• 제목/요약/키워드: Micro-Drilling

검색결과 145건 처리시간 0.03초

재료변화에 따른 Micro-EDM에서의 가공성에 관한 연구 (A Study on the Machinability of the Micro-EDM Depending on the Materials)

  • 이상국;김태현;홍민성
    • 한국생산제조학회지
    • /
    • 제21권4호
    • /
    • pp.658-665
    • /
    • 2012
  • Micro-EDM is widely used in metallic pattern, electronics, nuclear power and industry in the form of precision process. The improvement of Electro Discharge Machining has been on a steady progress since $19^{th}$ century. The technology has overcome the limits of the traditional precision process, enabling micro-EDM, micro electrolytic machining, micro drilling, micro punching and laser beam machining, which create versatile products with smaller sizes. What have been known about the major feature of Micro-EDM is high thermal energy so that their products are free from the hardness of their products as long as they are electrical conductor. However, each metal is suspected to have different features and natures even if they are created through the same procedure. In this thesis, the methodology of Micro-EDM and how to categorize them are explained. Also, the nature of the examined materials with surface shape and surface roughnes are analyzed. The results of the experiments are expected to understand surface roughness and workability of other materials for Micro-EDM.

Micro drilling of glass by ECDM

  • 카오후안;최세환;정도관;김도현;주종남
    • 한국정밀공학회:학술대회논문집
    • /
    • 한국정밀공학회 2007년도 춘계학술대회 논문집
    • /
    • pp.291-292
    • /
    • 2007
  • PDF

연질재료의 마이크로 구형렌즈금형 가공특성에 관한 연구 (A Study on the Manufacturing Characteristics for Micro Spherical Lens Mold of Soft Materials)

  • 홍성민;이동주;제태진;최두선;이응숙
    • 한국정밀공학회:학술대회논문집
    • /
    • 한국정밀공학회 2004년도 추계학술대회 논문집
    • /
    • pp.1466-1469
    • /
    • 2004
  • Micro spherical lens mold processing method based on mechanical one completes a spherical shape by setting a diamond tool of hundreds $\mu$m radius on spins with high speed and then using Z-axis vertical feeding motion like the fabrication of micro drilling. In this method, we can see unprocessed parts shaped like cylinder and cone and check increasing chatter marks and burrs by setting errors of the central axis of rotation on the edge of the tool. That is why this method doesn't suit for the optical lens mold. In this paper presents unprocessed parts are disappeared and chatter marks and burrs are decreased from centre of the lens after using Run-out measuring and setting system on run-out occurred from setting tool. Also the fabrication characteristics of 6:4 Brass, A1601, PMMA are compared and analyzed, establishing the optimum machining condition on each material.

  • PDF

2차원 진동 미세가공을 위한 가진테이블 개발 (Development of Excitation Table for 2-dimensional Vibrational Micro Cutting)

  • 김기대;이강희
    • 한국기계가공학회지
    • /
    • 제11권3호
    • /
    • pp.62-67
    • /
    • 2012
  • To realize 2-dimensional vibrational micro cutting in milling and drilling, etc. where the tools rotate, it could be a promising way to vibrate a workpiece instead of a rotating tool itself. In this study, an excitation work-table was developed using two piezoelectric materials orthogonally arranged. The trochoidal trajectory of a cutting tool which is necessary for 2D vibrational cutting is enabled in the excitation condition of higher excitation frequency and larger amplitude of vibration and the cutting condition of smaller diameter of cutting tool and lower spindle speed. The various trochoidal trajectories of a cutting tool could be generated in the excitation work-table by adjusting the input voltages to two piezoelectric materials and the phase between the two voltages and the trajectories could be readily used for the 2D vibrational micro cutting.

이중으로 텍스쳐 된 표면에 충돌하는 액적의 동적 특성 (Dynamic Characteristics of Droplet Impinging on Multi-layer Texture Surfaces)

  • 문주현;이성혁
    • 한국분무공학회지
    • /
    • 제21권1호
    • /
    • pp.58-63
    • /
    • 2016
  • This study presents the dynamic characteristics of an impinging droplet on hydrophobic and hydrophilic surfaces with various texture area fractions. The flat surface was fabricated by using the drilling technique to make micro-meter hole-patterned surfaces, which shows hydrophobic textured surfaces. Moreover, the hydrophilic textured surfaces were manufactured by anodizing technique on the micro-meter hole-patterned surfaces to generate multi-layer surfaces. Impinging droplet experiments were conducted for various hole-patterned surfaces, with changing impact velocity and texture area fractions. It is observed that an anodizing technique increases wettability by decrease in hole diameter on the textured surfaces. However, micro-drilled surfaces decreases wettability because the hole diameter was so large that air can be trapped under the holes. In addition, the maximum spreading diameter decreases with the texture area fraction for the micro-drilled surfaces because of decrease in wettability.

미소 버 형상 측정 방법 개발 (Development of Measurement Method for Micro Burr Geometry)

  • 김원섭;고성림
    • 한국정밀공학회:학술대회논문집
    • /
    • 한국정밀공학회 2002년도 추계학술대회 논문집
    • /
    • pp.407-410
    • /
    • 2002
  • Triangulation method, conoscopic holography method and interferometry method are analyzed for effective measurement of micro burr geometry, which is formed in micro drilling. To select proper sensor, cylinder with 0.5mm diameter is measured and the result shows that conoscopic holography method is effective for measuring highly inclined surface. Burr with 1.0mm height and 30$\mu\textrm{m}$ height are measured by all methods. The conoscopic holography method is probed to be most proper method for measuring micro burr. A Program for 3D display of measured burr is developed.

  • PDF

텅스텐 미세 전극을 이용한 전해 가공 (Electrochemical Machining Using Tungsten Microelectrode)

  • 류시형;유종선
    • 한국정밀공학회지
    • /
    • 제26권4호
    • /
    • pp.134-140
    • /
    • 2009
  • The feasibility of electrochemical drilling and milling on stainless steel are investigated using tungsten microelectrode with $10{\mu}m$ in diameter. For the development of environmentally friendly and safe electrochemical process, citric acid solution is used as electrolyte. A few hundred nanoseconds duration pulses are applied between the microelectrode and work material for dissolution localization. Tool fracture by Joule heating, micro welding, capillary phenomenon, tool wandering by the generated bubbles are observed and their effects on micro ECM are discussed. Occasionally, complex textures including micro pitting corrosion marks appeared on the hole inner surface. Metal growth is also observed under the weak electric conditions and it hinders further dissolutions for workpiece penetration. By adjusting appropriate pulse and chemical conditions, micro holes of $37{\mu}m$ in diameter with $100{\mu}m$ in depth and 26Jim in diameter with $50{\mu}m$ in depth are drilled on stainless steel 304. Also, micro grooves with $18{\mu}m$ width and complex micro hand pattern are machined by electrochemical milling.

PCB드릴링용 공기 베어링 스핀들의 설계 제작 및 성능평가에 관한 연구 (A study on the design, manufacturing and performance evaluation of air bearing spindle for PCB drilling)

  • 김상진;배명일;김형철;김기수
    • 한국정밀공학회지
    • /
    • 제23권4호
    • /
    • pp.29-36
    • /
    • 2006
  • Micro drilling by high-speed air bearing spindle is very useful manufacturing technology in electronic industry For the design of high speed air bearing spindle, there are considered stability of air bearing spindle, allowable load of air bearing, run out and tooling system design for micro drill's attach and remove. According to suggested details, we designed and manufactured high-speed air bearing spindle and carried out performance estimation such as run out, temperature change in running air bearing spindle, stiffness, chucking torque. Results are follows; Run out was measured under $5{\mu}m$ at air bearing spindle revolution $20,000\sim125,000rpm$. High speed air bearing spindle's temperature rose about $20^{\circ}C$ after 5 minutes from running and then was fixed. Allowable thrust load of spindle was 17kgf. Chucking torque of collet was 15kgfcm.

나노초 펄스 레이저 응용 사파이어/실리콘 웨이퍼 미세 드릴링 (Laser Micro-drilling of Sapphire/silicon Wafer using Nano-second Pulsed Laser)

  • 김남성;정영대;성천야
    • 한국정밀공학회지
    • /
    • 제27권2호
    • /
    • pp.13-19
    • /
    • 2010
  • Due to the rapid spread of mobile handheld devices, industrial demands for micro-scale holes with a diameter of even smaller than $10{\mu}m$ in sapphire/silicon wafers have been increasing. Holes in sapphire wafers are for heat dissipation from LEDs; and those in silicon wafers for interlayer communication in three-dimensional integrated circuit (IC). We have developed a sapphire wafer driller equipped with a 532nm laser in which a cooling chuck is employed to minimize local heat accumulation in wafer. Through the optimization of process parameters (pulse energy, repetition rate, number of pulses), quality holes with a diameter of $30{\mu}m$ and a depth of $100{\mu}m$ can be drilled at a rate of 30holes/sec. We also have developed a silicon wafer driller equipped with a 355nm laser. It is able to drill quality through-holes of $15{\mu}m$ in diameter and $150{\mu}m$ in depth at a rate of 100holes/sec.