• Journal of the Korean Society of Manufacturing Technology Engineers
• /
• v.9 no.5
• /
• pp.105-111
• /
• 2000

Micronization of sensor is a trend of the silicon sensor development with regard to a piezoresistive silicon pressure sensor, the size of the pressure sensor diaphragm have become smaller year by year, and a microaccelerometer with a size less than 200~300${\mu}{\textrm}{m}$ has been realized. Over the past four or five years, numerical modeling of microsensors and microstructures has gradually been developed as a field of microelectromechanical system(MEMS) design process. In this paper, we study some of the micromachining processes of single crystal silicon(SCS) for the microaccelerometer, and their subsequent processes which might affect thermal and mechanical loads. The finite element method(FEM) has been a standard numerical modeling technique extensively utilized in structural engineering discipline for component design of microaccelerometer. Temperature rise sufficiently low at the suspended beams. Instead, larger temperature gradient can be seen at the bottom of paddle part. The center of paddle part becomes about 5~2$0^{\circ}C$ higher than the corner of paddle and suspended beam edges.

• Proceedings of the Korean Society of Precision Engineering Conference
• /
• 2006.05a
• /
• pp.223-224
• /
• 2006

In this study, we have investigated the micromachining of PZT to fabricate interdigitated electrodes of electro active material actuator using Nd:YAG laser We have observed groove shapes of PZT with changing beam power, scanning speed, gas, and so on to find optimum conditions of the laser processing for PZT grooves. As a result, this method has been applied to the laser micromachining for grooves in PZT surface, and we could have optimum parameters of Nd:YAG laser Finally it was shown that the laser micromachining of PZT can substitute fer bonding, etching and deposition processes in fabricating electro active material actuator embedded with interdigitated electrodes.

• Journal of the Korean Society of Manufacturing Technology Engineers
• /
• v.21 no.5
• /
• pp.773-777
• /
• 2012

Recently UV laser micromachining processes is widely introduced to meet the needs of advanced components of IT, BT and ET industries. Due to the characteristics of non-contact and high-speed laser processing, UV laser micromachining is applied to manufacture very thin substrate such as polymer, metals and composite. These minimum line width obtained by UV laser micromachining is generally determined from laser wavelength, optical lens and its numerical aperture. In this paper we will show the lens effect of water droplet on the surface of workpiece to reduce the line width when UV laser light is irradiated and focused through the water droplet. Because of the refraction effect generated by the semi-spherical or spherical shape of water droplet, we can find smaller line width. And water droplet could not only protect thermal deformation, but also carry away burr around micro dent. Firstly fundamental theory of minimum line width was derived from relationship between the geometry of water droplet and laser light trace, and then experimental and simulation results will be finally compared to verify the effectiveness of water droplet lens effect of UV laser micromachining process.

• Laser Solutions
• /
• v.14 no.1
• /
• pp.25-29
• /
• 2011

Micromachining of photosensitive glass by UV exposure, heat treatment, and etching processes is reported. Like photoresist, the photosensitive glass is also classified into positive and negative types by development characteristics. For the positive type, the exposed area is crystallized and etched away during the etching process in HF solution, whereas the unexposed area is crystallized and etched away for the negative type. The crystallized area of the photosensitive glass has an etch rate approximately 30~100 times faster than that of the amorphous area so that it becomes possible to fabricate microstructures in the glass. Based on the unique properties of glass such as high optical transparency, electrical insulation, and chemical/thermal stability, the glass micromachining technique introduced in this work could be widely applied to various devices in the fields of electronics, bio engineering, nanoelectonics and so on.

• Journal of the Korean Society of Manufacturing Process Engineers
• /
• v.10 no.1
• /
• pp.1-7
• /
• 2011

Micromachining is gaining popularity due to recent advancements in MEMS(Micro Electro Mechanical Systems). Using conventional micromachining, it is relatively difficult to produce moving components in the order of microns. Photolithography for silicon material has high accuracy machining, but it has low aspect ratio. X-ray lithography has ultra high accuracy machining, but it has expensive cost. Micro-EDM(electro discharge machining) has been gaining popularity as a new alternative method to fabricate micro-structures. In this study, Micro-EDM machine is developed available for fabricate micro-structures and two processes such as side cut EDM and milling EDM is proposed. Several sets of experiment results have been performed to study the characteristics of the machining process.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
• /
• 2001.07a
• /
• pp.874-877
• /
• 2001

SOI(Silicon-On-Insulator) technology is proposed as an alternative to bulk silicon for MEMS(Micro Electro Mechanical System) manufacturing. In this paper, we fabricated the SOI wafer with uniform active layer thickness by silicon direct bonding and mechanical polishing processes. Specially-designed electrostatic bonding system is introduced which is available for vacuum packaging and silicon-glass wafer bonding for SOG(Silicon On Glass) wafer. We demonstrated thermopile sensor and RF resonator using the SOI wafer, which has the merits of simple process and uniform membrane fabrication.

• Proceedings of the Korean Society for Technology of Plasticity Conference
• /
• 2005.09a
• /
• pp.54-58
• /
• 2005

Femtosecond laser is the latest generation pulsed laser delivering shortest pulses. Any solid materials can be machined by it. Femtosecond laser micromachining allows highest precision and minimal heat influence within the workpiece. But due to the complex physical phenomena between the laser beam and the workpiece materials, it is very difficult to determine the optimal process conditions in the femtosecond laser micromachining. In this study, a method to simulate the femtosecond laser micromachining process was proposed. And femtosecond laser micro patterning processes of chromium thin film are simulated by the proposed method using a commercial FE code, LS-Dyna. Simulation results were compared with those of experiments.

• Journal of Advanced Marine Engineering and Technology
• /
• v.25 no.3
• /
• pp.631-635
• /
• 2001

The major problems associated with the manufacturing processes of the microaccelerometer based on the tunneling current concept is the residual stress. This paper deals with finite element analysis of residual stress causing pop up phenomenon which are induced in micromachining processes for a microaccelerometers sensor using silicon on insulator(SOI) wafer. After heating the tunnel gap up to $100^{\circ}C$and get it through cooling process and the additional beam up to $80^{\circ}C$get it through the cooling process. We learn the residual stress of each shape and compare the results with each other, after heating the tunnel gap up to $400^{\circ}Cduring$ the Pt deposition process. The equivalent stresses produced during the heating process of focused ion beam(FIB) cut was also to be about $0.02~0.25Pa/^{\circ}C$and cooling process the gradient of residual stresses of about $8.4\{times}10^2Pa/{\mu}m$ still at cantilever beam and connected part of paddle. We want to seek after the real cause of this pop up phenomenon and diminish this by change manufacturing processes of microaccelerometer sensors.

• Journal of the Korean Society for Precision Engineering
• /
• v.26 no.10
• /
• pp.108-115
• /
• 2009

Although nanosecond pulsed laser drilling and milling are rapid and non-wear processes in micromachining, the quality cannot meet the precision standard due to the recast layer and heat affected zone. On the other hand, electrical discharge machining (EDM) is a well-known high precision machining process in micro scale; however, the low material removal rate (MRR) and tool wear remain as drawbacks. In this paper, hybrid process of laser beam machining (LBM) using nanosecond pulsed laser and micro EDM was studied for micro drilling and milling. While the quality of the micro structure fabricated by this hybrid process remains as high as direct EDM, the machining time and tool wear can be reduced. In addition, variable depth of layer was introduced as an effective method improving efficiency of hybrid milling.

• Journal of Mechanical Science and Technology
• /
• v.20 no.4
• /
• pp.554-560
• /
• 2006

This paper describes the demonstration of successful fabrication and initial characterization of micromachined pressure sensors and micromachined jets (microjets) fabricated for use in macro flow control and other applications. In this work, the microfabrication technology was investigated to create a micromachined fluidic control system with a goal of application in practical fluids problems, such as UAV (Unmanned Aerial Vehicle)-scale aerodynamic control. Approaches of this work include: (1) the development of suitable micromachined synthetic jets (microjets) as actuators, which obviate the need to physically extend micromachined structures into an external flow; and (2) a non-silicon alternative micromachining fabrication technology based on metallic substrates and lamination (in addition to traditional MEMS technologies) which will allow the realization of larger scale, more robust structures and larger array active areas for fluidic systems. As an initial study, an array of MEMS pressure sensors and an array of MEMS modulators for orifice-based control of microjets have been fabricated, and characterized. Both pressure sensors and modulators have been built using stainless steel as a substrate and a combination of lamination and traditional micromachining processes as fabrication technologies.