• Journal of the Korean Society of Manufacturing Process Engineers
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• v.21 no.4
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• pp.77-83
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• 2022

Amorphous alloys exhibit excellent mechanical properties; therefore, application technology development is being attempted in various fields. However, industrial use of application technology is limited owing to the limitations in fabrication. In this study, micropattern fabrication of an amorphous alloy was conducted using laser beam machining. Although microhole fabrication is possible without the deformation of the amorphous phase through nanosecond pulsed laser beam machining, there are limitations in the generation of recast layers and spatters. In cover plate laser beam machining (c-LBM), a cover plate is used to reduce the thermal deformation and processing area. Therefore, it is possible to fabricate holes at the level of several micrometers. In this study, it was confirmed that recast layers are hardly generated in c-LBM. Furthermore, square-shaped micropatterns were successfully fabricated using c-LBM.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2008.06a
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• pp.241-241
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• 2008

Macrofore formation in silicon and other semiconductors using electrochemical etching processes has been, in the last years, a subject of great attention of both theory and practice. Its first reason of concern is new areas of macropore silicone applications arising from microelectromechanical systems processing (MEMS), membrane techniques, solar cells, sensors, photonic crystals, and new technologies like a silicon-on-nothing (SON) technology. Its formation mechanism with a rich variety of controllable microstructures and their many potential applications have been studied extensively recently. Porous silicon is formed by anodic etching of crystalline silicon in hydrofluoric acid. During the etching process holes are required to enable the dissolution of the silicon anode. For p-type silicon, holes are the majority charge carriers, therefore porous silicon can be formed under the action of a positive bias on the silicon anode. For n-type silicon, holes to dissolve silicon is supplied by illuminating n-type silicon with above-band-gap light which allows sufficient generation of holes. To make a desired three-dimensional nano- or micro-structures, pre-structuring the masked surface in KOH solution to form a periodic array of etch pits before electrochemical etching. Due to enhanced electric field, the holes are efficiently collected at the pore tips for etching. The depletion of holes in the space charge region prevents silicon dissolution at the sidewalls, enabling anisotropic etching for the trenches. This is correct theoretical explanation for n-type Si etching. However, there are a few experimental repors in p-type silicon, while a number of theoretical models have been worked out to explain experimental dependence observed. To perform ordered macrofore formaion for p-type silicon, various kinds of mask patterns to make initial KOH etch pits were used. In order to understand the roles played by the kinds of etching solution in the formation of pillar arrays, we have undertaken a systematic study of the solvent effects in mixtures of HF, N-dimethylformamide (DMF), iso-propanol, and mixtures of HF with water on the macrofore structure formation on monocrystalline p-type silicon with a resistivity varying between 10 ~ 0.01 $\Omega$ cm. The etching solution including the iso-propanol produced a best three dimensional pillar structures. The experimental results are discussed on the base of Lehmann's comprehensive model based on SCR width.

• Transactions of the Korean Society of Mechanical Engineers A
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• v.37 no.2
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• pp.213-218
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• 2013

Ultrasonic machining (USM) is a new method used in metal cutting. This process does not involve heating or any electrochemical effects, causes low surface damage, has small residual stress, and does not rely on the conductivity of the workpiece. These characteristics are suitable for the machining of brittle materials such as glass or ceramics. However, the use of USM for brittle materials generates cracks on the workpiece. Therefore, in this study, Taguchi's method was used to optimize the processing conditions of micro holes drilled in glass and ceramics. This method was used to successfully reduce the number of cracks at the entrance and the exit of the micro holes.

• Advances in materials Research
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• v.1 no.2
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• pp.129-146
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• 2012

Polycrystalline diamond is an ideal material for parts with micro-holes and has been widely used as dies and cutting tools in automotive, aerospace and woodworking industries due to its superior wear and corrosion resistance. In this research paper, the modeling and simultaneous optimization of multiple performance characteristics such as material removal rate and surface roughness of polycrystalline diamond (PCD) with ultrasonic machining process has been presented. The fuzzy logic and taguchi's quality loss function has been used. In recent years, fuzzy logic has been used in manufacturing engineering for modeling and monitoring. Also the effect of controllable machining parameters like type of abrasive slurry, their size and concentration, nature of tool material and the power rating of the machine has been determined by applying the single objective and multi-objective optimization techniques. The analysis of results has been done using the MATLAB 7.5 software and results obtained are validated by conducting the confirmation experiments. The results show the considerable improvement in S/N ratio as compared to initial cutting conditions. The surface roughness of machined surface has been measured by using the Perthometer (M4Pi, Mahr Germany).

• Proceedings of the Korean Geotechical Society Conference
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• 2005.03a
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• pp.163-170
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• 2005

In this paper, the rock bolts, soil nails with filling grout and the micro-piling with injecting grout by pressure were applied for the stabilization of the cut slopes consisting of sedimentary rocks, igneous rocks and metamorphic rocks respectively. The field measurements and 3-D FEM analyses to find out mobilized tensile stresses of the grouted-reinforcing members installed in the drilled holes were executed on each site. With assuming the increments of the cohesive strength in the improved ground, the back analysis using direct calibration approach of changing the elastic modulus of the ground was used to find out the improved elastic modulus which yields the same tensile stresses from field measurements. The results of back analysis show that the elastic modulus of the improved ground were 4 to 6 times as large as the elastic modulus of original ground. Consequently, the design for slope reinforcement to be more rational, it is proposed that not only the improved cohesive strength is to be used in the incremental ranges on well-known previous proposed data, but also the increased elastic modulus which is about 5 times as large as the original elastic modulus is to be considered in design.

• Proceedings of the Korean Society of Precision Engineering Conference
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• 2003.06a
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• pp.1853-1856
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• 2003

Multi-layer printed circuit board(PCB) is being used widely for the product with relatively complex circuits such as TV, VTR and FAX. With the rapid enlargement of electronic and IT industry, the hole machining technology on multi-layer PCB is increasingly required to improve. Thus, the micro drilling with ultrasonic vibration can be a good method for hole machining. Unlike conventional drilling, ultrasonic vibration applied drilling introduces less wear and fracture of not only tool but also internal surface of workpiece due to little cutting resistance, thus, machinability can be improved. The experiment is conducted through the comparison between the results of conventional drilling and ultrasonic micro drilling as well as among each results by the variation according to not only feed rate of drill but also amplitude and frequency of ultrasonic vibration. The multi-layer PCB consists of 6 layers and ${\Phi}$0.3 diameter drill was used. As a result, it was found that the state of internal surfaces of holes on multiple layer PCBs is improved by the application of ultrasonic vibration.

• Korean Journal of Materials Research
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• v.11 no.10
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• pp.820-832
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• 2001

In order to obtain the basic data on the optimum conditions of electroforming process for fabricating the micro wiring pattern for plate type micro- motor core, characteristics of plating bath and properties of deposits were studied with various copper plating baths which contain sulfate, fluoborate, pyrophosphate and cyanide salt, respectively. Cathodic polarization, throwing power, internal stress, texture and surface morphology of deposits were observed. Throwing power of plating solution is deeply related to the polarization curves and the values are in the range of +20∼20%. The order of values ate as follows- pyrophosphate, cyanide, sulfate and fluoborate bath. Internal stresses of deposits are tensile in all of the copper plating bath. Thickness of the deposits plated at the center of holes has the highest value in the pyrophosphate bath and K factor, ratio of height and width of deposit, is 1.44. It was confirmed that the pyrophosphate bath was the best one for the electroforming of wire pattern.

• Proceedings of the Korean Society for Technology of Plasticity Conference
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• 2002.02a
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• pp.245-252
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• 2002

Ultrasonic machining technology has been developed over recent years for the manufacture of cost-effective and quality-assured precision parts for several industrial application such as optics, semiconductors, aerospace, and automobile. Ultrasonic machining process is an efficient and economical means of precision machining of ceramic materials. The process is non-thermal, non-chemical and non-electric md hardly creates changes to the mechanical properties of the brittle materials machined. This paper describes the characteristics of the micro-hole of $Al_2O_3$ by ultrasonic machining with tungsten carbide tool. The effects of various parameters of ultrasonic machining, including abrasives, machining force and pressure, on the material removal rate, hole quality, and tool wear presented and discussed. The ultrasonic Machining of micro-holes in ceramics has been under taken and the machining mechanism in the ultrasonic machining of ceramics based on the fracture-mechanics concept has been analyzed.

• Journal of the Korean Society of Manufacturing Technology Engineers
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• v.20 no.2
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• pp.180-186
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• 2011

This paper describes a micro electrical discharge machining (MEDM) technique that uses an insulated tool in combination with ultrasonic vibration to drill micro holes. As the machining depth becomes deeper, the dispersion of debris and circulation of the dielectric fluid are difficult to occur. Consequently, machining becomes unstable in the machining region and unnecessary electrochemical dissolution and secondary discharge sparking occur at the tool side face. To reduce the amount of unnecessary side machining, an insulated tool was used. Ultrasonic vibration was applied to the MEDM work fluid to better remove debris. Through these methods, a $1000\;{\mu}m$ thick stainless steel plate was machined by using a $73\;{\mu}m$ diameter electrode. The diameters of the hole entrance and exit were $96\;{\mu}m$ and $88\;{\mu}m$, respectively. It took only 351s to completely drill one hole.

• Journal of KSNVE
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• v.7 no.6
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• pp.959-966
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• 1997

In general, the booming noise intensity at tunnel exit is strongly related to the gradient of the compression wave front created by high speed train entering the tunnel. This paper presents some results in relation with the compression wave front produced when the high speed train enters a tunnel. Four kinds of tunnel entrance shape with real dimensions were studied to investigate the formation of compression wave front inside tunnel by train entering tunnel. Computations were carried out using three-dimensional compressible Euler equation with vanishing viscosity and conductivity of fluid. According to the results, the flow disturbances occured at tunnel entrance were eliminated by tunnel hood with same cross sectional area. The compression wave front is formed completely at 30-40m from tunnel entrance. The maximum pressure gradient of compression wave front is reduced by 29.8% for the inclined tunnel hood and reduced by 21.5% for the tunnel hood with holes at the top face with tunnel without hood. The length of the inclined hood is 15m and the length of the hood with holes is 20m.