscale fabrication technology for biofilm has been emerged and applied to biodevices due to the various advantages such as high density immobilization and orientation control of immoblized biomolecules. This review described the nanoscale fabrication of biomolecular film and its application to bioelectronic devices and biochips.

• 센서학회지
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• 제4권4호
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• pp.55-61
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• 1995

가변 입력전압을 이용하여 ISFET의 문턱전압을 검출하는 새로운 개념의 ISFET array chip을 설계하였다. 설계된 칩은 240개의 pH-ISFET와 신호처리회로를 포함하며, 증가된 신뢰성 및 정확성, 디지탈 출력 그리고 멀티센서로의 응용성 등의 특성을 가진다. 칩제조를 위해 CMOS 공정을 응용한 새로운 공정을 설계하였고 칩을 layout 하였다.

• 한국정밀공학회:학술대회논문집
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• 한국정밀공학회 2003년도 춘계학술대회 논문집
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• pp.1717-1722
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• 2003

In this paper we developed flip-chip bonder using XY stage, liner-rotary actuator and vision system. We depicted the major parts of the developed flip-chip bonder. Then we discussed several problems and their solutions such as vision and motion control, pick-up module position accuracy, separation of chip from the blue taped hoop, etc. We used a post guide to improve the horizontal positional accuracy against the long arm. Also, we used an ejector module and synchronization technique for easy chip separation from the blue tape.

• 전기학회논문지
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• 제58권1호
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• pp.107-112
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• 2009

This paper describes design and fabrication issues of the SiP(System in Package) one-chip for a portable digital broadcasting receiver. It includes RF tuner chip, demodulator chip and passive components for the receiver system. When we apply the SiP one-chip technology to the broadcasting receiver, the system board size can be reduced from $776mm^2$ to $144mm^2$. SiP one-chip has an advantage that the area reduces more 81% than separated chips. Also the sensitivity performance advances -1dBm about 36 channels in the RF weak electric field, the power consumption reduces about 2mW and the C/N keeps on the same level.

• 대한전기학회:학술대회논문집
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• 대한전기학회 2006년도 제37회 하계학술대회 논문집 C
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• pp.1315-1316
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• 2006

Microarray-based DNA chips provide an architecture for multi-analyte sensing. In this paper, we report a new approach for DNA chip microarray fabrication. Multifunctional DNA chip microarray was made by immobilizing many kinds of biomaterials on transducers (particles). DNA chip microarray was prepared by randomly distributing a mixture of the particles on a chip pattern containing thousands of m-scale sites. The particles occupied a different sites from site to site. The particles were arranged on the chip pattern by the random fluidic self-assembly (RFSA) method, using a hydrophobic interaction for assembly.