• 한국결정성장학회지
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• 제4권4호
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• pp.336-346
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• 1994

용융 silicon과 carbon 입자가 어떠한 반응관계를 나타내는가를 알아보기 위하여 sili-con만으로 된 powder와 silicon에 carbon을 0.2wt%의 비율로 혼합한 powder와 silicon에 carbon을 0.2wt%의 비율로 혼합한 powder를 silicon의 용융점 이사의 고온인 $1450^{\circ}C, 1550^{\circ}C, 1650^{\circ}C, 1700^{\circ}C$에서 각각 1시간, 4시간을 유지시킨 다음 quenching시켜 각각의 조건에 따른 반응의 정도 및 상의 분포와 morphology의 분석을 통해 melt sili-con의 morphology 변화,carbon이 함유된 silicon의 조건에 따른 물성변화 및 SiC의 형성여부를 조사하기 위하여 광학현미경과 SEM, XRD등을 이용하여 시편의 미세구조 및 결정화 양상을 관찰하였다. 용융점 이상의 온도에서 quartz는 연화하여 분해반응을 일으켜 산소를 내놓고 이것이 silicon과 결합하여 SiO로써 기체상태로 휘발하게 되어 silicon melt에 산소침투로 인항 표면결함을 형성하며, liquid silicon속에 용융되어 있던 carbonrhk 불순물로써 grain boundary를 따라 존재 하고 있는 미반응의 carbon이 용융상태 silicon과 반응하여 SiC를 형성한다. SiC 결정은 고화계 면에서 발생하게 되며 생성되는 결정은 ${\alpha}-SiC$이었다.

• 한국표면공학회지
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• 제20권4호
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• pp.144-153
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• 1987

In the case of dipping the Ni-Resist cast iron into molten aluminum with iron content, the thickness of intermetallic compound was remarkably increased with increasing iron content. The thickness was shown by following equation in the range of 1-3% iron content; $x=22.5t^{1/2}+4.47{\cdot}t{\cdot}(Fe%)$. where, x is thickness(${\mu}m$), t the time (minute), Fe% the iron w/o. When the Ni-Resist cast iron was dipped into the molten aluminum containing zinc content, the intermetallic compound thickness was also increased with increasing zinc contents. And thickness was represented by the following equation in the range of 2-10% zinc content; $x=3.46t^{1/2}+0.27{\cdot}t{\cdot}(Zn%)$. However, in the case of dipping the Ni-resist cast iron into molten aluminum with silicon content, the thickness of intermetallic compound was decreased with increasing silicon content, as shown in the following equation; $x=7.17t^{1/2}-0.15{\cdot}t{\cdot}(Si%)$. The intermetallic compound formed onto Ni-Resist cast iron was identified to be $FeAl_3\;and\;Fe_3Al$. As the result of hardness measurement, the peak hardness appeared in the intermetallic compound at near interface of the cast iron and the compound.

• 한국주조공학회지
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• 제25권4호
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• pp.161-167
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• 2005

The experiment of hot dip interaction tests was carried out in order to study the formation behavior of interfacial reaction layer between as-received STD61 hot work tool steel and a commercial pure aluminum melt, Al-xwt.%Fe(x=0.2, 0.5, 0.8 and 1.1) alloys melt and Al-xwt.%Si(x=1.0, 4.0, 7.0 and 10.0) alloys melt, respectively. The results show that the reaction layer, over 300 ${\mu}m$ in thickness, is easily formed by the dissolution of silicon from as-received tool steel. When the iron content in the aluminum alloy is higher than 1.1 wt.%, the thickness of reaction layer decreases below 180 ${\mu}m$ by preventing iron dissolution from the tool steel. The silicon dissolved from tool steel acts as a strong promoter on the formation of reaction layer, but the alloyed silicon in molten aluminum alloys acts as an inhibitor on the formation of reaction layer.

• Journal of Electrochemical Science and Technology
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• 제11권4호
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• pp.392-398
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• 2020

Producing solar grade silicon using an inexpensive method is a key factor in lowering silicon solar cell costs; the direct electrochemical reduction of SiO₂ in molten salt is one of the more promising candidates for manufacturing this silicon. In this study, SiO₂ granules were electrochemically reduced in molten CaCl₂ (850℃) using Ag-Si eutectic droplets that catalyze electrochemical reduction and purify the Si product. When Ag is used as the working electrode, the Ag-Si eutectic mixture is formed naturally during SiO₂ reduction. However, since the Ag-Si eutectic droplets are liquid at 850℃, they are easily lost during the reduction process. To minimize the loss of liquid Ag-Si eutectic droplets, a cylindrical graphite container working electrode was introduced and Ag was added separately to the working electrode along with the SiO₂ granules. The graphite container working electrode successfully prevented the loss of the Ag-Si eutectic droplets during reduction. As a result, the Ag-Si eutectic droplets acted as stable catalysts for the electrochemical reduction of SiO₂, thereby producing one-dimensional Si rods through a mechanism similar to that of vapor-liquid-solid growth.

• 한국결정성장학회지
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• 제3권2호
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• pp.117-124
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• 1993

연속성장법은 crystal growth chamber의 상부에 있는 reservoir에서 원료 분말을 연속적으로 공급하면서 도가니 하부에 용융대를 형성시킨 후, 종자결정을 용융대에 dipping하여 회전시키면서 아래로 끌어내려 단결정을 성장시키는 방법이다. 본 연구에서는 연속 성장법을 이용하여 silicon 단결정을 육성시켰으며 연속성장에 영향을 미치는 인자는 critical melt level, 원료공급속도, 성장속도, graphite crucible과 gruphite susceptor의 형태, work coil의 위치에 따른 graphite susceptor의 수직온도구배, 중력과 종자결정의 회전에 의한 원심력이 용융대의 안정화에 미치는 영향과 용융액 표면에서 일어나는 소결현상에 관해 고찰하였다.

• 대한금속재료학회지
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• 제47권7호
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• pp.423-432
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• 2009

In the galvanizing coating process, the effects of the silicon content on the coatability and wettability of molten zinc were investigated on Dual-Phase High Strength Steels (DP-HSS) with various Si contents using the galvanizing simulator and dynamic reactive wetting systems. DP-HSS showed good coatability and a well-developed inhibition layer in the range of Si content below 0.5 wt%. Good coatability was the results of the mixed oxide $Mn_{2}SiO_{4}$, being formed by the selective oxidation on the surface, with a low contact angle in molten zinc and a large fraction of oxide free surface that provided a sufficient site for the molten zinc to wet and react with the substrate. On the other hand, with more than 0.5 wt%, DP-HSS exhibited poor coatability and an irregularly developed inhibition layer. The poor coatability was due to the poor wettability that resulted from the development of network-type layers of amorphous ${SiO}_{2}$, leading to a high contact angle in molten zinc, on the surface.

• Applied Microscopy
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• 제8권1호
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• pp.77-79
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• 1978

Al-Si junctions were made by vacuum deposition of aluminium on to silicon wafers and examined by TEM. The uneven interfaces of the junctions are formed due to the surface tension of the molten solution resulting in preferential dissolution of silicon in aluminium at some areas. These undesirable uneven interfaces affect the junction shape and so the over-all characteristics of the devices.

• 한국결정성장학회:학술대회논문집
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• 한국결정성장학회 1996년도 The 9th KACG Technical Annual Meeting and the 3rd Korea-Japan EMGS (Electronic Materials Growth Symposium)
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• pp.325-350
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• 1996

• Journal of Welding and Joining
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• 제32권3호
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• pp.68-73
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• 2014

Among through silicon via (TSV) technologies, for replacing Cu filling method, the method of molten solder filling has been proposed to reduce filling cost and filling time. However, because Sn alloy which has a high coefficient of thermal expansion (CTE) than Cu, CTE mismatch between Si and molten solder induced higher thermal stress than Cu filling method. This thermal stress can deteriorate reliability of TSV by forming defects like void, crack and so on. Therefore, we fabricated SiC composite filling material which had a low CTE for reducing thermal stress in TSV. To add SiC nano particles to molten solder, ball-typed SiC clusters, which were formed with Sn powders and SiC nano particles by ball mill process, put into molten Sn and then, nano particle-dispersed SiC composite filling material was produced. In the case of 1 wt.% of SiC particle, the CTE showed a lowest value which was a $14.8ppm/^{\circ}C$ and this value was lower than CTE of Cu. Up to 1 wt.% of SiC particle, Young's modulus increased as wt.% of SiC particle increased. And also, we observed cross-sectioned TSV which was filled with 1 wt.% of SiC particle and we confirmed a possibility of SiC composite material as a TSV filling material.

• 한국결정성장학회지
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• 제5권1호
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• pp.37-43
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• 1995

실리콘의 용액성장을 위해서는 우선 적절한 용매의 선택이 선행되어야 한다. 이 논문에서는 최소한의 실리콘을 (1 atomic%) 고용할 수 있는 온도를 여러 용매를 대상으로 계산하였다.