• Title/Summary/Keyword: Microwave device

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UWB/Bluetooth for a High Speed Wireless Communication Network Dual Band Microstrip Antenna Design (해상 고속 무선 통신망을 위한 UWB/Bluetooth용 이중대역 마이크로스트립 안테나 설계)

  • Oh, Mal-Geun
    • Journal of the Korean Society of Marine Environment & Safety
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    • v.24 no.7
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    • pp.960-966
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    • 2018
  • Communication antennas used at sea have been developed remarkably. However, the speed of this development is insufficient when compared with user demands. Therefore, we developed an antenna for UWB/Bluetooth that operates on 3 [GHz] and 5.72 [GHz] bands in order to use the high-speed communication network system which improved antenna miniaturization, gain and radiation patterns. To improve bandwidth, a microstrip patch antenna was selected and CST Microwave Studio 2014 program was used. Through the program, we calculated the slot width, length, transmission line width, etc. using a theoretical formula at each step. These figures were checked through simulation to see if they meet production standards. UWB for high-speed wireless communication for short-range communication at sea, Bluetooth for exchanging information at a short distance by connecting each device, and corresponding technology can be easily utilized.

Accuracy evaluation of microwave water surface current meter for measurement angles in middle flow condition (전자파표면유속계의 측정 각도에 따른 평수기 유속 측정 정확도 분석)

  • Son, Geunsoo;Kim, Dongsu;Kim, Kyungdong;Kim, Jongmin
    • Journal of Korea Water Resources Association
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    • v.53 no.1
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    • pp.15-27
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    • 2020
  • Streamflow discharge as a fundamental riverine quantity plays a crucial role in water resources management, thereby requiring accurate in-situ measurement. Recent advances in instrumentations for the streamflow discharge measurement has complemented or substituted classical devices and methods. Among various potential methods, surface current meter using microwave has increasingly begun to be applied not only for flood but also normal flow discharge measurement, remotely and safely enabling practitioners to measure flow velocity postulating indirect contact. With minimized field preparedness, this method facilitated and eased flood discharge measurement in the difficult in-situ conditions such as extreme flood in active ways emitting 24.125 GHz microwave without relying on natural lights. In South Korea, a rectangular shaped instrument named with Microwave Water Surface Current Meter (MWSCM) has been developed and commercially released around 2010, in which domestic agencies charging on streamflow observation shed lights on this approach regarding it as a potential substitute. Considering this brand-new device highlighted for efficient flow measurement, however, there has been few noticeable efforts in systematic and comprehensive evaluation of its performance in various measurement and riverine conditions that lead to lack in imminent and widely spreading usages in practices. This study attempted to evaluate the MWSCM in terms of instrumen's monitoring configuration particularly regarding tilt and yaw angle. In the middle of pointing the measurement spot in a given cross-section, the observation campaign inevitably poses accuracy issues related with different tilt and yaw angles of the instrument, which can be a conventionally major source of errors for this type of instrument. Focusing on the perspective of instrument configuration, the instrument was tested in a controlled outdoor river channel located in KICT River Experiment Center with a fixed flow condition of around 1 m/s flow speed with steady flow supply, 6 m of channel width, and less than 1 m of shallow flow depth, where the detailed velocity measurements with SonTek micro-ADV was used for validation. As results, less than 15 degree in tilting angle generated much higher deviation, and higher yawing angle proportionally increased coefficient of variance. Yaw angles affected accuracy in terms of measurement area.

DC and RF Characteristics of 100-nm mHEMT Devices Fabricated with a Two-Step Gate Recess (2단계 게이트 리세스 방법으로 제작한 100 nm mHEMT 소자의 DC 및 RF 특성)

  • Yoon, Hyung Sup;Min, Byoung-Gue;Chang, Sung-Jae;Jung, Hyun-Wook;Lee, Jong Min;Kim, Seong-Il;Chang, Woo-Jin;Kang, Dong Min;Lim, Jong Won;Kim, Wansik;Jung, Jooyong;Kim, Jongpil;Seo, Mihui;Kim, Sosu
    • The Journal of Korean Institute of Electromagnetic Engineering and Science
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    • v.30 no.4
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    • pp.282-285
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    • 2019
  • A 100-nm gate-length metamorphic high electron mobility transistor(mHEMT) with a T-shaped gate was fabricated using a two-step gate recess and characterized for DC and microwave performance. The mHEMT device exhibited DC output characteristics having drain current($I_{dss}$), an extrinsic transconductance($g_m$) of 1,090 mS/mm and a threshold voltage($V_{th}$) of -0.65 V. The $f_T$ and $f_{max}$ obtained for the 100-nm mHEMT device were 190 and 260 GHz, respectively. The developed mHEMT will be applied in fabricating W-band monolithic microwave integrated circuits(MMICs).

Study on Dissolution Condition of Monsanto Catalyst (몬산토 촉매의 용해방법에 관한 연구)

  • Choi, Kwang Soon;Lee, Chang Heon;Pyo, Hyung Yeol;Park, Yang Soon;Joe, Kih Soo;Kim, Won Ho
    • Analytical Science and Technology
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    • v.14 no.4
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    • pp.317-323
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    • 2001
  • Dissolution procedures of Monsanto catalyst which has been used to produce acrylronitrile by ammoxidation of propylene have been studied. Optimum dissolution condition of the catalyst supported on silica was obtained by microwave digestion system with mixed of HCl, HF and $H_2O_2$. When a safety device was activated by increased pressure in microwave vessel, Bi, Fe, Mo, Sb and U were not volatilized even though silica was volatilized as $SiF_4$. Quantification results by this method were $SiO_2$ $50.5{\pm}0.4%$, $Sb_2O_3$ $29.6{\pm}0.6%$, $UO_2$ $10.2{\pm}0.1%$, $Fe_2O_3$ $6.1{\pm}0.1%$, $MoO_3$ $0.73{\pm}0.01%$ and $Bi_2O_3$ $0.49{\pm}0.01%$ by ICP-AES and the relative error was within ${\pm}10%$ except bismuth.

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Effect of low temperature microwave irradiation on tunnel layer of charge trap flash memory cell

  • Hong, Eun-Gi;Kim, So-Yeon;Jo, Won-Ju
    • Proceedings of the Korean Vacuum Society Conference
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    • 2016.02a
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    • pp.261-261
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    • 2016
  • 플래시 메모리 (flash memory)는 DRAM(dynamic racdom access memory)이나 SRAM(static random access memory)에 비해 소자의 구조가 매우 단순하기 때문에 집적도가 높아서 기기의 소형화가 가능하다는 점과 제조비용이 낮다는 장점을 가지고 있다. 또한, 전원을 차단하면 정보가 사라지는 DRAM이나 SRAM과 달리 전원이 꺼지더라도 저장된 정보가 지워지지 않는다는 특징을 가지고 있어서 ROM(read only memory)과 정보의 입출력이 자유로운 RAM의 장점을 동시에 가지기 때문에 활용도가 크다. 또한, 속도가 빠르고 소비전력이 작아서 USB 드라이브, 디지털 TV, 디지털 캠코더, 디지털 카메라, 휴대전화, 개인용 휴대단말기, 게임기 및 MP3 플레이어 등에 널리 사용되고 있다. 특히, 낸드(NAND)형의 플래시 메모리는 고집적이 가능하며 하드디스크를 대체할 수 있어 고집적 음성이나 화상 등의 저장용으로 많이 쓰이며 일정량의 정보를 저장해두고 작업해야 하는 휴대형 기기에도 적합하며 가격도 노어(NOR)형에 비해 저렴하다는 장점을 가진다. 최근에는 smart watch, wearable device 등과 같은 차세대 디스플레이 소자에 대한 관심이 증가함에 따라 투명하고 유연한 메모리 소자에 대한 연구가 다양하게 진행되고 있으며 유리나 플라스틱과 같은 기판 위에서 투명한 플래시 메모리를 형성하는 기술에 대한 관심이 높아지고 있다. 전하트랩형 (charge trap type) 플래시 메모리는 플로팅 게이트형 플래시 메모리와는 다르게 정보를 절연막 층에 저장하므로 인접 셀간의 간섭이나 소자의 크기를 줄일 수 있기 때문에 투명하고 유연한 메모리 소자에 적용이 가능한 차세대 플래시 메모리로 기대되고 있다. 전하트랩형 플래시메모리는 정보를 저장하기 위하여 tunneling layer, trap layer, blocking layer의 3층으로 이루어진 게이트 절연막을 가진다. 전하트랩 플래시 메모리는 게이트 전압에 따라서 채널의 전자가 tunnel layer를 통해 trap layer에 주입되어 정보를 기억하게 되는데, trap layer에 주입된 전자가 다시 채널로 빠져나가는 charge loss 현상이 큰 문제점으로 지적된다. 따라서 tunnel layer의 막질향상을 위한 다양한 열처리 방법들이 제시되고 있으며, 기존의 CTA (conventional thermal annealing) 방식은 상대적으로 높은 온도와 긴 열처리 시간을 가지고, RTA (rapid thermal annealing) 방식은 매우 높은 열처리 온도를 필요로 하기 때문에 플라스틱, 유리와 같은 다양한 기판에 적용이 어렵다. 따라서 본 연구에서는 기존의 열처리 방식보다 에너지 전달 효율이 높고, 저온공정 및 열처리 시간을 단축시킬 수 있는 마이크로웨이브 열처리(microwave irradiation, MWI)를 도입하였다. Tunneling layer, trap layer, blocking layer를 가지는 MOS capacitor 구조의 전하트랩형 플래시 메모리를 제작하여 CTA, RTA, MWI 처리를 실시한 다음, 전기적 특성을 평가하였다. 그 결과, 마이크로웨이브 열처리를 실시한 메모리 소자는 CTA 처리한 소자와 거의 동등한 정도의 우수한 전기적인 특성을 나타내는 것을 확인하였다. 따라서, MWI를 이용하면 tunnel layer의 막질을 향상시킬 뿐만 아니라, thermal budget을 크게 줄일 수 있어 차세대 투명하고 유연한 메모리 소자 제작에 큰 기여를 할 것으로 예상한다.

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Simulation Study on the DC/RF Characteristics of MHEMTs (MHEMT 소자의 DC/RF 특성에 대한 시뮬레이션 연구)

  • Son, Myung-Sik
    • Journal of the Korean Vacuum Society
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    • v.20 no.5
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    • pp.345-355
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    • 2011
  • GaAs-based metamorphic high electron mobility transistors (MHEMTs) and InP-based high electron mobility transistors (HEMTs) have good microwave and millimeter-wave frequency performance with lower minimum noise figure. MHEMTs have some advantages, especially for cost, compared with InP-based ones. In this paper, InAlAs/InxGa1-xAs/GaAs MHEMTs are simulated for DC/RF small-signal analysis. The hydrodynamic simulation parameters are calibrated to a fabricated 0.1-${\mu}m$ ${\Gamma}$-gate MHEMT device having the modulation-doped $In_{0.52}Al_{0.48}As/In_{0.53}Ga_{0.47}As$ heterostructure on the GaAs substrate, and the simulations for RF small-signal characteristics are performed, compared with the measured data, and analyzed for the devices. In addition, the simulations for the DC/RF characteristics of the MHEMTs with different gate-recess structures are performed, compared and analyzed.

A Ku-band 3 Watt PHEMT MMIC Power Amplifier for satellite communication applications (위성 통신 응용을 위한 Ku-대역 3 Watt PHEMT MMIC 전력 증폭기)

  • Uhm, Won-Young;Lim, Byeong-Ok;Kim, Sung-Chan
    • Journal of IKEEE
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    • v.24 no.4
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    • pp.1093-1097
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    • 2020
  • This work describes the design and characterization of a Ku-band monolithic microwave integrated circuit (MMIC) power amplifier (PA) for satellite communication applications. The device technology used relies on 0.25 ㎛ gate length gallium arsenide (GaAs) pseudomorphic high electron mobility transistor (PHEMT) of wireless information networking (WIN) semiconductor foundry. The developed Ku-band PHEMT MMIC power amplifier has a small-signal gain of 22.2~23.1 dB and saturated output power of 34.8~35.4 dBm over the entire band of 13.75 to 14.5 GHz. Maximum saturated output power is a 35.4 dBm (3.47 W) at 13.75 GHz. Its power added efficiency (PAE) is 30.6~37.83% and the chip dimensions are 4.4 mm×1.9 mm. The developed 3 W PHEMT MMIC power amplifier is expected to be applied in a variety of Ku-band satellite communication applications.

Analysis of issues in gate recess etching in the InAlAs/InGaAs HEMT manufacturing process

  • Byoung-Gue Min;Jong-Min Lee;Hyung Sup Yoon;Woo-Jin Chang;Jong-Yul Park;Dong Min Kang;Sung-Jae Chang;Hyun-Wook Jung
    • ETRI Journal
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    • v.45 no.1
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    • pp.171-179
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    • 2023
  • We have developed an InAlAs/InGaAs metamorphic high electron mobility transistor device fabrication process where the gate length can be tuned within the range of 0.13㎛-0.16㎛ to suit the intended application. The core processes are a two-step electron-beam lithography process using a three-layer resist and gate recess etching process using citric acid. An electron-beam lithography process was developed to fabricate a T-shaped gate electrode with a fine gate foot and a relatively large gate head. This was realized through the use of three-layered resist and two-step electron beam exposure and development. Citric acid-based gate recess etching is a wet etching, so it is very important to secure etching uniformity and process reproducibility. The device layout was designed by considering the electrochemical reaction involved in recess etching, and a reproducible gate recess etching process was developed by finding optimized etching conditions. Using the developed gate electrode process technology, we were able to successfully manufacture various monolithic microwave integrated circuits, including low noise amplifiers that can be used in the 28 GHz to 94 GHz frequency range.

GaN-based Low Noise Amplifier MMIC for X-band Applications (X-대역 응용을 위한 GaN 기반 저잡음 증폭기 MMIC)

  • Byeong-Ok Lim;Joo-Seoc Go;Sung-Chan Kim
    • Journal of IKEEE
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    • v.28 no.1
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    • pp.33-37
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    • 2024
  • In this paper, we report the design and the measurement of a X-band low noise amplifier (LNA) monolithic microwave integrated circuit (MMIC) using a 0.25 ㎛ gate length microstrip GaN-on-SiC high electron mobility transistor (HEMT) technology. The developed X-band GaN-based LNA MMIC achieves small signal gain of 22.75 dB ~ 25.14 dB and noise figure of 1.84 dB ~ 1.94 dB in the desired band of 9 GHz to 10 GHz. Input and output return loss values are -11.36 dB ~ -24.49 dB and -11.11 dB ~ -17.68 dB, respectively. The LNA MMIC can withstand 40 dBm (10 W) input power without performance degradation. The chip dimensions are 3.67 mm × 1.15 mm. The developed GaN-based LNA MMIC is applicable to various X-band applications.

A Study on the Breakdown in MHEMTs with InAlAs/InGaAs Heterostructure Grown on the GaAs substrate (InAlAs/InGaAs/GaAs MHEMT 소자의 항복 특성에 관한 연구)

  • Son, Myung-Sik
    • Journal of the Institute of Electronics Engineers of Korea SD
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    • v.48 no.11
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    • pp.1-8
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    • 2011
  • One of the most important parameters that limit maximum output power of transistor is breakdown. InAlAs/InGaAs/GaAs Metamorphic HEMTs (MHEMTs) have some advantages, especially for cost, compared with InP-based ones. However, GaAs-based MHEMTs and InP-based HEMTs are limited by lower breakdown voltage for output power even though they have good microwave and millimeter-wave frequency performance with lower minimum noise figure. In this paper, InAlAs/$In_xGa_{1-x}As$/GaAs MHEMTs are simulated and analyzed for breakdown. The parameters affecting breakdown are investigated in the fabricated 0.1-${\mu}m$ ${\Gamma}$-gate MHEMT device having the modulation-doped $In_{0.52}Al_{0.48}As/In_{0.53}Ga_{0.47}As$ heterostructure on the GaAs wafer using the hydrodynamic transport model of a 2D commercial device simulator. The impact ionization and gate field effect in the fabricated device including deep-level traps are analyzed for breakdown. In addition, Indium mole-fraction-dependent impact ionization rates are proposed empirically for $In_{0.52}Al_{0.48}As/In_xGa_{1-x}As$/GaAs MHEMTs.