• 한국정밀공학회지
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• 제21권8호
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• pp.89-96
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• 2004

Micro-tensile testing system, consisting of a micro tensile loading system and micro-ESPI(Electronic Speckle Pattern Interferometry) system, has been developed for measurement of micro-tensile properties of thin micro-materials. Micro-tensile loading system had a load cell with the maximum capacity of 50N and micro actuator with resolution of 4.5nm in stroke. The system was used to apply a tensile load to the micro-sized specimen. During tensile loading, the micro-ESPI system acquired interferornetric speckle patterns in the deformed specimen and measured the in-plane tensile strain. The ESPI system consisted of a CCD-camera with a lens and the window-based program developed for this experiment. Using this system, stress-strain curves for 4 kinds of electrolytic copper foil 18$\square$m thick were obtained. From these curves, tensile properties, including the elastic modulus. yielding strength and tensile strength, were determined and also values of the plastic exponent and coefficient based on Ramberg-Osgood relationship were evaluated.

• 한국정밀공학회지
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• 제23권8호
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• pp.54-63
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• 2006

Enhancement methods of sensitivity to in-plane strain measurement by micro-ESPI(Electronic Speckle Pattern Interferometry) technique were proposed using TiN and Au thin films. Micro-tensile strain over the micro-tensile specimens, prepared in micro-scale by those films, was measured by micro-tensile loading system and micro-ESPI system developed in this study. The subsequent measurement of in-plane tensile strain in the micro-sized specimens was introduced using the micro-ESPI technique, and the micro-tensile stress-strain curves for these films were determined. To enhance the sensitivity to measurement of in-plane tensile strain, algorithms of the phase estimation by using curve fitting of inter-fringe and the discrete Fourier Transform with object-induced dynamic phase shifting were developed. Using these two algorithms, the micro-tensile strain-stress curves were generated. It is shown that the algorithms for enhancement of the sensitivity suggested in this study make the sensitivity to measurement of the in-plane tensile strain increase.

• 한국정밀공학회:학술대회논문집
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• 한국정밀공학회 2005년도 춘계학술대회 논문집
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• pp.1442-1445
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• 2005

Several test methods, including micro strain/deformation measurement techniques, have been studied to more reliably measure the micro properties in micro/nano materials. Therefore, in this study, the continuous measurement of in-plane tensile strain in micro-sized specimens of thin film materials was introduced using the micro-ESPI technique. TiN and Au thin films 1 and $0.47\;\mu{m}$ thick, respectively, were deposited on the silicon wafer and fabricated into the micro-sized tensile specimens using the electromachining process. The micro-tensile loading system and micro-ESPI system were developed to measure the tensile strain during micro-tensile test. The micro-tensile stress-strain for these materials was determined using the algorithm for continuous strain measurement. Furthermore, algorithm for enhancing the sensitivity to measurement of in-plane tensile strain was suggested. According to the algorithm for enhancement of sensitivity, micro-tensile strain data between interfringe were calculated. It is shown that the algorithm for enhancement of the sensitivity suggested in this study makes the sensitivity to the in-plane tensile strain increase.

• 한국정밀공학회지
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• 제23권4호
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• pp.14-21
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• 2006

• 한국정밀공학회:학술대회논문집
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• 한국정밀공학회 2003년도 춘계학술대회 논문집
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• pp.1059-1062
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• 2003

Micro-tensile testing system has been developed and micro-tensile tests for copper foil have been carried out. The system consisted of a micro tensile loading system and a micro-ESPI system for measuring strain. The loading system has a maximum loading capacity of 50N and a stroke resolution of 4.5nm. Stress-strain curves for the electro-deposited copper foil with the thickness of 18$\mu\textrm{m}$ were obtained, and tensile properties, including elastic modulus, yielding strength and tensile strength, were determined. The tensile properties obtained under three different conditions of testing speed showed a dependency on the speed.

• 한국정밀공학회:학술대회논문집
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• 한국정밀공학회 2006년도 추계학술대회 논문집
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• pp.319-320
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• 2006

• 대한기계학회:학술대회논문집
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• 대한기계학회 2004년도 춘계학술대회
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• pp.240-245
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• 2004

Tensile properties of hard coating material, TiN, were evaluated using micro-tensile testing system. TiN has been known as a hard coating material commonly used today. Micro-tensile testing system consisted of a micro tensile loading system and a micro-ESPI(Electronic Speckle Pattern Interferometry) system. Micro-tensile loading system had a maximum load capacity of 500mN and a resolution of 4.5 nm in stroke. TiN thin film $1{\mu}m$ thick was deposited on the Si wafer pre-deposited of $Si_3N_4$ film substrate by the closed field unbalanced magnetron sputtering (CFUBMS) process. Three kinds of micro-tensile specimen with the respective width of $50{\mu}m$, $100{\mu}m$ and $500{\mu}m$ were fabricated by MEMS process. The mechanical properties including tensile strength and elastic modulus were determined using the micro-tensile testing system and compared by those obtained by nano-indentation

• 대한기계학회논문집A
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• 제26권12호
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• pp.2535-2540
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• 2002

ESPI is a noncontact, nondestructive and relatively fast inspection method. For these reasons ESPI is being applied as a valuable tool in the nondestructive evaluation of structural components. Phase shifting ESPI is used more effectively than the traditional ESPI because spatial resolution of small object displacements are improved and numerical phase values are obtained for all pixels in the image. Consequently the quantitative measurement of deformation is possible. ESPI fringe patterns are contaminated with high levels of speckle noise. Therefore the phase image is to be smoothed to remove the noise and obtain a better signal-to-noise ratio. In this study, smoothing is done by phase shifting convolution to avoid smoothing errors close to the 2$\pi$ phase ambiguities in the deformation phase image, and median filter is used as a smoothing filter.

• 한국정밀공학회:학술대회논문집
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• 한국정밀공학회 2005년도 춘계학술대회 논문집
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• pp.1115-1119
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• 2005

The paper proposes the elastic modulus evaluation technique of a cantilever beam by vibration analysis based on time-average electronic speckle pattern interferometry (TA-ESPI) with non-contact and nondestructive and Euler-Bernoulli equation. General approaches for the measurement of elastic modulus of thin film are Nano indentation test, Bulge test and Micro-tensile test and so on. They each have strength and weakness in the preparation of test specimen and the analysis of experimental result. ESPI has been developed as a common measurement method for vibration mode visualization and surface displacement. Whole-field vibration mode shape (surface displacement distribution) at a resonance frequency can be visualized by ESPI. And the maximum surface displacement distribution from ESPI is a clue to find the resonance frequency at each vibration mode shape. And the elastic modules of test material can be easily estimated from the measured resonance frequency and Euler-Bernoulli equation. The TA-ESPI vibration analysis technique is able to give the elastic modulus of materials through the simple processing of preparation and analysis.

• 한국정밀공학회지
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• 제18권5호
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• pp.90-97
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• 2001

An electronic speckle pattern interferometry (ESPI) system for measuring tensile properties under micro-tensile testing has been developed. The system consists of an optical system and an image processing system. In the optical system, optical components for measurement of in-plane deformation are arranged on the path of He-Ne laser. In the image processing system, the window-based program for acquiring speckle pattern interferometric image was developed and deformation in a small specimen is continuously evaluated during the test. Using this system, tensile strain of copper foil was measured during tensile testing. Tensile specimen had the thickness and width of 22 and 500 ${\mu}{\textrm}{m}$, respectively. Tensile properties, including the elastic modulus, yielding strength and tensile strength, of the copper were evaluated and also plastic exponent and coefficient in the Ramberg-Osgood relationship were evaluated from the stress-strain curve.