• Journal of the Korea Academia-Industrial cooperation Society
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• v.19 no.11
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• pp.1-7
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• 2018

In a microcolumn, a miniaturized electrostatic deflector is often adopted to scan an electron beam. Usually, a double octupole deflector is used because it can avoid excessive spherical aberrations by controlling the electron beam path close to the optical axis of the objective lens and has a wide scan field. Studies on microcolumns have been performed to improve the low throughput of an electron column through multiple column applications. On the other hand, as the number of microcolumns increases, the number of wires connected to the components of the microcolumn increases. This will result in practical problems during the process of connecting the wires to electronic controllers outside of the vacuum chamber. To reduce this problem, modified quadrupole and octupole deflectors were examined through simulation analysis by selecting an ultraminiaturized microcolumn with the Einzel lens eliminated. The modified deflectors were designed changing the size of each electrode of the conventional Si octupole deflector. The variations of the scan field and electric field strength were studied by changing the size of active electrodes to which the deflection voltage was to be applied. The scan field increased linearly with increasing deflection voltage. The scan field of the quadrupole deflector and the electric field strength at the center were calculated to be approximately 1.3 ~ 2.0 times larger than those of the octupole deflector depending on the electrode size.

• Proceedings of the International Microelectronics And Packaging Society Conference
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• 2004.09a
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• pp.233-241
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• 2004

A new alloy definition will be presented concerning increasing demands for the board level reliability of miniaturized interconnections. The damage mechanism for LFBGA components on different board finishes is not quite understood. Further demands from mobile phones are the drop test, characterizing interface performance of different package constructions in relation to decreased pad constructions and therefore interfaces. The paper discusses the characterization of interfaces based on SnPb, SnPbXYZ, SnAgCu and SnAgCuInNd ball materials and SnAgCuInNd as solder paste, the stability after accelerated tests and the description of modified interfaces strictly related to the assembly conditions, dissolution behavior of finishes on board side and the influence of intermetallic formation. The type of intermetallic as well as the quantity of intermetallics are observed, primaliry the hardness, E modules describing the ability of strain/stress compensation. First results of board level reliability are presented after TCT-40/+150. Improvement steps from the ball formulation will be discussed in conjunction to the implementation of lead free materials In order to optimize ball materials for area array devices accelareted aging conditions like TCTs were used to analyze the board level reliability of different ball materials for BGA, LFBGA, CSP, Flip Chip. The paper outlines lead-free ball analysis in comparison to conventional solder balls for BGA and chip size packages. The important points of interest are the description of processability related to existing ball attach procedures, requirements of interconnection properties and the knowledge gained the board level reliability. Both are the primary acceptance criteria for implementation. Knowledge about melting characteristic, surface tension depend on temperature and organic vehicles, wetting behavior, electrical conductivity, thermal conductivity, specific heat, mechanical strength, creep and relaxation properties, interactions to preferred finishes (minor impurities), intermetallic growth, content of IMC, brittleness depend on solved elements/IMC, fatigue resistance, damage mechanism, affinity against oxygen, reduction potential, decontamination efforts, endo-/exothermic reactions, diffusion properties related to finishes or bare materials, isothermal fatigue, thermo-cyclic fatigue, corrosion properties, lifetime prediction based on board level results, compatibility with rework/repair solders, rework temperatures of modified solders (Impurities, change in the melting point or range), compatibility to components and laminates.

• Proceedings of the International Microelectronics And Packaging Society Conference
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• 2004.09a
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• pp.211-219
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• 2004

A new alloy definition will be presented concerning increasing demands for the board level reliability of miniaturized interconnections. The damage mechanism for LFBGA components on different board finishes is not quite understood. Further demands from mobile phones are the drop test, characterizing interface performance of different package constructions in relation to decreased pad constructions and therefore interfaces. The paper discusses the characterization of interfaces based on SnPb, SnPbXYZ, SnAgCu and SnAgCuInNd ball materials and SnAgCuInNd as solder paste, the stability after accelerated tests and the description of modified interfaces stric시y related to the assembly conditions, dissolution behavior of finishes on board side and the influence of intermetallic formation. The type of intermetallic as well as the quantity of intermetallics are observed, primaliry the hardness, E modules describing the ability of strain/stress compensation. First results of board level reliability are presented after TCT-40/+150. Improvement steps from the ball formulation will be discussed in conjunction to the implementation of lead free materials. In order to optimize ball materials for area array devices accelareted aging conditions like TCTs were used to analyze the board level reliability of different ball materials for BGA, LFBGA, CSP, Flip Chip. The paper outlines lead-free ball analysis in comparison to conventional solder balls for BGA and chip size packages. The important points of interest are the description of processability related to existing ball attach procedures, requirements of interconnection properties and the knowledge gained the board level reliability. Both are the primary acceptance criteria for implementation. Knowledge about melting characteristic, surface tension depend on temperature and organic vehicles, wetting behavior, electrical conductivity, thermal conductivity, specific heat, mechanical strength, creep and relaxation properties, interactions to preferred finishes (minor impurities), intermetallic growth, content of IMC, brittleness depend on solved elements/IMC, fatigue resistance, damage mechanism, affinity against oxygen, reduction potential, decontamination efforts, endo-/exothermic reactions, diffusion properties related to finishes or bare materials, isothermal fatigue, thermo-cyclic fatigue, corrosion properties, lifetime prediction based on board level results, compatibility with rework/repair solders, rework temperatures of modified solders (Impurities, change in the melting point or range), compatibility to components and laminates.

• The Journal of Korean Institute of Electromagnetic Engineering and Science
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• v.24 no.3
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• pp.348-351
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• 2013

Recently, a brain imaging system with microwave devices has been proposed. The brain imaging system requires a small antenna which has ultra wide band(UWB) operating frequency bandwidth(0.5~2 GHz) and non-varying boresight of antenna over the frequency band. This paper proposes asymmetric corrugations on a tapered slot antenna (TSA) so that the size of the TSA is reduced by 14 % while 10 dB return loss bandwidth is satisfied over the operating frequency band from 0.5 GHz to 2 GHz. A miniaturized TSA with symmetric corrugations shows tilted boresight whilst frequency is getting lower; however, the proposed TSA with asymmetric corrugations maintains direction of boresight for different frequencies. This enhancements make an asymmetric corrugated TSA meet the requirement of the brain imaing system.

• The Journal of the Institute of Internet, Broadcasting and Communication
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• v.16 no.4
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• pp.27-30
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• 2016

in this paper, to improve the narrow bandwidth problem of the microstrip antenna for WLAN and WiFi dual band array antenna was designed to satisfy the bandwidth of 3.6GHz and 5.2GHz it contained with IEEE 802. 11. The substrate of proposed microstrip array antenna is FR-4(er=4.3) and $25mm{\times}45mm{\times}0.8mm$ size and thickness t=0.035mm, and the simulation was used for CST Microwave Studio 2014. input return loss compared -10dB less than operates at and when gain 3.6GHz 2.516dB, 5.2GHz showed the results of 3.581dB. the antenna designed to be miniaturized and the be used in electronic devices such as mobile phone.

• The Journal of Korean Institute of Electromagnetic Engineering and Science
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• v.29 no.5
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• pp.397-400
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• 2018

This paper presents a miniaturized 65 nm CMOS 30~46 GHz wideband amplifier. To minimize the chip area, coupled inductors are used in the matching networks. The measurement shows that the fabricated amplifier exhibits 9.3 dB of peak gain, 16 GHz of 3 dB bandwidth, and 42 % fractional bandwidth. The measured input and output return losses were more than 10 dB at 35.8~46.0 GHz and 28.6~37.8 GHz, respectively. The chip consumes 42 mW at 1.2 V. The measured group delay variation is 19.1 ps within the 3 dB bandwidth and the chip size excluding the pads is $0.09mm^2$.

• Journal of the Korea Institute of Information and Communication Engineering
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• v.17 no.9
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• pp.1996-2002
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• 2013

In this paper, a design method for a compact broadband planar monopole antenna fed by a coplanar waveguide (CPW) is studied. The proposed broadband monopole is optimized for terrestrial digital television (DTV) reception. In order to achieve broadband characteristics, the monopole and ground conductor are gradually tapered. By loading slit pairs on both monopole and ground plane, the proposed antenna is miniaturized. The monopole is fed by a CPW with 75-ohm characteristic impedance on an FR4 substrate and its size is $100mm{\times}200mm$. The optimized monopole antenna for DTV band (470-806 MHz) is fabricated on an FR4 substrate and tested experimentally to verify the results of this study.

• The Journal of The Korea Institute of Intelligent Transport Systems
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• v.16 no.2
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• pp.171-179
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• 2017

In this paper, microstrip antenna using multi-layer and folded structure for GPS application is presented for aircraft loading. Existing microstrip patch antenna used dielectric of high specific inductive capacity to miniaturize that cause smaller bandwidth and decline of efficiency due to dielectric loss. To compensate the existing flaws, Rogers TMM 10i(dielectric constant=9.8, loss tangent=0.002) is used for multi-layer dielectric miniaturization, and we construct folded radiating element on the surface of the dielectric applying perturbation effect. The antenna is designed in the bandwidth of GPS $L_1$ band, and the size of the antenna's radiating element is $20.3mm{\times}19.93mm$, and it gets 94.2% miniaturized characteristic of basic ${\lambda}/2$ microstrip patch antenna. Also the measured -10 dB bandwidth is 32.3 MHz(2.05%), 3 dB axial ratio bandwidth is 6.7 MHz(0.43%). Measured radiation patterns was maximum gain of 0.56 dBi at x axis polarization, 1.23 dBi at y axis polarization.

• Journal of the Korea Institute of Information and Communication Engineering
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• v.21 no.1
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• pp.1-7
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• 2017

In this paper, a design method for a compact stepped open slot antenna for an operation in the UWB band is studied. The proposed antenna is miniaturized by inserting L-shaped slots on the ground plane of the stepped open slot antenna through the creation of a resonance in the low frequency, and a strip director is appended to the antenna in order to increase the gain in the middle and high frequency regions. The effects of varying the length of the L-shaped slots, the distance between the director and the slot antenna, and the director length on input reflection coefficient and realized gain characteristics of the proposed antenna are analyzed. The optimized antenna with the size of $30mm{\times}30mm$ is fabricated on an FR4 substrate, and the experiment results show that the antenna has a frequency band of 3.02-11.04 GHz for a VSWR < 2, which assures the operation in the UWB band.

• The Journal of The Korea Institute of Intelligent Transport Systems
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• v.9 no.6
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• pp.105-112
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• 2010

Recently, wireless communication systems have been developed and the circuits which operate with the broad-band for multiband uses were introduced. However, broad-band circuits have problems that inevitably increase the size. Dual-band circuit operates only two frequency, therefore, it will be able to miniaturize through unnecessary decreased elements. The Wilkinson power divider is the one of the most commonly used components in wireless communication system for power division. Nowaday, the Wilkinson power divider is also demanded dual-band. In this paper, I propose miniaturized dual-band Wilkinson power divider operating at 2.45 GHz and 5.2 GHz for IEEE 802.11n standard. Proposed dual-band Wilkinson power divider is used in parallel stub line. The design is accomplished by transforming the electrical length and impedance of the quarter wave sections of the conventional Wilkinson power divider into dual band ${\pi}$-shaped sections.