• Title/Summary/Keyword: Micro-Grooving

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Waviness measurement of workpiece with a Large Surface Area (대면적 공작물의 기하학적 Waviness 측정)

  • Kang D.B.;Son S.M.;Ah J.H.
    • Proceedings of the Korean Society of Precision Engineering Conference
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    • 2005.10a
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    • pp.115-118
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    • 2005
  • A workpiece with a large surface area is likely to be uneven due to form error and waviness. These geometric disturbances can cause inaccurate micro shapes to be formed when micro features are micro-grooved into the surface and cause the resulting workpiece to fail to function as desired. Thus, real-time measurement and compensation is required to guarantee the form accuracy of micro features while machining a workpiece with a large surface area. In this study, a method is suggested for real-time measurement of geometric error for the micro grooving of a large flat surface using a laser displacement sensor. The measurements are demonstrated for the workpieces with large surface areas and the experimental results show that the waviness and form error are well detected.

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Wear of Single Crystal Diamond(SCD) Tools in Ultra Precision Turning of Electro-Nickel Plated Drum (전해니켈도금된 대면적 롤금형 가공시 단결정 다이아몬드공구의 마모에 관한 연구)

  • Lee, D.Y.;Hong, S.H.;Kang, H.C.;Choi, H.Z.;Lee, S.W.
    • Transactions of the Korean Society of Mechanical Engineers A
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    • v.33 no.7
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    • pp.621-628
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    • 2009
  • Nickel-phosphorus alloys are attractive materials for diamond turning applications such as fabrication of large optics and other high precision parts. It is also well-known that the higher phosphorus content of the alloys minimizes the diamond tool wear. Due to the weakness of electoless nickel plating that the phosphorus contents is limited to 13-14% (wgt), increased attention has been paid at electro-nickel plating which enables the alloys with 15-16% phosphorus. In this study, experiments were carried out to observe the wear characteristic of single crystal diamond tools in micro-grooving of electro-nickel plated drums. The experiments shows that long distance (50km) machining of micro-grooving on electro-nickel plated drum is possible with a single crystal diamond tool without any significant tool wear and defective machined surface.

The Machining Characteristics of Groove Patterning for Nitinol Shape Memory Alloy Using Electrochemical Machining (전해가공을 이용한 Nitinol 형상기억합금의 그루브 패턴 가공특성에 관한 연구)

  • Shin, Tae-Hee;Kim, Baek-Kyoum;Baek, Seung-Yub;Lee, Eun-Sang
    • Journal of the Korean Society of Manufacturing Technology Engineers
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    • v.18 no.6
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    • pp.551-557
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    • 2009
  • A development of smart materials is becoming a prominent issue on present industries. A smart material, included in functions, is needed for micro fabrication. A shape memory alloy(SMA) in a smart material is best known material. Ni-Ti alloy, composed of nikel and titanium is one of the best shape memory alloy(SMA). Nitinol SMA is used for a lot of high tech industry such as aero space, medical device, micro actuator, sensor system. However, Ni-Ti SMA is difficult to process to make a shape and fabrications as traditional machining process. Because nitinol SMA, that is contained nikel content more than titanium content, has similar physical characteristics of titanium. In this paper, the characteristics of ECM grooving process for nitinol SMA are investigated by experiments. The experiments in this study are progressed for power, gap distance and machining time. The characteristics are found each part. Fine shape in work piece can be found on conditions; current 6A, duty factor 50%, gap distance 15%, gap distance $15{\mu}m$, machining time 10min.

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A Study on the Micro Machining in Polyurethane by Excimer Laser (엣시머 레이져를 이용한 폴리우레탄의 미세 가공에 관한 연구)

  • 김재구;이성국;윤경구
    • Proceedings of the Korean Society of Precision Engineering Conference
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    • 1997.04a
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    • pp.366-370
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    • 1997
  • This paper descibes a micro groove machining process on the polyurethane biopolymer by KrF excimer laser. To investigate the etch charcteristics of polyurethane biopolymer quantitatively,laser system for ablation was installed with high precison moter and then polymer ablation experiment, in which paramteters were fluence,pulse repetition rate,numbers of pulses and assist gas, was carred out. In this experiment, we found out that the value of critical energy density for ablation is 30mJ/cmsup2/ and the etching rate is more dependent on the pulse number and fluence than any other pamameter. Finally, we machined micro grooves for fiexibility as width 300.mu.m depth 100.mu.m and port for micro-devices mounting as length 100.mu.m width 300.mu.m depth .mu.m on the outer wallof polyurethane biopolymer tube which is used as medical device.

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A Study on the minimizing of cutting depth in sub-micro machining (초정밀 절삭에서의 가공깊이 최소화에 관한연구)

  • 손성민;허성우;안중환
    • Proceedings of the Korean Society of Machine Tool Engineers Conference
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    • 2003.04a
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    • pp.376-381
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    • 2003
  • Ultra precision diamond cutting is a very efficient manufacturing method for optical parts such as HOE, Fresnel lenses, diffraction lenses, and others. During micro cutting, the rake angle is likely to become negative because the tool edge radius is considerably large compared to the sub-micrometer-order depth of cut. Depending on the ratio of the tool edge radius to the depth of cut, different micro-cutting mechanism modes appear. Therefore, the tool edge sharpness is the most important factor affecting the qualities of machined parts. That is why diamond especially mono-crystal diamond, which has the sharpest edge among all other materials is widely used in micro-cutting. The question arises, given a diamond tool, what is the minimum (critical) depth of cut to get continuous chips while in the cutting process\ulcorner In this paper, the micro machinability around the critical depth of cut is investigated in micro grooving with a diamond tool, and introduce the minimizing method of cutting depth using vibration cutting. The experimental results show the characteristics of micro cutting in terms of cutting force ratio (Fx/Fy), chip shape, surface roughness, and surface hardeing around the critical depth of cut.

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Computational Analysis of 355 nm UV Laser Single-Pulsed Machining of Copper Material Considering the Strain Rate Effect (변형률 속도 효과를 고려한 355 nm UV 레이저 구리재질의 싱글 펄스 전산해석)

  • Lee, Jung-Han;Oh, Jae Yong;Park, Sang Hu;Shin, Bo Sung
    • Journal of the Korean Society of Manufacturing Process Engineers
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    • v.9 no.3
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    • pp.56-61
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    • 2010
  • Recently, UV pulse laser is widely used in micro machining of the research, development and industry field of IT, NT and BT products because the laser short wavelength provides not only micro drilling, micro cutting and micro grooving which has a very fine line width, but also high absorption coefficient which allows a lot of type of materials to be machined more easily. To analyze the dynamic deformation during a very short processing time, which is nearly about several tens nanoseconds, the commercial Finite Element Analysis (FEA) code, LS-DYNA 3D, was employed for the computitional simulation of the UV laser micro machining behavior for thin copper material in this paper. A finite element model considering high strain rate effect is especially suggested to investigate the micro phenomena which are only dominated by mechanically pressure impact in disregard of thermally heat transfer. From these computational results, some of dynamic deformation behaviors such as dent deformation shapes, strains and stresses distributions were observed and compared with previous experimental works. These will help us to understand micro interaction between UV laser beam and material.

Basic Experimental Investigations to UV Laser Micro-Machining of Nano-Porous Alumina Ceramic Material (나노 다공 구조를 가진 알루미나 재료의 UV 레이저 미세가공에 관한 실험적 기초 연구)

  • Shin, Bo-Sung;Lee, Jung-Han
    • Journal of the Korean Society of Manufacturing Process Engineers
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    • v.11 no.1
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    • pp.62-67
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    • 2012
  • Recently UV laser is widely used to process micro parts using various materials such as polymers, metals and ceramics because it has a very high intensity at the focused spot area. It is generally known that there are still some difficulties for alumina($Al_2O_3$) ceramics to directly make micro patterns like holes and lines on the surface of working material using 355nm UV laser because the alumina has a very low absorption coefficient at that wavelength. But nowadays new alumna with nano-porous holes is developed and applied to advanced micro functional parts of IT, BT and BT industries. In this paper, we are going to show the mechanism of photo-thermal ablation for nano-porous ceramics. Inside hole there is a lot of multiple reflections along the depth of hole. Experimentally we can find the micro hole drilling and micro grooving on the surface of nano-porous alumina.

Micro Ultrasonic Elliptical Vibration Cutting (I) The Generation of a Elliptical Vibration Cutting Motion for Micro Ultrasonic Machining (미세 초음파 타원궤적 진동절삭 (I) 미세 초음파 가공을 위한 타원 절삭경로 생성)

  • Loh Byung-Gook;Kim Gi Dae
    • Journal of the Korean Society for Precision Engineering
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    • v.22 no.12 s.177
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    • pp.190-197
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    • 2005
  • For precise micro-grooving and surface machining, a mechanism for creating elliptical vibration cutting (EVC) motion is proposed which uses two parallel piezoelectric actuators. And based on its kinematical analysis, variations of EVC path are investigated as a function of dimensional changes in the mechanism, phase difference and amplitude of excitation sinusoidal voltages. Using the proposed PZT mechanism, various types of two dimensional EVC paths including one dimensional vibration cutting path along the cutting direction and thrust direction can be easily obtained by changing the phase lag, the amplitude of the piezoelectric actuators, and the dimension of the mechanism.

Deformation analysis of Tool and Tool holder for Micromachining by FEM (FEM을 이용한 Micromachining용 Tool 및 Tool holder의 변형해석)

  • Min, Kyung-Tak;Jang, Ho-Su
    • Journal of the Korean Society of Manufacturing Process Engineers
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    • v.9 no.1
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    • pp.87-92
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    • 2010
  • Micromachining technology using a ultra-precision micromachining system is widely applied in the fields of optics, biotechnology and analytical chemistry, etc. specially in microfabrication of fresnel lens, light guide panels of TFT-LED and PDP ribs with micro-patterns, machining errors have an effect on the performance of those products. The deflection of tool and tool holder is known to be one of the very important factors that is due to machining errors in micromachining. The deflections of diamond tool and tool holder used in micro-grooving are analysed by FEM. We analysed by FEM. With an linearity valuation of FEM, deflection of tool and tool holder is calculated by using the data of cutting force which is acquired from micro-V groove machining experiments in micromachining system.

Characterization of the Chemical Mechanical Micro Machining for Single Crystal Silicon (실리콘의 화학기계적 미세가공 특성)

  • Jeong, Sang-Cheol;Park, Jun-Min;Lee, Hyeon-U;Jeong, Hae-Do
    • Journal of the Korean Society for Precision Engineering
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    • v.19 no.1
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    • pp.186-195
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    • 2002
  • The mechanism of micro machining of reacted layer on silicon surface were proposed. The depth of reacted layer and the change of mechanical property were measured and analyzed. Depth of hydrated layer which is created on the surface of silicon by potassium hydrate was analyzed with SEM and XPS. The decrease of the micro victors hardness of silicon surface was shown with the increase of the concentration of potassium hydrate and the change of the dynamic friction coefficient by chemical reacted layer was measured due to the readiness of machining. The experiment of groove machining was done with 3-axis machine with constant load. With chemical mechanical micro machining the surface crack and burrs generated by both brittle and ductile micro machining were diminished. And the surface profile and groove depth was shown in accordance with the machining speed and reaction time with SEM and AFM.