• Journal of Sensor Science and Technology
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• v.18 no.5
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• pp.359-364
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• 2009

This paper presents flexible electrocardiography(ECG) sensors using micro electro mechanical systems(MEMS) and flexible printed circuit(FPC) technology. By using FPC technology, ECG sensors which consisted of an outer hook-shaped electrode and an inner circular-shaped electrode were fabricated on the polyimide substrate. Thereafter, the bipolar ECG sensor was miniaturized using MEMS technology. The ECG measurement capability was examined by attaching the sensor to the human chest and wrist. Performance of the proposed sensors was then compared with ECG measured by commercial Ag/AgCl electrodes. It was verified that ECG could be measured using proposed sensors at only single body.

• Journal of Sensor Science and Technology
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• v.14 no.4
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• pp.265-271
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• 2005

In this study, a variable capacitive pressure sensor is fabricated for TPMS (Tire Pressure Monitoring System). This study is for developing sensors which consecutively measure the tire pressure given as 30 psi from the industrial standard. For improving non-linearity of the prior capacitive pressure sensors, it is suggested that touch mode capacitive pressure sensor be applied. In addition, initial capacitance is designed as small as possible for the conformity to the wireless sensor. ANSYS, commercial FEA package, is used for designing and simulating the sensor. The device is progressed by MEMS (Micro Electro Mechanical Systems) fabrication and packaged with PDMS. The result is obtained sensitivity, 1 pF/psi, through a pressure test. The simulation result is discrepant from experiment one. Wafer's uniformity is presumed as the main reason of discrepancy.

• Proceedings of the Korean Society of Precision Engineering Conference
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• 2004.05a
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• pp.140-140
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• 2004

마이크로 기술을 대변하는 Micro-Electro-Mechanical-Systems (MEMS)와 반도체, 각종 micro-sensor 및 actuator 등은 실리콘 위에 박막 코팅한 재료를 주로 사용하고 있다. 따라서 1 Um 이하의 박막코팅에 의해 원하는 성능을 얻으려는 시도가 널리 진행되고 있다 Hard Disk Drive (HDD)의 Head-Disk Interface (HDI)와 MEMS 접촉면에서는 발생하는 마찰 및 마멸에 대한 문제 등은 중요한 고려대상이다. 특히 코팅 층의 표면 파손 현상은 코팅 층의 파손 특성과 코팅 층과 기판 사이의 결합상태가 큰 영향을 미친다.(중략)

• Korean Journal of Materials Research
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• v.24 no.10
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• pp.532-537
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• 2014

In this study, highly sensitive hydrogen micro gas sensors of the multi-layer and micro-heater type were designed and fabricated using the micro electro mechanical system (MEMS) process and palladium catalytic metal. The dimensions of the fabricated hydrogen gas sensor were about $5mm{\times}4mm$ and the sensing layer of palladium metal was deposited in the middle of the device. The sensing palladium films were modified to be nano-honeycomb and nano-hemisphere structures using an anodic aluminum oxide (AAO) template and nano-sized polystyrene beads, respectively. The sensitivities (Rs), which are the ratio of the relative resistance were significantly improved and reached levels of 0.783% and 1.045 % with 2,000 ppm H2 at $70^{\circ}C$ for nano-honeycomb and nano-hemisphere structured Pd films, respectively, on the other hand, the sensitivity was 0.638% for the plain Pd thin film. The improvement of sensitivities for the nano-honeycomb and nano-hemisphere structured Pd films with respect to the plain Pd-thin film was thought to be due to the nanoporous surface topographies of AAO and nano-sized polystyrene beads.

• Journal of the Microelectronics and Packaging Society
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• v.24 no.4
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• pp.9-17
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• 2017

In these days, MEMS (micro-electro-mechanical system) devices become the crucial sensor components in mobile devices, automobiles and several electronic consumer products. For MEMS devices, the packaging determines the performance, reliability, long-term stability and the total cost of the MEMS devices. Therefore, the packaging technology becomes a key issue for successful commercialization of MEMS devices. As the IoT and wearable devices are emerged as a future technology, the importance of the MEMS sensor keeps increasing. However, MEMS devices should meet several requirements such as ultra-miniaturization, low-power, low-cost as well as high performances and reliability. To meet those requirements, several innovative technologies are under development such as integration of MEMS and IC chip, TSV(through-silicon-via) technology and CMOS compatible MEMS fabrication. It is clear that MEMS packaging will be key technology in future MEMS. In this paper, we reviewed the recent development trends of the MEMS packaging. In particular, we discussed and reviewed the recent technology trends of the MEMS bonding technology, such as low temperature bonding, eutectic bonding and thermo-compression bonding.

• The Journal of the Institute of Internet, Broadcasting and Communication
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• v.10 no.2
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• pp.151-157
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• 2010

Rapid technological advances in the area of micro electro-mechanical systems (MEMS) have spurred the development of small inexpensive sensors capable of intelligent sensing. A significant amount of research has been done in the area of connecting large numbers of these sensors to create robust and scalable Wireless Sensor Networks (WSNs). The resource scarcity, ad-hoc deployment, and immense scale of WSNs make secure communication a particularly challenging problem. Since the primary consideration for sensor networks is energy efficiency, security schemes must balance their security features against the communication and computational overhead required to implement them. In this paper, we combine location information and probability to create a new security aware multipath geographic routing protocol. The implemented result in network simulator (ns-2) showed that our protocol has a better performance under attacks.

• Journal of Navigation and Port Research
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• v.35 no.10
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• pp.785-791
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• 2011

This paper describes the evaluation and selection of MEMS(Micro-Elect Mechanical System) based inertial sensor to fit to implement the Inertial Measurement Unit(IMU) for a small-sized vessel at sea. At first, the error model and the noise model of the inertial sensors are defined with Euler's equations and then, the inertial sensor evaluation is carried out with Allan Variance techniques and Monte Carlo simulation. As evaluation results for the five sensors, ADIS16405, SAR10Z, SAR100Grade100, LIS344ALH and ADXL103, the combination of gyroscope and accelerometer of ADIS16405 is shown minimum error having around 160 m/s standard deviation of velocity error and around 35 km standard deviation of position error after 600 seconds. Thus, we select the ADIS16405 inertial sensor as a MEMS-based inertial sensor to implement IMU and, the error reducing method is also considered with the search for reference papers.

• Proceedings of the SAREK Conference
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• 2009.06a
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• pp.404-408
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• 2009

Gas pipelines in bridges, roads and subway construction sections can undergo abrupt stress and vibration changes. To protect human life from any gas leakage accidents induced by the abrupt stress and vibration, the gas pipeline system needs to be continuously monitored. The estimation method of pipeline stress using MEMS wireless tilt sensor has been developed and its validity has been evaluated using a lab test bench.

• Journal of the Institute of Electronics Engineers of Korea SC
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• v.46 no.3
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• pp.22-30
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• 2009

GPS and INS integrated systems are expected to become commonly available as a result of low cost Micro-Electro-Mechanical Sensor (MEMS) technology. However, the current performance achieved by low cost sensors is still relatively poor due to the large inertial sensor errors. This is particularly prevalent in the urban environment where there are significant periods of restricted sky view. To reduce the inertial sensor error, GPS and low cost INS are integrated using a Loosely Coupled Kalman Filter architecture which is appropriate in most applications where there is good satellite availability. In this paper, we present the GPS/INS sensor Integration using Loosely Coupled Kalman Filter approach. We also compare the simulation results of Wander Azimuth Strapdown Mechanization Scheme with the reference values generated by the ZH35C trajectory simulator that is describe mathematically either by the geometry of the path, or as the position of the object over time.

• Journal of Sensor Science and Technology
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• v.26 no.2
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• pp.91-95
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• 2017

Recently, infrared (IR) spectrometers have been required in various fields such as environment, safety, mobile, automotive, and military. This IR dispersive sensor detection method of substances is widely used. In this study, we fabricated a silicon (Si) prism-based near infrared (NIR) spectrometer utilizing micro electro mechanical system (MEMS) technology. Si prism-based NIR spectrometer utilizing MEMS technology consists of upper, middle, and lower substrates. The upper substrate passes through the incident IR ray selectively. The middle substrate, acting as a prism, disperses and separates the incident IR beam. The lower substrate has an amorphous Si (a-Si)-based bolometer array to detect the IR spectrum. The fabricated Si prism-based NIR spectrometer utilizing MEMS technology has the advantage of a simple structure, easy fabrication steps, and a wide NIR region operating range.