• 대한기계학회논문집
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• 제16권12호
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• pp.2279-2286
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• 1992

본 연구에서는 절삭가공만으로 실리콘 석출을 위한 경면가공을 얻기위한 최적 의 조건을 찾고자 한다.

• 한국결정성장학회지
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• 제10권5호
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• pp.350-355
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• 2000

수평 Bridgeman방식으로 성장된 C축 방향의 사파이어 결정기판을 연마 가공하였으며, 또한 유기금속 기상화학 증착 방법으로 사파이어 기판 위에 GaN 박막을 증착하였다. 사파이어 인고트를 성장하여 2인치 사파이어 기판으로 이용하였으며 웨이퍼 절편장치 및 연마장치를 개발하였다. 이러한 다단계의 연마 가공은 기판 표면을 경면화하였다. 표면 평탄도 및 조도는 원자힘현미경으로 측정하였다. 개발된 사파이어 기판위에 성장된 GaN 박막의 특성 및 청색광소자로의 응용 가능성을 확인하였다.

• 대한전기학회:학술대회논문집
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• 대한전기학회 2006년도 제37회 하계학술대회 논문집 C
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• pp.1313-1314
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• 2006

The polycrystalline 3C-SiC thin films heteroepitaxially grown by LPCVD method using single precursor 1,3-disilabutane at $850^{\circ}C$. The crystallinity of the 3C-SiC thin film was analyzed by XRD and FT-IR. Residual strain was investigated by Raman scattering. The surface morphology was also observed by AFM and voids or dislocations between SiC and $SiO_2$ were measured by SEM. The grown poly 3C-SiC thin film is very good crystalline quality, surface like mirror, and low defect and strain. Therefore, the polycrystalline 3C-SiC is suitable for harsh environment MEMS applications.

• 한국전기전자재료학회:학술대회논문집
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• 한국전기전자재료학회 2006년도 하계학술대회 논문집 Vol.7
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• pp.408-409
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• 2006

The polycrystalline 3C-SiC thin films heteroepitaxially grown by LPCVD method using single precursor 1. 3-disilabutane at $850^{\circ}C$. The crystallinity of the 3C-SiC thin film. was analyzed by XPS. Residual strain was investigated by Raman scattering. The surface morphology and voids between SiC and $SiO_2$ were measured by SEM. The grown poly 3C-SiC thin film is very good crystalline quality, surface like mirror, and low defect and strain. Therefore, the polycrystalline 3C-SiC is suitable for harsh environment MEMS applications.

• 한국정밀공학회지
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• 제20권5호
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• pp.218-224
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• 2003

This paper describes a novel MEMS integration technique on a CMOS chip. MEMS integration on CMOS circuit has many advantages in view of manufacturing cost and reliability. The surface topography of a CMOS chip from a commercial foundry has 0.9 ${\mu}{\textrm}{m}$ bumps due to the conformal coating on aluminum interconnect patterns, which are used for addressing each MEMS element individually. Therefore, it is necessary to achieve a flat mirror-like CMOS chip fer the microelectromechanical system (MEMS) such as micro mirror array. Such CMOS chip needs an additional thickness of the dielectric passivation layer to ease the subsequent planarization process. To overcome a temperature limit from the aluminum thermal degradation, this study uses RF sputtering of silicon nitride at low temperature and then polishes the CMOS chip together with the surrounding dummy pieces to define a polishing plane. Planarization reduces 0.9 ${\mu}{\textrm}{m}$ of the bumps to less than 25 nm.

• 한국정밀공학회지
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• 제29권8호
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• pp.834-839
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• 2012

Recently, mechanical components with miniaturized size, complex shape and fine surface are on demand from industries such as mobile electronics, medical devices and defense. The size of them is smaller than several millimeters, the shape has micro-holes, curve, or multi-step and the surface is mirror-like. This features are not able to be machined with the conventional machining, therefore electro-discharge machining (EDM), cutting, and laser machining have been applied. If the technologies are assisted by vibration, high aspect ratio and good surface are to be achieved. In this paper, prior and current researches of vibration-assisted machining are reviewed. Machining mechanisms with vibration-assisting are explained, their effects are shown, and vibrating apparatuses are discussed. Especially, comparison between with and without vibration assisting is presented. This review shows the vibration-assisted machining is effectively fabricate the components with small and complicated shape and fine surface finish.

• 한국정밀공학회지
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• 제13권11호
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• pp.64-72
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• 1996

This paper is aimed to develop an optical method for measuring 3-dimensional shapes of specular objects having curved surfaces. The existing methods measuring the shapes of specular objects have several common disadvantages: they may not work properly if the surface is highly specular like mirror surface or if the reflectance property is not uniform over the surface. And, they often require the a priori knowledege about the surface reflectance. To overcome these disadvantages, the measurement using double pass retroreflection method is proposed in this paper. For this measurement principle, an experimental measuring system is designed and prepared which is composed of a galvanometer scanner, a beam splitter, a laser source, a CCD camera, and a reflector made of retroreflective material. To verify the effectiveness of the measurement system a series of experiments are performaed for various specular objects. The results observed from the experiments show that the developed optical sensing system can be an effective mean of measuring the 3-D shapes of specular objects.

• 대한전자공학회논문지SD
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• 제41권1호
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• pp.35-46
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• 2004

Vertical-Cavity Surface-Emitting Laser(VCSEL)는 짧은 공진기(cavity)와 여러 층의 distributed Bragg reflector(DBR)층을 거울로 사용하기 때문에, edge-emitting lasers(EELs)와는 달리, 광출력 및 변환효율 등의 예측이 쉽지 않다. 그 주된 원인은 VCSEL에서는 Fabry-Perot 레이저와는 달리, 각각의 DBR 거울 층들이 손실을 가지고 있기 때문으로 이에 따라 상/하향광출력 비나 변환효율을 계산해 내는 데에 어려움이 있다. 그러나 전달 행렬 방법(transfer matrix method, TMM)을 이용하면, VCSEL과 같은 여러 층을 갖는 구조에서의 성능 지수를 정확히 계산할 수 있다. 이 논문에서는 전달 행렬 방법을 이용하여 VCSEL의 구조 변화에 따른 문턱이득, 문턱전류 밀도 및 변환효율을 구하였으며 문턱전류 및 변환효율 모두를 고려한 VCSEL의 최적 구조 설계 기법을 제시하였다.

• 한국기계가공학회지
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• 제11권6호
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• pp.48-54
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• 2012

In recent years, developments in the semiconductor and electronic industries have brought a rapid increase in the use of large size silicon. However, for many companies, it is hard to produce 400mm or 450mm wafers, because of excesive funds for exchange the equipments. Therefore, it is necessary to investigate 300mm wafer to obtain a better efficiency and a good property rate. Polishing is one of the important methods in manufacturing of Si wafers and in thinning of completed device wafers. This research investigated the surface characteristics that apply variable machining conditions and Taguchi Method was used to obtain more flexible and optimal condition. In this study, the machining conditions have head speed, oscillation speed and polishing time. By using optimum condition, it achieves a ultra precision mirror like surface.

• 한국정밀공학회:학술대회논문집
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• 한국정밀공학회 1995년도 추계학술대회 논문집
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• pp.71-74
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• 1995

Diamond shaping is one of the machining strategies to make the optical micro-groove molds,and it is especially useful when rhe component is an assembly of the linear micro-groove array. A mirror-like surface and arbitrary crose-sectional curve can be easily made by diamond. Howerver, the cutting speed of shaping is relatively lower than that of the other cutting methods, and there exist an unstable cutting conditions that generate the chatter. This study is focused on the modeling of the simplified self-induced chatter of the diamond shapping. Form the chatter model and experiments, it is found that the unstable cutting conditions exist wwhen the depth of cut is low and cutting speed is high.