• 제목/요약/키워드: Miniaturization/High Efficiency

검색결과 56건 처리시간 0.027초

극 수와 슬롯 수 조합에 따른 집중권 방식 매입형 영구자석 동기전동기의 Normal Forces 및 설계 파라미터의 비교에 관한 연구 (A Study on Comparison of Normal Force and Design Parameters in IPMSM(Interior Permanent Magnet Synchronous Motor) with Concentrated Winding according to Pole-Slot Combinations)

  • 하승형;권순오;반지형;정재우;홍정표
    • 대한전기학회:학술대회논문집
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    • 대한전기학회 2006년도 제37회 하계학술대회 논문집 B
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    • pp.765-766
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    • 2006
  • Interior Permanent Magnet Synchronous Motor(IPMSM) have many advantages such as high power density, wide speed range and so on. With the IPMSM, miniaturization and energy efficient design can be achieved in comparison with Surface Permanent Magnet Synchronous Motor(SPMSM). In order to secure miniaturization and manufacturing efficiency of the motor, it has concentrated winding, because concentrated winding can reduce the motor volume and make manufacturing to be simple compared with the distributed winding. However, according to the pole-slot combinations motor parameters can be changed and unexpected normal force can be generated. Especially, unbalanced normal force in airgap can cause serious vibration and acoustic problem. Accordingly, in this paper, normal force and parameters variation of concentrated winding IPMSM are investigated according to the pole-slot combinations.

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감마선 영상화 장치용 경량 고효율 차폐체 최적설계에 관한 연구 (A study on the optimization of light weight high efficiency shield for gamma-ray imaging detector)

  • 박강택;이남호;황영관
    • 한국정보통신학회:학술대회논문집
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    • 한국정보통신학회 2016년도 춘계학술대회
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    • pp.773-774
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    • 2016
  • 본 논문에서는 감마선원 영상화를 위한 감마선 탐지장치에 적용할 차폐체의 경량, 소형화 연구를 수행하였다. 선행 연구를 통해 상용 감마선 영상화 장치의 차폐체와 유사한 차폐효율 및 성능을 나타내는 납 기반의 차폐체를 구현하였으며, 본 논문에서는 납 기반의 차폐체보다 경량화, 소형화를 위해 텅스텐기반의 차폐체를 설계하였다. 차폐체 설계를 위해서 MCNP 전산모사를 수행하였으며, 그 결과 17%의 경량화 및 51%의 체적을 줄이는 결과를 얻었다.

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우수한 기계적 특성과 형상치수 확보를 위한 정밀 압출기술개발 (The Precise Extrusion-Technical Development to Get Excellent Mechanical-property and Accurate Shape- Dimension)

  • 이현철;이광식;오개희;박상우
    • 한국철도학회:학술대회논문집
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    • 한국철도학회 2009년도 춘계학술대회 논문집 특별세미나,특별/일반세션
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    • pp.311-320
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    • 2009
  • Most advanced countries are researching to apply light weight materials far rolling stock because weight reduction for railway body derives cost-saving, energy-saving, and high-speed. Likewise, current Korea rolling stock field makes arduous effects of weight-reduction, miniaturization, and high-efficiency to achieve a high-speed railway. Aluminum becomes suitable material for these projects because it is much lighter than steel or stainless. Manufacturing the railway car body by using the Aluminum is increasing because Aluminum is not bringing the corrosion by unique oxidation-passivate. Aluminum extrusion profile far railway body requires a high mechanical property, accurate shape dimension, and stable quality because the railway body is composed with many different kinds of extruded profiles. Therefore, it is necessary to research about Aluminum precision-extrusion technology to maintain exit temperature and die load. The goal of this project is applying the Aluminum extrusion profile to next-generation railway car body by developing the Aluminum extrusion profile according to precision-extrusion technology which may maintain isothermal exit temperature.

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SiC Based Single Chip Programmable AC to DC Power Converter

  • Pratap, Rajendra;Agarwal, Vineeta;Ravindra, Kumar Singh
    • JSTS:Journal of Semiconductor Technology and Science
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    • 제14권6호
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    • pp.697-705
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    • 2014
  • A single chip Programmable AC to DC Power Converter, consisting of wide band gap SiC MOSFET and SiC diodes, has been proposed which converts high frequency ac voltage to a conditioned dc output voltage at user defined given power level. The converter has high conversion efficiency because of negligible reverse recovery current in SiC diode and SiC MOSFET. High frequency operation reduces the need of bigger size inductor. Lead inductors are enough to maintain current continuity. A complete electrical analysis, die area estimation and thermal analysis of the converter has been presented. It has been found that settling time and peak overshoot voltage across the device has reduced significantly when SiC devices are used with respect to Si devices. Reduction in peak overshoot also increases the converter efficiency. The total package substrate dimension of the converter circuit is only $5mm{\times}5mm$. Thermal analysis performed in the paper shows that these devices would be very useful for use as miniaturized power converters for load currents of up to 5-7 amp, keeping the package thermal conductivity limitation in mind. The converter is ideal for voltage requirements for sub-5 V level power supplies for high temperatures and space electronics systems.

H 형태 공진기를 이용한 소형화된 HTS 안테나의 제작 및 특성 해석 (Fabrication and Characterization of Miniaturized HTS Microstrip Antennas Using "H"-type Resonator)

  • 정동철;윤창훈;황종선;최창주
    • 대한전기학회논문지:전기물성ㆍ응용부문C
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    • 제52권7호
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    • pp.282-287
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    • 2003
  • ″H″ type resonator has the advantage for the miniaturization of high-T7 superconducting (HTS) microstrip antenna in comparison with the conventional microstrip antenna such as rectangular type or circular type. In this paper we designed miniaturized HTS antennas using this "H"-type resonator and reported the characteristics of our antennas including return loss, bandwidth, radiation patterns, efficiency and so on. To fabricate the "H" type antenna, HTS YBa$_2$Cu$_3$$O_{7-x}$ (YBCO) thin films were deposited on MgO substrates using rf-magnetron sputtering. For comparison between normal conducting antennas and superconducting antennas, the gold antennas with the same dimension were also fabricated. An aperture coupling was used for impedance matching between 50 $\Omega$ feed line and HTS radiating patch. The ″H" type superconducting antenna showed the performance of 1.38 in SWR, 26 % in efficiency, and 13.8 dB in the return loss superior to the normal conducting counterpart.

3D 웨이퍼 전자접합을 위한 관통 비아홀의 충전 기술 동향 (Technical Trend of TSV(Through Silicon Via) Filling for 3D Wafer Electric Packaging)

  • 고영기;고용호;방정환;이창우
    • Journal of Welding and Joining
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    • 제32권3호
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    • pp.19-26
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    • 2014
  • Through Silicon Via (TSV) technology is the shortest interconnection technology which is compared with conventional wire bonding interconnection technology. Recently, this technology has been also noticed for the miniaturization of electronic devices, multi-functional and high performance. The short interconnection length of TSV achieve can implement a high density and power efficiency. Among the TSV technology, TSV filling process is important technology because the cost of TSV technology is depended on the filling process time and reliability. Various filling methods have been developed like as Cu electroplating method, molten solder insert method and Ti/W deposition method. In this paper, various TSV filling methods were introduced and each filling materials were discussed.

Experimental Investigation of Laser Spot Welding of Ni and Au-Sn-Ni Alloy

  • Lee, Dongkyoung
    • Journal of Welding and Joining
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    • 제35권2호
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    • pp.1-5
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    • 2017
  • Many microelectronic devices are miniaturizing the capacitance density and the size of the capacitor. Along with this miniaturization of electronic circuits, tantalum (Ta) capacitors have been on the market due to its large demands worldwide and advantages such as high volumetric efficiency, low temperature coefficient of capacitance, high stability and reliability. During a tantalum capacitor manufacturing process, arc welding has been used to weld base frame and sub frame. This arc welding may have limitations since the downsizing of the weldment depends on the size of welding electrode and the contact time may prevent from improving productivity. Therefore, to solve these problems, this study applies laser spot welding to weld nickel (Ni) and Au-Sn-Ni alloy using CW IR fiber laser with lap joint geometry. All laser parameters are fixed and the only control variable is laser irradiance time. Four different shapes, such as no melting upper workpiece, asymmetric spherical-shaped weldment, symmetric weldment, and, excessive weldment, are observed. This shape may be due to different temperature distribution and flow pattern during the laser spot cutting.

인버터방식의 고전압 발생장치를 이용한 의료용 X선 기기의 특성평가 (Characteristic Evaluation of Medical X-Ray Using High-Voltage Generator with Inverter System)

  • 김영표;천민우;박용필
    • 한국전기전자재료학회논문지
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    • 제24권1호
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    • pp.36-41
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    • 2011
  • Medical X-ray has been brought many changes according to the rapid development of high technology. Especially, for high-voltage generator which is the most important in X-ray generation the traditional way is to use high-voltage electric transformers primarily. However, since it is large and heavy and the ripple rate of DC high-voltage applied to X-ray tube is too big, it has a disadvantage of low X-ray production efficiency. To solve these problems, the studies about high-voltage power supply are now proceeding. At present, the high-voltage generator that generates high-voltage by making high frequency using inverter control circuit consisting of semiconductor device is mainly used. High-voltage generator using inverter has advantages in the diagnosis using X-ray including high performance with short-term use, miniaturization of power supply and ripple reduction. In this study, the X-ray high-voltage device with inverter type using pulse width modulation scheme to the control of tube voltage and tube current was designed and produced. For performance evaluation of produced device, the control signal analysis, irradiation dose change and beam quality depending on the load variation of tube voltage and tube current were evaluated.

고효율 및 높은 격리 특성을 갖는 Ka 대역 도파관 결합기 설계 및 제작 (Design and Fabrication of Ka-band Waveguide Combiner with High Efficiency and High Isolation Characteristics)

  • 김효철;조흥래;이주흔;이덕재;안세환;이만희;주지한;김홍락
    • 한국인터넷방송통신학회논문지
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    • 제22권2호
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    • pp.35-42
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    • 2022
  • 본 논문에서는 SSPA(Solid state amplifier) 의 핵심 모듈인 결합기의 효율 및 격리 특성을 높이는 방법에 대해 연구하였다. 구체적으로 도파관 결합기에서 공용 포트와 격리 포트 정합을 이루어 격리도를 확보 하였다. 정합을 위한 매칭 구조는 원형 디스크 형태로 도파관 결합기 내부에서 음각으로 가공하게 된다. 구조는 매우 단순하여 안정적인 성능 확보가 가능하다. 그리고 이러한 구조는 이전 연구 대비 60배 이상의 높은 임계전력 성능을 보여 고출력에 적합함을 확인하였다. 그리고 1단의 T-junction과 2, 3단의 MagicT 결합기를 조합하여 소형화를 이루고, 삽입손실을 줄여 결합 효율을 최적화 하였다. 제작된 도파관 결합기는 16dB 이상의 격리도와 86.2% 의 결합 효율을 얻었다.

저주파/고주파와 냉자극을 이용한 의료용 조합 자극기의 설계 및 구현 (Design and Implementation of Medical Compound Stimulator Using Low/High Frequency and Cooling Stimulation)

  • 윤완오;강석엽;정진하;최상방
    • 대한의용생체공학회:의공학회지
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    • 제29권1호
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    • pp.82-87
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    • 2008
  • In this paper, the study was carried out to design and implement the medical compound stimulator based on the preexisting individual medical stimulators with Low frequency, High frequency and cooling stimulation. The proposed equipment is designed to compound all the functions including a cooling stimulation with a range of $0{\sim}20^{\circ}C$ and the verified low and high frequencies of 250Hz, 500Hz, 1KHz and 1MHz respectively from the previous clinical experiment with a consideration of its credibility and efficiency. Also, it was constructed by using a new technique, thermoelectricity semiconductor with a consideration of miniaturization and stability. In accordance with patients' treatment purpose, the hand piece of low frequency/cooling stimulation and High frequency/cooling stimulation were separately designed for convenience. The frequency, accuracy and other factors of implemented medical compound stimulator was satisfied according to its measurement. It was also tested by Korean Testing Laboratory (KTL) for its stability and efficacy and it confirmed that the medical compound stimulator is suitable for use as it fits in with the medical equipment standards.