• Design & Manufacturing
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• v.16 no.2
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• pp.33-38
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• 2022

Currently, Korea is an aging society, and it is expected to enter a super-aging society in about 4 years. Accordingly, many X-ray technologies are being developed. In X-rays, 99% of X-rays are converted into heat energy and 1% into light energy (X-rays). 99% of the thermal energy raises the temperature of the anode and its surroundings, and the cooling system is an important factor as overheating can affect the deterioration of X-ray quality and shortened lifespan. There is a method of forced air cooling using natural convection. Therefore, in this study, when X-rays were taken 5 times, Flow analysis was performed on heat removal according to temperature rise and cooling time for the heat generated at the anode of the X-ray tube (input power 60kW, 75kW, 90kW). Based on one-shot, the most rapid temperature rise section increased by more than 57% to 0.03 seconds, A constant temperature rises from 0.03 seconds to 0.1 seconds, It is judged that the temperature rises by about 8.2% or more at one time. After one-shot cooling, the cooling drops sharply from about 60% to 0.03 seconds, It is judged that the temperature has cooled by more than 86% compared to the temperature before shooting. One-shot is cooled by more than 86% with cooling time after 0.1 seconds, As the input power of the anode increases, the cooling temperature gradually increases. Since the tungsten of the anode target inside the X-ray tube may be damaged by thermal shock caused by a rapid temperature rise, an improvement method for removing thermal energy is required when using a high-input power supply.

• Design & Manufacturing
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• v.16 no.2
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• pp.1-6
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• 2022

As environmental regulations are strengthened, automobile manufacturers continuously research lightweight structures based on carbon fiber reinforced plastic (CFRP). However, it is difficult to see the effect of strength reinforcement when using a single CFRP material. To improve this, a hybrid laminate in which CFRP is mixed with the existing body structural steel was proposed. In this paper, CFRP patch reinforcement is applied to each compression/tensile action surface of a 22MnB5 metal sheet, and it was evaluated through a 3-point bending experiment. Progressive failure was observed in similar deflection on bending deformation to each one-sided reinforced specimen. After progressive failure, the tensile reinforced specimen was confirmed to separate the damaged CFRP patch and 22MnB5 sheet from the center of the flexure. The compression reinforced specimen didn't separate that CFRP patch and 22MnB5, and the strength reinforcement behavior was confirmed. In the compression reinforced specimen, damaged CFRP patches were observed at the center of flexure during bending deformation. As a result of checking the specimen of the compression reinforcement specimen with an optical microscope, It is confirmed that the damaged CFRP patch and the reinforced CFRP patch overlapped, resulting in a concentrated load. Through the experimental results, the 22MnB5 strength reinforcement characteristics according to the reinforcement position of the CFRP patch were confirmed.

• Design & Manufacturing
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• v.18 no.2
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• pp.57-63
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• 2024

In this study, the recyclability of commonly used PP (polypropylene) and ABS (acrylonitrile butadiene styrene) was evaluated by molding test specimens from mixture of virgin and shredded material, followed by measuring their strength properties, Experiments were conducted o two type of PP (transparent and non-transparent) and two types of ABS (white and yellow). Test specimens for each resin were prepared with shredded material ratios ranging from 10% to 50% in 10% increments. Changes in tensile strength, elastic modulus, and elastic limit were analyzed based on the mixing ratio of the shredded material. The experimental results demonstrated that the strength properties of all the resins remained consistent within a certain range, even with increasing proportions of shredded material. For transparent PP, the tensile strength ranged from 30.87± MPa, the elastic modulus from 1.23±0.04 GPa, and the elastic limit from 19.17±0.44%. Non-transparent PP exhibited a tensile strength ranging from 27.71±0.58 MPa, an elastic modulus from 1.03±0.06 GPa, and an elastic limit from 17.35±0.41%. For ABS, white ABS had a tensile strength of 39.42±0.28 MPa, an elastic modulus of 1.94±0.01 GPa, and an elastic limit of 36.76±0.25%. Yellow ABS showed a tensile strength of 39.25±0.78 MPa, an elastic modulus of 1.94±0.01 GPa, and an elastic limit of 37.14±0.23%, with values remaining consistent within this range. Based on these results, it was confirmed that the mechanical properties of the resins used in this study do not change significantly when mixed with recycled shredded material, indicating excellent mechanical recyclability.

• Journal of the Microelectronics and Packaging Society
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• v.21 no.1
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• pp.31-39
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• 2014

For mobile application, semiconductor packages are increasingly moving toward high density, miniaturization, lighter and multi-functions. Typical wafer level packages (WLP) is fan-in design, it can not meet high I/O requirement. The fan-out wafer level packages (FOWLPs) with reconfiguration technology have recently emerged as a new WLP technology. In FOWLP, warpage is one of the most critical issues since the thickness of FOWLP is thinner than traditional IC package and warpage of WLP is much larger than the die level package. Warpage affects the throughput and yield of the next manufacturing process as well as wafer handling and fabrication processability. In this study, we investigated the characteristics of warpage and main parameters which affect the warpage deformation of FOWLP using the finite element numerical simulation. In order to minimize the warpage, the characteristics of warpage for various epoxy mold compounds (EMCs) and carrier materials are investigated, and DOE optimization is also performed. In particular, warpage after EMC molding and after carrier detachment process were analyzed respectively. The simulation results indicate that the most influential factor on warpage is CTE of EMC after molding process. EMC material of low CTE and high Tg (glass transition temperature) will reduce the warpage. For carrier material, Alloy42 shows the lowest warpage. Therefore, considering the cost, oxidation and thermal conductivity, Alloy42 or SUS304 is recommend for a carrier material.

• Journal of the Korean Society of Industry Convergence
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• v.26 no.6_2
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• pp.1011-1017
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• 2023

In this study, the harmless crack size (a_hml) by double shot peening (DSP) using shot balls with different diameters was evaluated on carburized, quenched-tempered SCM822H steel. The minimum crack size (a_NDI) detectable by non-destructive inspection was also evaluated. The relationship between the crack size (a_25,50) that reduces the fatigue limit by 25% and 50% and a_hml was evaluated. The residual stress of DSP was greater in SP_(0.6+0.08) than SP_(0.8+0.08) and appeared deeper in the depth direction. In addition, the hardness below the surface appeared larger. The fatigue limit of DSP increased 2.07 times and 1.95 times compared to non-SP. All a_hml of the DSP specimen was determined at the depth (a). The compressive residual stress distribution affects a_hml, and the a_hml of SP_(0.6+0.08), which has a large compressive residual stress and a high fatigue limit, appeared large. a_hml of SP_(0.6+0.08) introduced deeper than the residual stress of SP_(0.8+0.08) is larger in the range of As=1.0-0.3. Since the residual stress in the thickness direction has a greater effect on a_hml than the residual stress at the surface, it is necessary to introduce it more deeply. The relation of a_hml, a_25,50, and a_NDI were evaluated in the point for safety and reliability.

• Design & Manufacturing
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• v.15 no.2
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• pp.11-16
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• 2021

Recently, three-dimensional (3D) cell culture systems, which are superior to conventional two-dimensional (2D) vascular systems that mimic the in vivo environment, are being actively studied to reproduce drug responses and cell differentiation in organisms. Conventional two-dimensional cell culture methods (scaffold-based and non-scaffold-based) have a limited cell growth rate because the culture cannot supply the culture medium as consistently as microvessels. To solve this problem, we would like to propose a 3D culture system with an environment similar to living cells by continuously supplying the culture medium to the bottom of the 3D cell support. The 3D culture system is a structure in which microvascular structures are combined under a scaffold (agar, collagen, etc.) where cells can settle and grow. First, we have manufactured molds for the formation of four types of microvessel-mimicking chips: width / height ①100 ㎛ / 100 ㎛, ②100 ㎛ / 50 ㎛, ③ 150 ㎛ / 100 ㎛, and ④ 200 ㎛ / 100 ㎛. By injection molding, four types of microfluidic chips were made with GPPS (general purpose polystyrene), and a 100㎛-thick PDMS (polydimethylsiloxane) film was attached to the top of each microfluidic chip. As a result of observing the flow of the culture medium in the microchannel, it was confirmed that when the aspect ratio (height/width) of the microchannel is 1.5 or more, the fluid flows from the inlet to the outlet without a backflow phenomenon. In addition, the culture efficiency experiments of colorectal cancer cells (SW490) were performed in a 3D culture system in which PDMS films with different pore diameters (1/25/45 ㎛) were combined on a microfluidic chip. As a result, it was found that the cell growth rate increased up to 1.3 times and the cell death rate decreased by 71% as a result of the 3D culture system having a hole membrane with a diameter of 10 ㎛ or more compared to the conventional commercial. Based on the results of this study, it is possible to expand and build various 3D cell culture systems that can maximize cell culture efficiency by cell type by adjusting the shape of the microchannel, the size of the film hole, and the flow rate of the inlet.