• 한국정밀공학회지
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• 제23권1호
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• pp.13-22
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• 2006

• 한국생산제조학회지
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• 제21권5호
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• pp.773-777
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• 2012

Recently UV laser micromachining processes is widely introduced to meet the needs of advanced components of IT, BT and ET industries. Due to the characteristics of non-contact and high-speed laser processing, UV laser micromachining is applied to manufacture very thin substrate such as polymer, metals and composite. These minimum line width obtained by UV laser micromachining is generally determined from laser wavelength, optical lens and its numerical aperture. In this paper we will show the lens effect of water droplet on the surface of workpiece to reduce the line width when UV laser light is irradiated and focused through the water droplet. Because of the refraction effect generated by the semi-spherical or spherical shape of water droplet, we can find smaller line width. And water droplet could not only protect thermal deformation, but also carry away burr around micro dent. Firstly fundamental theory of minimum line width was derived from relationship between the geometry of water droplet and laser light trace, and then experimental and simulation results will be finally compared to verify the effectiveness of water droplet lens effect of UV laser micromachining process.

• 한국레이저가공학회:학술대회논문집
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• 한국레이저가공학회 2005년도 춘계학술발표대회 논문집
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• pp.77-80
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• 2005

• 한국레이저가공학회지
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• 제16권2호
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• pp.1-6
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• 2013

Picosecond lasers are a very effective tool for micromachining metals, especially when high accuracy, high surface roughness and no heat affected zone are required. However, low productivity has been a limit to broadening the spectrum of their industrial applications. Recently it was reported that in the micromachining of copper with a 1064nm picosecond laser, there exist the optimal pulse energy and repetition rate to achieve the maximum volume ablation rate. In this paper, we used a 515nm picosecond laser, which is more efficient for micromachining copper in terms of laser energy absorption, to obtain its optimal pulse energy and repetition rate. Theoretical analysis based on the experimental data on copper ablation showed that using a 515nm picosecond laser instead of a 1064nm picosecond laser is more favorable in that the calculated threshold fluence is 75% lower and optical penetration depth is 50% deeper.

• 한국재료학회:학술대회논문집
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• 한국재료학회 2003년도 추계학술발표강연 및 논문개요집
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• pp.207-207
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• 2003

Uncooled infrared(IR) detectors that use a microbolometer with a large focal-plane array(FPA) have been developed with surface micromachining technology. There are many materials for microbolometers, such as metals, vanadium oxide, semiconductors and superconductors. Among theses, vanadium oxide is a promising material for uncooled microbolometers due to it high temperature coefficient of resistance(TCR) at room temperature. It is, however, is very difficult to deposit vanadium oxide thin films having a high TCR and low resistance because of the process limits in microbolometer fabrication. In general, vanadium oxides have been applied to microbolometer in mixed phases formed by ion beam deposition methods at low temperature with TCR in the range from -1.5 to -2.0%K.

• 한국분말재료학회지
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• 제9권4호
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• pp.267-272
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• 2002

The production of micro components is one of the leading technologies in the fields of information and communiation, medical and biotechnology, and micro sensor and micro actuator system. Microfabrication (micromachining) techniques such as X-ray lithography, electroforming, micromolding and excimer laser ablation are used for the production of micro components out of silicon, polymer and a limited number of pure metals or binary alloys. However, since the first development of microfabrication technologies there have been demands for the cost-effective replication in large scale series as well as the extended range of available material. One such promising process is micro powder injection molding (PIM), which inherits the advantages of the conventional PIM technology, such as low production cost, shape complexity, applicability to many materials, applicability to many materials, and good tolerance. This paper reports on a fundamental investigation of the application of W-Cu powder to micro metal injection molding (MIM), especially in view of achieving a good filling and a safe removal of a micro mold conducted in the experiment. It is absolutely legitimate and meaningful, at the present state of the technique, to continue developing the micro MIM towards production processes for micro components.

• Transactions on Electrical and Electronic Materials
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• 제10권4호
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• pp.135-139
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• 2009

$H_2S$ micro-gas sensors have been developed employing $SnO_2$:CuO composite thin films. The films were prepared by e-beam evaporation of Sn and Cu metals on silicon substrates, followed by oxidation at high temperatures. Results of various studies, such as scanning electron microscopy (SEM), X-ray diffraction (XRD) and X-ray photoelectron spectroscopy (XPS) reveal that $SnO_2$ and CuO are mutually non-reactive. The CuO grains, which in turn reside in the inter-granular regions of $SnO_2$, inhibit grain growth of $SnO_2$ as well as forming a network of p-n junctions. The film showed more than a 90% relative resistance change when exposed to $H_2S$ gas at 1 ppm in air at an operating temperature of $350^{\circ}C$ and had a short response time of 8 sec.

• 한국레이저가공학회지
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• 제11권4호
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• pp.29-34
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• 2008

Ultraviolet laser micromachining has increasingly been applied to the electronics industry where precision machining of high-density, multi-layer, and multi material components is in a strong demand. Due to the ever-decreasing size of electronic products such as cellular phones, MP3 players, digital cameras, etc., flexible printed circuit board (FPCB), multi-layered with polymers and metals, tends to be thicker. In present, multi-layered FPCBs are being mechanically cut with a punching die. The mechanical cutting of FPCBs causes such defects as burr on layer edges, cracks in terminals, delamination and chipping of layers. In this study, the laser cutting mechanism of FPCB was examined to solve problems related to surface debris and short-circuiting that can be caused by the photo-thermal effect. The laser cutting of PI and FCCL, which are base materials of FPCB, was carried out using a pico-second laser(355nm, 532nm) and nano-second UV laser with adjusting variables such as the average/peak power, scanning speed, cycles, gas and materials. Points which special attention should be paid are that a fast scanning speed, low repetition rate and high peak power are required for precision machining.

• 마이크로전자및패키징학회지
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• 제30권2호
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• pp.65-70
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• 2023

나노임프린트 리소그래피(Nanoimprint lithography, NIL) 공정은 패턴 형성을 위한 공정 단순성, 우수한 패턴 형성, 공정의 확장성, 높은 생산성 및 저렴한 공정 비용이라는 이유들로 인해 많은 관심을 받고 있다. 그러나, 기존의 NIL 기술들을 통해 금속 소재 상 구현할 수 있는 패턴의 크기는 일반적으로 마이크로 수준으로 제한적이다. 본 연구에서는, 다양한 두께의 금속 기판 표면에 마이크로/나노 스케일 패턴을 직접적으로 형성하기 위한 극압 임프린트 리소그래피(extremepressure imprint lithography, EPIL) 방법을 소개하고자 한다. EPIL 공정은 자외선, 레이저, 임프린트 레지스트 또는 전기적 펄스 등의 외부 요인을 사용하지 않고 고분자, 금속, 세라믹과 같은 다양한 재료의 표면에 신뢰성 있는 나노 수준의 패터닝을 가능하게 한다. 레이저 미세가공 및 포토리소그래피로 제작된 마이크로/나노 몰드는 상온에서 높은 하중 혹은 압력을 가해 정밀한 소성변형 기반 Al 기판의 나노 패터닝에 활용된다. 20 ㎛ 부터 100 ㎛까지 다양한 두께를 갖는 Al 기판 상 마이크로/나노 스케일의 패턴 형성을 보여주고자 한다. 또한, 다목적 EPIL 기술을 통해 금속 재료 표면에서 그 형상을 제어하는 방법 역시 실험적으로 증명된다. 임프린트 리소그래피 기반 본 접근법은 복잡한 형상이 포함된 금속 재료의 표면을 요구하는 다양한 소자 응용을 위한 나노 제조 방법에 적용될 수 있을 것으로 기대한다.