• 대한기계학회논문집A
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• 제26권5호
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• pp.851-863
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• 2002

Recent industrial requirements for highly precise shape processing have brought the electric discharge machining (EDM) in great need. High precision in EDM is primarily achieved by high performance controllers. However there exists inherent precision loss due to structural micro-deformation. On this background, we study structural deformation characteristics of wire cut EDM via finite element (FE) analysis and axiomatic design. Two different wire cut EDMs are selected as analysis models. 3D CAD package I-Deas is first used to construct FE models of wire cut EDMs, and then ABAQUS FE code is used for following structural analysis. Pertinency of FE mesh refinement is discussed in terms of η -factor. It is shown that performance accuracy of EDM depends strongly on the structural characteristics. Some design enhancements are suggested in an axiomatic design point of view. Finally we provide weight and temperature induced displacement discrepancies between wire end points as position functions of each subframe.

• 한국전기전자재료학회:학술대회논문집
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• 한국전기전자재료학회 2010년도 하계학술대회 논문집
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• pp.260-260
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• 2010

In recent years, polymer/clay nanocomposites have generated a great interest, both in industry and in academia, because they often exhibit remarkable improvement in material properties when compared with the virgin polymer or conventional micro and macro-composites. Among these properties are stiffness, strength, dimensional stability and permeability. [1-3] The dispersion of hydrophilic silicates in a hydrophobic matrix like Polyethylene (PE) is difficult because of the difference in character between PE and Montmorillonite (MMT). Therefore, it is necessary to modify PE with polar groups, which can increase the hydrophilicity of PE. In this study, High density polyethylene (HDPE)/$Mg(OH)_2$/Montmorillonite (MMT) nanocomposites having a various compositions were prepared by a melt blending technique with an internal mixer and properties namely mechanical, morpology, rheological and thermal properties were investigated

• 소성∙가공
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• 제18권4호
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• pp.342-346
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• 2009

Forming characteristics for the bundle extrusion of Cu-Ti bimetal wires are investigated, which can identify the process conditions for weak mechanical bonding at the contact surface during the direct extrusion of a Cu-Ti bimetal wire bundle. Bonding mechanism between Cu and Ti is assumed as a cold pressure welding. Then, the plastic deformation at the contact zone causes mechanical bonding and a new bonding criterion for pressure welding is developed as a function of the principal stretch ratio and normal pressure at the contact surface by analyzing micro local extrusion at the contact zone. The averaged deformation behavior of Cu-Ti bimetal wire is adopted as a constitutive behavior at a material point in the finite element analysis of Cu-Ti wire bundle extrusion. Various process conditions for bundle extrusions are examined. The deformation histories at the three points, near the surface, in the middle and near the center, in the cross section of a bundle are traced and the proposed new bonding criterion is applied to predict whether the mechanical bonding at the Cu-Ti contact surface happens. Finally, a process map for the direct extrusion of Cu-Ti bimetal wire bundle is proposed.

• 한국소성가공학회:학술대회논문집
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• 한국소성가공학회 2005년도 추계학술대회 논문집
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• pp.393-397
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• 2005

A process map has been developed, which can identify the process conditions for weak mechanical bonding at the contact surface during the direct extrusion of a Cu-Ti bimetal wire bundle. Bonding mechanism between Cu and Ti is assumed as a cold pressure welding. Then, the plastic deformation at the contact zone causes mechanical bonding and a new bonding criterion fur pressure welding is developed as a function of the principal stretch ratio and normal pressure at the contact surface by analyzing micro local extrusion at the contact zone. The averaged deformation behavior of Cu-Ti bimetal wire is adopted as a constitutive behavior at a material point in the finite element analysis of Cu-Ti wire bundle extrusion. Various process conditions for bundle extrusions are examined. The deformation histories at the three points, near the surface, in the middle and near the center, in the cross section of a bundle are traced and the proposed new bonding criterion is applied to predict whether the mechanical bonding at the Cu-Ti contact surface happens. Finally, a process map for the direct extrusion of Cu-Ti bimetal wire bundle is proposed.

• 한국정밀공학회:학술대회논문집
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• 한국정밀공학회 2006년도 추계학술대회 논문집
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• pp.539-540
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• 2006

• 한국정밀공학회:학술대회논문집
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• 한국정밀공학회 2009년도 추계학술대회 논문집
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• pp.193-194
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• 2009

• 한국소성가공학회:학술대회논문집
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• 한국소성가공학회 2009년도 추계학술대회 논문집
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• pp.169-172
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• 2009

Multiple scale modeling has been applied to predict defect shape change during the wire rod rolling process. The size difference between bloom and defect prevent using usual FEM approaches due to the enormous number of elements required to depict the defect. The newly developed multiple scale model can visualize defect shape changes during the multi stands rolling process. The defect positioned at the top and side of bloom are smoothed out but the one at the middle evolved as folding or remained as crack. This approach can be used for defect control with roll shape design and initial bloom shape.

• 대한전기학회:학술대회논문집
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• 대한전기학회 2003년도 하계학술대회 논문집 C
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• pp.1469-1471
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• 2003

The effect of heat treatment on torsion characteristics of high nitrogen steel wire has been studied by using torsion test, micro vickers hardness and scanning electron microscopy. After heat treatment at $600{\sim}700^{\circ}C$, torsion cycle was increased with increasing temperature. Especially, in case of high nitrogen steel wire heat treated at $650^{\circ}C$, torsion cycle was sharply increased. It is estimated that the cold-worked high nitrogen steel wire started to recrystallize around at $640^{\circ}C$ in air atmosphere.

• 설비공학논문집
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• 제5권2호
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• pp.85-93
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• 1993

The rise of a large gas bubble or slug in a Micro Two-Phase Closed Thermosyphon with a thin wire insert has been analiged by the potential flow theory. The effect of the interfacial surface tension is explicitly accounted by application of the Kelvin-Laplace equation and solved for the bubble shape. The solution is expressed in terms of the Stokes stream function which consists of an infinite series of Bessel functions. The conditions of the bubble movement in a Micro Two-Phase Closed Thermosyphon were theoretically ascertained.

• Journal of Welding and Joining
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• 제32권3호
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• pp.19-26
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• 2014

Through Silicon Via (TSV) technology is the shortest interconnection technology which is compared with conventional wire bonding interconnection technology. Recently, this technology has been also noticed for the miniaturization of electronic devices, multi-functional and high performance. The short interconnection length of TSV achieve can implement a high density and power efficiency. Among the TSV technology, TSV filling process is important technology because the cost of TSV technology is depended on the filling process time and reliability. Various filling methods have been developed like as Cu electroplating method, molten solder insert method and Ti/W deposition method. In this paper, various TSV filling methods were introduced and each filling materials were discussed.