• Title/Summary/Keyword: Mobile phone camera module

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Camera Module Actuator and Electromechanical Shutter for Mobile Phone (휴대폰용 카메라 모듈 구동기 및 셔터)

  • Jung, Jae-Hyun;Lee, Kyung-Taek;Lee, Jong-Jin;Lee, Man-Hyung;Hong, Sam-Nyol;Ko, Eui-Seok
    • Proceedings of the Korean Society for Noise and Vibration Engineering Conference
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    • 2005.11a
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    • pp.740-742
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    • 2005
  • In the past, a mobile phone had only a function of communication. Recently, new functions such as an mp3 player and a camera are added in a mobile phone. For the application of a camera module to a mobile phone, the size of the camera module needs to become smaller than a general Digital Camera. Furthermore, it is also required that the performance of the camera module in a mobile phone be the same as that of a Digital Camera. In order to fulfill these requirements, the camera module should have functions such as Auto Focus, Zoom, the shutter and the aperture. Therefore, we introduce a simple and effective actuator and propose the shutter composed of solenoid.

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Camera-Module for Mobile-Phone View Point from Module Assembly Maker

  • Muraishi, Hiroaki
    • Proceedings of the International Microelectronics And Packaging Society Conference
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    • 2006.10a
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    • pp.37-45
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    • 2006
  • The mobile-phone which Camera was put on was released at the end of 2000 and dramatically puts up the deployment ratio because not only simple Camera but also a function that the photograph which I took is dispatched was added. It is the force that demand in this year presses 600,000,000 sale of a mobile-phone is estimated to be 960,000,000 of them in 2006, and to be able to include two errands with a support model after 3G. A person of entry to a camera-module appear much. In addition, the various kinds of products open markedly which a product comes to be known widely in the world, and the application range has opened widely, and considered QCDT come to be key issues for answer to market demand. By manufacturing industry, there is peculiar culture to each industry, camera-module is the composition the various industries. The construction of true Supply-chain becomes unavoidable to make a good product. I describe the point that the situation of each supply-chain and the direction for the future by the view point of module assembly maker.

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Development of Compact Auto Focus Actuator for Camera Phone by Applying New Electromagnetic Configuration

  • Chung, Myung-Jin;Son, Sung-Yong
    • Journal of Mechanical Science and Technology
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    • v.20 no.12
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    • pp.2087-2093
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    • 2006
  • In this paper, auto focus actuator, which is used to move a lens module in the mobile phone having a camera module, is developed. Camera module containing auto focus actuator requires to minimize total size because of characteristics of the application area such as mobile phone, digital camera, and personal digital assistant. There are stepping motor, voice coil motor, and piezoelectric motor as auto focus actuator. In this paper, voice coil motor having new electromagnetic configuration is proposed. And actuator using proposed voice coil motor is developed by optimal design method using magnetic circuit analysis. The sectional area of the developed actuator is reduced to 32.4% compared with actuator using general electromagnetic configuration. From the performance test, the developed actuator has moving stroke of 0.64 mm for 2.1 volt, hysteresis of 40 $\mu$m, full stroke current of 54 mA, and unit step motion of 3 $\mu$m.

Effect of Die Bonding Epoxy on the Warpage and Optical Performance of Mobile Phone Camera Packages (모바일 폰 카메라 패키지의 다이 본딩 에폭시가 Warpage와 광학성능에 미치는 영향 분석)

  • Son, Sukwoo;Kihm, Hagyong;Yang, Ho Soon
    • Journal of the Semiconductor & Display Technology
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    • v.15 no.4
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    • pp.1-9
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    • 2016
  • The warpage on mobile phone camera packages occurs due to the CTE(Coefficient of Thermal Expansion) mismatch between a thin silicon die and a substrate. The warpage in the optical instruments such as camera module has an effect on the field curvature, which is one of the factors degrading the optical performance and the product yield. In this paper, we studied the effect of die bonding epoxy on the package and optical performance of mobile phone camera packages. We calculated the warpages of camera module packages by using a finite element analysis, and their shapes were in good agreement showing parabolic curvature. We also measured the warpages and through-focus MTF of camera module specimens with experiments. The warpage was improved on an epoxy with low elastic modulus at both finite element analysis and experiment results, and the MTF performance increased accordingly. The results show that die bonding epoxy affects the warpage generated on the image sensor during the packaging process, and this warpage eventually affects the optical performance associated with the field curvature.

A Study on Characteristics of Smart Phone Camera Module for Measuring a Shooting Object (피사체 계측을 위한 스마트 폰 카메라 모듈 특성 연구)

  • Oh, Sun-Jin
    • The Journal of the Institute of Internet, Broadcasting and Communication
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    • v.12 no.5
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    • pp.99-105
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    • 2012
  • With the rapid development and diffusion of smart phone applications, mobile users are able to use various useful mobile services in humdrum life. Especially, interesting applications like QR code using camera module in a smart phone are developed continuously nowadays. We realized that the size and shape of shooting objects taken by a smart phone camera module are very different according to their types and versions of the android-based smart phone in the process of developing applications for measuring the shooting object using camera module of a smart phone. In this paper, we investigate the major differences among smart phone types and system versions when we take specific object with camera module of smart phones, analyze the various characteristics of camera modules that influencing the real size of the shooting object taken by a smart phone, and apply them to the development of the smart camruler application.

Improvement of Assembly Characteristics of a Lens Module in a Mobile Phone Camera using Finite Element Analysis (유한요소해석을 사용한 휴대폰 카메라용 렌즈모듈의 결합특성 개선)

  • Moon, Yang-Ho;Moon, Jae-Ho;Lyu, Min-Young;Park, Keun
    • Elastomers and Composites
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    • v.44 no.4
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    • pp.366-372
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    • 2009
  • The present study covers the optimal design for a lens module in a mobile phone camera by using the design of experiments (DOE) and finite element (FE) analysis. FE analyses are performed to investigate the effect of design parameters on the amount of torque required to assemble a barrel and a housing part. The DOE approach is then performed to optimize the design parameters in order to maintain an appropriate torque with less variations.

Camera Imaging Lens Fabrication using Wafer-Scale UV Embossing Process

  • Jeong, Ho-Seop;Kim, Sung-Hwa;Shin, Dong-Ik;Lee, Seok-Cheon;Jin, Young-Su;Noh, Jung-Eun;Oh, Hye-Ran;Lee, Ki-Un;Song, Seok-Ho;Park, Woo-Je
    • Journal of the Optical Society of Korea
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    • v.10 no.3
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    • pp.124-129
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    • 2006
  • We have developed a compact and cost-effective camera module on the basis of wafer-scale-replica processing. A multiple-layered structure of several aspheric lenses in a mobile-phone camera module is first assembled by bonding multiple glass-wafers on which 2-dimensional replica arrays of identical aspheric lenses are UV-embossed, followed by dicing the stacked wafers and packaging them with image sensor chips. This wafer-scale processing leads to at least 95% yield in mass-production, and potentially to a very slim phone with camera-module less than 2 mm in thickness. We have demonstrated a VGA camera module fabricated by the wafer-scale-replica processing with various UV-curable polymers having refractive indices between 1.4 and 1.6, and with three different glass-wafers of which both surfaces are embossed as aspheric lenses having $230{\mu}m$ sag-height and aspheric-coefficients of lens polynomials up to tenth-order. We have found that precise compensation in material shrinkage of the polymer materials is one of the most technical challenges, in orderto achieve a higher resolution in wafer-scaled lenses for mobile-phone camera modules.