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Characterization of the Chemical Mechanical Micro Machining for Single Crystal Silicon  

Jeong, Sang-Cheol (Dept.of Precision Mechanical Engineering, Busan National University)
Park, Jun-Min (Dept.of Precision Mechanical Engineering, Busan National University)
Lee, Hyeon-U (Dept.of Precision Mechanical Engineering, Busan National University)
Jeong, Hae-Do (Busan National University)
Publication Information
Journal of the Korean Society for Precision Engineering / v.19, no.1, 2002 , pp. 186-195 More about this Journal
Abstract
The mechanism of micro machining of reacted layer on silicon surface were proposed. The depth of reacted layer and the change of mechanical property were measured and analyzed. Depth of hydrated layer which is created on the surface of silicon by potassium hydrate was analyzed with SEM and XPS. The decrease of the micro victors hardness of silicon surface was shown with the increase of the concentration of potassium hydrate and the change of the dynamic friction coefficient by chemical reacted layer was measured due to the readiness of machining. The experiment of groove machining was done with 3-axis machine with constant load. With chemical mechanical micro machining the surface crack and burrs generated by both brittle and ductile micro machining were diminished. And the surface profile and groove depth was shown in accordance with the machining speed and reaction time with SEM and AFM.
Keywords
C3M(Chemical Mechanical Micro Machining); grooving; PCD(Poly Crystal Diamond); XPS(X-ray Photoelectron Spectroscopy); AFM(Atomic Force Microscope);
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