• 한국소음진동공학회:학술대회논문집
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• 한국소음진동공학회 2005년도 추계학술대회논문집
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• pp.740-742
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• 2005

In the past, a mobile phone had only a function of communication. Recently, new functions such as an mp3 player and a camera are added in a mobile phone. For the application of a camera module to a mobile phone, the size of the camera module needs to become smaller than a general Digital Camera. Furthermore, it is also required that the performance of the camera module in a mobile phone be the same as that of a Digital Camera. In order to fulfill these requirements, the camera module should have functions such as Auto Focus, Zoom, the shutter and the aperture. Therefore, we introduce a simple and effective actuator and propose the shutter composed of solenoid.

• 한국마이크로전자및패키징학회:학술대회논문집
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• 한국마이크로전자및패키징학회 2006년도 ISMP 2006
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• pp.37-45
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• 2006

The mobile-phone which Camera was put on was released at the end of 2000 and dramatically puts up the deployment ratio because not only simple Camera but also a function that the photograph which I took is dispatched was added. It is the force that demand in this year presses 600,000,000 sale of a mobile-phone is estimated to be 960,000,000 of them in 2006, and to be able to include two errands with a support model after 3G. A person of entry to a camera-module appear much. In addition, the various kinds of products open markedly which a product comes to be known widely in the world, and the application range has opened widely, and considered QCDT come to be key issues for answer to market demand. By manufacturing industry, there is peculiar culture to each industry, camera-module is the composition the various industries. The construction of true Supply-chain becomes unavoidable to make a good product. I describe the point that the situation of each supply-chain and the direction for the future by the view point of module assembly maker.

• Journal of Mechanical Science and Technology
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• 제20권12호
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• pp.2087-2093
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• 2006

In this paper, auto focus actuator, which is used to move a lens module in the mobile phone having a camera module, is developed. Camera module containing auto focus actuator requires to minimize total size because of characteristics of the application area such as mobile phone, digital camera, and personal digital assistant. There are stepping motor, voice coil motor, and piezoelectric motor as auto focus actuator. In this paper, voice coil motor having new electromagnetic configuration is proposed. And actuator using proposed voice coil motor is developed by optimal design method using magnetic circuit analysis. The sectional area of the developed actuator is reduced to 32.4% compared with actuator using general electromagnetic configuration. From the performance test, the developed actuator has moving stroke of 0.64 mm for 2.1 volt, hysteresis of 40 $\mu$m, full stroke current of 54 mA, and unit step motion of 3 $\mu$m.

• 반도체디스플레이기술학회지
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• 제15권4호
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• pp.1-9
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• 2016

The warpage on mobile phone camera packages occurs due to the CTE(Coefficient of Thermal Expansion) mismatch between a thin silicon die and a substrate. The warpage in the optical instruments such as camera module has an effect on the field curvature, which is one of the factors degrading the optical performance and the product yield. In this paper, we studied the effect of die bonding epoxy on the package and optical performance of mobile phone camera packages. We calculated the warpages of camera module packages by using a finite element analysis, and their shapes were in good agreement showing parabolic curvature. We also measured the warpages and through-focus MTF of camera module specimens with experiments. The warpage was improved on an epoxy with low elastic modulus at both finite element analysis and experiment results, and the MTF performance increased accordingly. The results show that die bonding epoxy affects the warpage generated on the image sensor during the packaging process, and this warpage eventually affects the optical performance associated with the field curvature.

• 한국정밀공학회:학술대회논문집
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• 한국정밀공학회 2007년도 춘계학술대회 논문집
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• pp.109-110
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• 2007

• 한국인터넷방송통신학회논문지
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• 제12권5호
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• pp.99-105
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• 2012

스마트 폰 어플의 급속한 개발과 보급으로 우리는 일상생활에서 많은 유용한 모바일 서비스를 이용하는 것이 가능하게 되었으며, 특히 스마트 기기의 카메라 모듈을 이용한 QR 코드 응용과 같은 흥미로운 어플들이 지속적으로 개발되고 있다. 우리는 스마트 기기의 카메라 모듈을 이용하여 촬영되는 피사체의 실물 크기를 측정하는 어플을 개발하는 과정에서 국내에 시판되는 안드로이드 기반 스마트 폰들의 기종이나 시스템 버전에 따라 촬영되는 피사체의 이미지의 크기나 모양이 매우 상이하게 나타난다는 점을 알게 되었다. 본 논문에서는 스마트 기기들의 카메라 모듈로 촬영할 때 스마트 폰 기종과 시스템 버전에 따라 나타나는 차이점들을 면밀히 알아보고, 스마트 폰 카메라로 촬영한 결과 영상에서 피사체의 실물 크기에 영향을 미치는 카메라 모듈의 다양한 특징들을 비교 분석하여, 이를 바탕으로 스마트 폰 카메라 모듈을 이용한 피사체 크기 계측 어플을 개발하는데 응용하고자 한다.

• 한국정밀공학회:학술대회논문집
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• 한국정밀공학회 2008년도 추계학술대회 논문집
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• pp.673-674
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• 2008

• Elastomers and Composites
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• 제44권4호
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• pp.366-372
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• 2009

본 연구에서는 휴대폰 카메라용 렌즈모듈의 구조를 최적화하기 위한 연구를 수행하고자 한다. 휴대폰 카메라용 렌즈모듈의 안정적인 작동을 위해 경통부와 외장부간 결합력의 적절한 유지가 필요한데, 본 연구에서는 유한요소해석을 사용하여 적절한 결합력 유지를 위한 나사 간섭부 설계변수의 영향에 대해 고찰하였다. 또한 실험계획법을 적용하여 렌즈모듈 설계변수 최적화를 위한 연구를 수행하고, 실험계획법 결과에 대한 통계적인 분석을 통해 최적 조건을 선정하여 결합토크의 크기를 원하는 범위 내로 유지하고 동시에 산포를 감소시킴으로써 제품품질 향상에 기여하고자 한다.

• 한국마이크로전자및패키징학회:학술대회논문집
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• 한국마이크로전자및패키징학회 2006년도 ISMP 2006
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• pp.1-20
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• 2006

• Journal of the Optical Society of Korea
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• 제10권3호
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• pp.124-129
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• 2006

We have developed a compact and cost-effective camera module on the basis of wafer-scale-replica processing. A multiple-layered structure of several aspheric lenses in a mobile-phone camera module is first assembled by bonding multiple glass-wafers on which 2-dimensional replica arrays of identical aspheric lenses are UV-embossed, followed by dicing the stacked wafers and packaging them with image sensor chips. This wafer-scale processing leads to at least 95% yield in mass-production, and potentially to a very slim phone with camera-module less than 2 mm in thickness. We have demonstrated a VGA camera module fabricated by the wafer-scale-replica processing with various UV-curable polymers having refractive indices between 1.4 and 1.6, and with three different glass-wafers of which both surfaces are embossed as aspheric lenses having $230{\mu}m$ sag-height and aspheric-coefficients of lens polynomials up to tenth-order. We have found that precise compensation in material shrinkage of the polymer materials is one of the most technical challenges, in orderto achieve a higher resolution in wafer-scaled lenses for mobile-phone camera modules.