• The Research Journal of the Costume Culture
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• v.14 no.6
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• pp.1042-1055
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• 2006

The purpose of this study is to consider the formative characteristics of dance sports from such points of view as shapes, colors, material and decorations, and to examine artistic characteristics that are expressed through those elements. As a result, this study shows five artistic characteristics as follows; First, rhythmic characteristic is expressed with repeat of lines that is formed by pleats, shirring or gather, with duplication of ruffle's wave, with gradation of colors, with Moire-effect that is generated with overlap of see-through material, with glossy material that reflects lights to a great extent, with fringe. Second, bodily characteristic emphasizes the beauty of human bodies through direct or indirect body exposure by way of cut-and-open, see-throughness or close adhesion. Third, decorative characteristic is shown with beads, fringe, ruffle, embroidery, shirring, binding, or feather. Fourth, the beauty of female body is manifested to express eroticism, which is culminated by body exposure, body consciousness, use of illuminating or see-through material or colorful trimming. Finally, elegant characteristic is revealed through feminity, sophistication, and harmony that are expressed with black and white colors, see-through material, or bead trimmings.

• Journal of the Korean Society for Nondestructive Testing
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• v.26 no.6
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• pp.373-379
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• 2006

Vibration-based structural health monitoring is one of non-destructive evaluation (NDE) techniques for civil infrastructures. This paper presents a novel fiber optic accelerometer system to monitor civil engineering structures and a successful application of the novel sensor system for measuring ambient vibration of a real building structure. This sensor system integrates the Moire fringe phenomenon with fiber optics to achieve accurate and reliable measurements. The sensor system is immune to electromagnetic (EM) interference making it suitable for difficult applications in such environments involving strong EM fields, electrical spark-induced explosion risks, and cabling problems, prohibiting the use of conventional electromagnetic accelerometers. A prototype sensor system has been developed, together with a signal processing software. The experimental studies demonstrated the high-performance of the fiber optic sensor system. Especially, the sensor was successfully used for monitoring a real building on UCI (University of California Irvine, USA).

• Journal of the Korean Society for Precision Engineering
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• v.22 no.7 s.172
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• pp.88-93
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• 2005

$Moir\acute{e}$ topography method is a well-known non-contacting 3-D measurement method. Recently, the automatic 3-D measurement by $Moir\acute{e}$ topography has been required, since the method was frequently applied to the engineering and medical fields. The 3-D measurement using projection $Moir\acute{e}$ topography is very attractive because of its high measuring speed and high sensitivity. In this paper, using two-wavelength method of projection $Moir\acute{e}$ topography was tested to measuring object with $2\pi-ambiguity$ problems. The experimental results prove that the proposed scheme is capable of finding absolute fringe orders, so that the $2\pi-ambiguity$ problems can be effectively overcome so as to treat large step discontinuities in measured objects.

• Journal of the Microelectronics and Packaging Society
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• v.17 no.3
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• pp.17-26
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• 2010

Pb-Sn solder is rapidly being replaced by lead-free solder for board-level interconnection in microelectronic package assemblies due to the environmental protection requirement. There is a general lack of mechanical reliability information available on the lead-free solder. In this study, thermo-mechanical behaviors of wire-bond plastic ball grid array (WB-PBGA) package assemblies are characterized by high-sensitivity moire interferometry. Experiments are conducted for two types of WB-PBGA packages that have Pb-Sn solder and lead-free solder as joint interconnections. Using real-time moire setup, fringe patterns are recorded and analyzed for several temperatures. Bending deformations of the assemblies and average strains of the solder balls are investigated and compared for the two type of WB-PBGA package assemblies. Results show that shear strain in #3 solder ball located near the chip shadow boundary is dominant for the failure of the package with Pb-Sn solder, while normal strain in #7 most outer solder ball is dominant for that with lead-free solder. It is also shown that the package with lead-free solder has much larger bending deformation and 10% larger maximum effective strain than the package with Pb-Sn solder at same temperature level.

• Korean Journal of Optics and Photonics
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• v.11 no.4
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• pp.232-238
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• 2000

The new collimation testing technique of a white light beam using vernier Moire fringes of two line or circular gratings with different pitches is presented. We can visually measure the defocusing ($\Deltaf$), the divergence angle ($\theta$), and the longitudinal chromatic aberration $(L_{ch})$ of a collimating lens by using the technique. For example, we obtained $\Deltaf$= 21.9 mm and $\theta=0.0038^{\circ}$ for a testing lens with the focallengthf = 120.0 mm and F-number of F/2.4. The longitudinal chromatic aberration $L_{ch}$ of another testing lens withf = 65.0 mm, F/1.6, and the Abbe number V = 64.1 for the incident wavelengths of $\lambda_1=480 nm and \lambda_2=640 nm$ is easily measured by same technique. It is found that the measured value $L_{ch}=1.59mm(\pm0.01mm)$ is well agreed with $L_{ch}=1.58mm(\pm0.01mm)$ obtained by the autofocus method.

• Journal of the Microelectronics and Packaging Society
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• v.10 no.4
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• pp.1-8
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• 2003

Thermo-mechanical behavior of a ceramic ball grid array (CBGA) package assembly are characterized by high sensitive moire interferometry. Moir fringe patterns are recorded and analyzed at various temperatures in a temperature cycle. Thermal-history dependent analyses of global and local deformations are presented, and bending deformation (warpage) of the package and shear strain in the rightmost solder ball are discussed. A significant non-linear global behavior is documented due to stress relaxation at high temperature. Analysis of the solder interconnections reveals that inelastic deformation accumulates on only eutectic solder fillet region at high temperatures.

• Proceedings of the Korean Society of Precision Engineering Conference
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• 2004.10a
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• pp.29-33
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• 2004

This paper presents ESPI system for the measurement of thermal expansion coefficient of STS430 up to 1,000$^{\circ}C$. Existing methods, strain gauge and moire have the limitation of contact to object and do not supply the coefficient up to 800$^{\circ}C$. There needs to measure the data up to 800$^{\circ}C$, because heat resistant materials have high melting temperature up to 1,000$^{\circ}C$. In previous studies related to thermal strain analysis, the quantitative results are not reported by ESPI at high temperature, yet. In-plane ESPI and vacuum chamber for the reduction of air turbulence and oxidation are designed for the measurement of the coefficient up to 1,000$^{\circ}C$and speckle correlation fringe pattern images are processed by commercial image filtering tool-smoothing, thinning and enhancement- to obtain quantitative results, which is compared with references data. The comparison shows two data are agreed within 4.1％ blow 600$^{\circ}C$ however, there is some difference up to 600$^{\circ}C$. Also, the incremental ratio of the coefficient is changed up to 800$^{\circ}C$. The reason is the phase transformation of STS430 probably begins at 800$^{\circ}C$.

• Proceedings of the Korean Society of Precision Engineering Conference
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• 2001.04a
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• pp.15-19
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• 2001

A dedicated reverse engineering(RE) system for rapid manufacturing of human head in a 3D bust has been developed. The first step in the process is to capture the surface details of a human head and shoulder by three scanners based upon the digital moire fringe technique. Then the multiple scans captured from different angles are aligned and merged into a single polygonal mesh, and the aligned data set is refined by smoothing, subdividing or hole filling process. Finally, the refined data set is sent to a 4-axis computer numerically control(NC) machine to manufacture a replica. In this paper, we mainly describe on the algorithms and software for aligning multiple data sets. The method is based on the recently popular Iterative Closest Point(ICP) algorithm that aligns different polygonal meshes into one common coordinate system. The ICP algorithm finds the nearest positions on one scan to a collection of points on the other scan by minimizing the collective distance between different scans. We also integrate some heuristics into the ICP to enhance the aligning process. A typical example is presented to validate the system and further research work is also discussed.

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.17 no.9
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• pp.994-1000
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• 2004

We studied the characteristics of annular phase gratings as spatial frequency filters. We first calculated the Fraunhofer diffraction patterns of annular gratings and then got the modulation transfer function (MTF) from the zeroth order Hankel transform of the intensity distribution function. Binaryphase annular grating shows higher diffraction efficiency than binary phase rectangular grating. But the MTF decreases linearly in the low-frequency region as that of rectangular grating does. The diffraction pattern of 4-phase annular grating is similar to that of 2-phase grating and hence MTFs of the two are much alike. For 8-phase annular grating, the 7th order diffracted beam is the lowest one next to the first. Consequently, the diffraction efficiency is very high and the MTF graph is curved upward. The diffracted beams except the first order are negligible and hence the MTF characteristics are more improved in the case of 16-phase grating. But the degree of improvement becomes lowered c(Impaled with 8-phase grating. We made a 16-phase annular grating and measured its MTF. The experimental result agrees well with the calculated one.

• Journal of the Korean Society for Precision Engineering
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• v.21 no.11
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• pp.69-74
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• 2004

This paper presents ESPI system for the measurement of thermal expansion coefficient of STS430 up to 1,00$0^{\circ}C$ . Existing methods, strain gauge and moire have the limitation of contact to object and do not supply the coefficient up to 80$0^{\circ}C$ . There needs to measure the data up to 80$0^{\circ}C$, because heat resistant materials have high melting temperature up to 1,000'E In previous studies related to thermal strain analysis, the quantitative results have not reported by ESPI at high temperature, yet. In-plane ESPI and vacuum chamber for the reduction of air turbulence and oxidation are designed for the measurement of the coefficient up to 1,00$0^{\circ}C$ and speckle correlation fringe pattern images are processed by commercial image filtering tool-smoothing, thinning and enhancement- to obtain quantitative results, which is compared with references data. The comparison shows two data are agreed within 4.1% blow $600^{\circ}C$ however, there is some difference up to $600^{\circ}C$. Also, the incremental ratio of the coefficient is changed up to 80$0^{\circ}C$ . The reason is the phase transformation of STS430 probably begins at 80$0^{\circ}C$