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Thermal Expansion Coefficient Measurement of STS430 at High Temperature by In-plane ESPI  

김경석 (조선대학교 기계정보공학과)
강기수 (조선대학교 대학원)
장호섭 (조선대학교 대학원)
Publication Information
Journal of the Korean Society for Precision Engineering / v.21, no.11, 2004 , pp. 69-74 More about this Journal
Abstract
This paper presents ESPI system for the measurement of thermal expansion coefficient of STS430 up to 1,00$0^{\circ}C$ . Existing methods, strain gauge and moire have the limitation of contact to object and do not supply the coefficient up to 80$0^{\circ}C$ . There needs to measure the data up to 80$0^{\circ}C$, because heat resistant materials have high melting temperature up to 1,000'E In previous studies related to thermal strain analysis, the quantitative results have not reported by ESPI at high temperature, yet. In-plane ESPI and vacuum chamber for the reduction of air turbulence and oxidation are designed for the measurement of the coefficient up to 1,00$0^{\circ}C$ and speckle correlation fringe pattern images are processed by commercial image filtering tool-smoothing, thinning and enhancement- to obtain quantitative results, which is compared with references data. The comparison shows two data are agreed within 4.1% blow $600^{\circ}C$ however, there is some difference up to $600^{\circ}C$. Also, the incremental ratio of the coefficient is changed up to 80$0^{\circ}C$ . The reason is the phase transformation of STS430 probably begins at 80$0^{\circ}C$
Keywords
Electronic Speckle Pattern Interferometry; ESPI; Thermal expansion coefficient; STS430; Non-contact measurement;
Citations & Related Records
Times Cited By KSCI : 2  (Citation Analysis)
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1 Moore, A.J. and Tyrer, J.R., 'An Electronic speckle pattern interferometry for complete in-plane displacement measurement,' Measurement science and technology, Vol. 1, pp. 1024-1030, 1990   DOI   ScienceOn
2 kang, Y.J., Bea, J.K., You, W.J., Park, N.K., 'A Study on Measurement of Crack Length by using Laser Speckle Interferometry,' Journal of the Korean Society of Precision Engineering, Vol. 18, No. 5, pp. 34-41, 2001   과학기술학회마을
3 Cloud, G.L., Optical Methods of Engineering Analysis, Cambridge University Press, pp.453-476, 1990
4 Malmo, J. T., Lokberg, O. J. and Slettemoen, G. A., 'Interferometric Testing at Very High Temperatures by TV Holography (ESPI)', Experimental Mechanics, Sept., pp.315-321,1987   DOI
5 Ratnam, M.M., Evans, W.T. and Tyrer, J.R., 'Measurement of thermal expansion of a piston using holographic and electronic speckle pattern interferometry,' Optical Engineering, Vol. 31, No. 1, pp. 61-69, 1992   DOI
6 Hack, Erwin and Bronnimann, Rolf, 'Electronic speckle pattern interferometry deformation measurement on lightweight structures under thermal load,' Optics and Lasers in Engineering, Vol. 31, pp.213-222, 1999   DOI   ScienceOn
7 Lokberg, O.J., 'ELECTRONIC SPECKLE PATTERN INTERFEROMETRY,' Physics in technology, No. 11, pp. 16-22, 1980   DOI   ScienceOn
8 Kim, I.K., Kim, K.S., Yoon, S.W., Kang, K.S., 'A Study on Vibration Characteristic of Thin Plate in Crack Propagation by Laser Holography Method,' Journal of the Korean Society of Precision Engineering, Vol. 17, No. 10, pp. 200-205, 2000   과학기술학회마을