• Title/Summary/Keyword: Micro patterning

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Polymer Wafer bonding of MEMS device and Cap Wafer with deep cavity (Deep cavity를 가진 Cap Wafer와 MEMS 소자의 Polymer Wafer bonding)

  • Lee, Hyun-Kee;Park, Tae-Joon;Yoon, Sang-Kee;Park, Nam-Su;Park, Hyung-Jae;Min, Jong-Hwan;Lee, Yeong-Gyu
    • Proceedings of the KIEE Conference
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    • 2011.07a
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    • pp.1702-1703
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    • 2011
  • MEMS 소자의 Wafer level Package 관련하여 Deep cavity를 가진 Cap Wafer와 Polymer bonding 중 cavity 단차로 인한 Polymer Patterning 및 접합 불량의 어려움을 극복할 수 있는 새로운 공정 flow를 제안하였다. Cavity를 형성할 때 사용하는 Si deep etching Mask인 기존의 Photoresist를 접합용 감광성 Polymer로 대체하고, cavity 형성 후, 별도의 추가 공정 없이 이 Polymer를 이용해 Wafer bonding을 진행하였다. 이를 통해 cavity 단차에 따른 문제를 해결함과 동시에 공정이 단순하고 제작 비용이 저렴하며, 신뢰성 있는 Wafer level Package를 구현하였다.

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Microfabrication by Localized Electrochemical Deposition Using Ultra Short Pulses (초단펄스 응용 전해증착에 의한 마이크로 구조물 제작)

  • 박정우;류시형;주종남
    • Journal of the Korean Society for Precision Engineering
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    • v.21 no.11
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    • pp.186-194
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    • 2004
  • In this research, microfabrication technique using localized electrochemical deposition (LECD) with ultra short pulses is presented. Electric field is localized near the tool tip end region by applying a few hundreds of nano second pulses. Pt-Ir tip is used as a counter electrode and copper is deposited on the copper substrate in 0.5 M CuSO$_4$ and 0.5 M H$_2$SO$_4$ electrolyte. The effectiveness of this technique is verified by comparison with LECD using DC voltage. The deposition characteristics such as size, shape, surface, and structural density according to applied voltage and pulse duration are investigated. The proper condition is selected from the results of the experiments. Micro columns less than 10 $\mu$m in diameter are fabricated using this technique. The real 3D micro structures such as micro pattern and micro spring can be fabricated by this method. It is suggested that presented method can be used as an easy and inexpensive method for fabrication of microstructure with complex shape.

A NUMERICAL STUDY ON A THIN FILM MANUFACTURING PROCESS USING THE CONTROL OF SURFACE ENERGY OF A MICRODROPLET (미세액적의 표면에너지 제어를 통한 박막 제조 공정에 대한 연구)

  • Suh, Y.;Son, G.
    • 한국전산유체공학회:학술대회논문집
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    • 2008.03a
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    • pp.221-226
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    • 2008
  • Numerical simulation is performed for microdroplet deposition on a pre-patterned micro-structure. The level-set method for tracking the liquid-gas interface is extended to treat the immersed (or irregular-shaped) solid surface. The no-slip condition at the fluid-solid interface as well as the matching conditions at the liquid-gas interface is accurately imposed by incorporating the ghost fluid approach based on a sharp-interface representation. The method is further extended to treat the contact angle condition at an immersed solid surface. The present computation of a patterning process using microdroplet ejection demonstrates that the multiphase characteristics between the liquid-gas-solid phases can be used to improve the patterning accuracy.

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A NUMERICAL STUDY ON A THIN FILM MANUFACTURING PROCESS USING THE CONTROL OF SURFACE ENERGY OF A MICRODROPLET (미세액적의 표면에너지 제어를 통한 박막 제조 공정에 대한 연구)

  • Suh, Y.;Son, G.
    • 한국전산유체공학회:학술대회논문집
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    • 2008.10a
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    • pp.221-226
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    • 2008
  • Numerical simulation is performed for microdroplet deposition on a pre-patterned micro-structure. The level-set method for tracking the liquid-gas interface is extended to treat the immersed (or irregular-shaped) solid surface. The no-slip condition at the fluid-solid interface as well as the matching conditions at the liquid-gas interface is accurately imposed by incorporating the ghost fluid approach based on a sharp-interface representation. The method is further extended to treat the contact angle condition at an immersed solid surface. The present computation of a patterning process using microdroplet ejection demonstrates that the multiphase characteristics between the liquid-gas-solid phases can be used to improve the patterning accuracy.

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Roll-type Micro Contact Printing for Fine Patterning of Metal Lines on Large Plastic Substrate (대면적 미세 금속전극 인쇄를 위한 원통형 마이크로 접촉 인쇄공정)

  • Kim, Jun-Hak;Lee, Mi-Young;Song, Chung-Kun
    • Journal of the Institute of Electronics Engineers of Korea SD
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    • v.48 no.6
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    • pp.7-14
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    • 2011
  • This paper is related to a roll-type micro-contact printing process. The proper parameters such as coating velocity, inking velocity, printing velocity and printing pressure as well as Ag contents of Ag ink were extracted to perform the fine patterning of Ag electrodes. Additionally we developed a process for PDMS with high uniform thickness. Finally, we obtained the Ag fine electrodes on $4.5cm\;{\times}\;4.5cm$ plastic substrate with the line width of 10 um, thickness less than 300 nm, surface roughness less than 40 nm, and the specific resistance of $2.08\;{\times}\;10^{-5}{\Omega}{\cdot}cm$.

Fabrication of PDMS Mold by AFM Based Mechanical TNL Patterning (AFM기반 기계적 TNL 패터닝을 통한 PDMS 몰드제작)

  • Jung, Y.J.;Park, J.W.
    • Journal of the Korean Society of Manufacturing Technology Engineers
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    • v.22 no.5
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    • pp.831-836
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    • 2013
  • This study demonstrates the process of fabricating patterns using tribonanolithography (TNL),with laboratory-made micro polycrystalline diamond (PCD) tools that are attached to an atomic force microscope (AFM). The various patterns are easily fabricated using mechanical scratching, under various normal loads, using the PCD tool on single crystal silicon, which is the master mold for replication in this study. Then, polydimethylsiloxane (PDMS) replica molds are fabricated using precise pattern transfer processes. The transferred patterns show high dimensional accuracy as compared with those of TNL-processed silicon micro molds. TNL can reduce the need for high cost and complicated apparatuses required for conventional lithography methods. TNL shows great potential in that it allows for the rapid fabrication of duplicated patterns through simple mechanical micromachining on brittle sample surfaces.

A Comparative Study on the Influence of Etchant upon the Etching Rate and Quality in Laser Induced Wet Etching of Fused Silica (식각액에 따른 용융실리카의 레이저 습식 식각 특성 비교 연구)

  • 이종호;이종길;전병희
    • Transactions of Materials Processing
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    • v.13 no.3
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    • pp.268-272
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    • 2004
  • Transparent materials such as fused silica are widely utilized in optical and optoelectronics field because of its outstanding properties, such as transparency in a wide wavelength range, strong damage resistance for laser irradiation, and high thermal and chemical stability. In this study, we made a few micro patterns on the surface of fused silica plate using laser induced wet etching. KrF excimer laser was used as a light source. There were no burrs and micro cracks on the etched surface of fused silica and the flatness of the etched surface was fairly good. We investigated the influence of etchant upon the etch rate and quality in laser induced wet etching. Pyrene-acetone solution and toluene were used as etchant. In the side of etch rate, toluene solution was better than pyrene-acetone solution. But we made in wider range of energy density using pyrene-acetone solution. But pyrene-acetone solution gave us wider window of energy density for successful micro patterning.

The fabrication of micro- size conductor lines on alumina patterned by laser ablation (레이저 직접 묘화법에 의한 알루미나 기판위의 미세 전도성 패턴 제작)

  • 김혜원;이제훈;신동식;강성군
    • Proceedings of the Korean Society of Precision Engineering Conference
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    • 2003.06a
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    • pp.1889-1892
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    • 2003
  • The fabrication of micro-size patterning on alumina substrate is generated by laser direct writing, which has high precision and selectivity of various laser beam energies. The depth and width of patterns is affected by laser parameter such as laser power, scan rate. Through the chemical and mechanical polishing Pd seeds was effectively got rid of alumina substrate for selectivity electroless Ni plating. Thermal treatment is good method for changing electrical property of conductor line, because the treatment can control of the grain size.

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Fabrication of 1-${\mu}m$ channel length OTFTs by microcontact printing

  • Shin, Hong-Sik;Baek, Kyu-Ha;Yun, Ho-Jin;Ham, Yong-Hyun;Park, Kun-Sik;Lee, Ga-Won;Lee, Hi-Deok;Wang, Jin-Suk;Lee, Ki-Jun;Do, Lee-Mi
    • 한국정보디스플레이학회:학술대회논문집
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    • 2009.10a
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    • pp.1118-1121
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    • 2009
  • We have fabricated inverted staggered pentacene Thin Film Transistor (TFT) with 1-${\mu}m$ channel length by micro contact printing (${\mu}$-CP) method. Patterning of micro-scale source/drain electrodes without etching was successfully achieved using silver nano particle ink, Polydimethylsiloxane (PDMS) stamp and FC-150 flip chip aligner-bonder. Sheet resistance of the printed Ag nano particle films were effectively reduced by two step annealing at $180^{\circ}C$.

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Development of Micro-machined Heat Flux Sensor by using MEMS technology (MEMS를 이용한 미세 열유속센서의 개발)

  • Yang, Hoon-Cheul;Song, Chul-Hwa;Kim, Moo-Hwan
    • Proceedings of the KSME Conference
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    • 2004.04a
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    • pp.1364-1369
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    • 2004
  • New method for the design, fabrication, and calibration of micro-machined heat flux sensor has been developed. Two types of micro-machined heat flux sensor having different thicknesses of the thermal-resistance layer are fabricated using the MEMS technique. Photo-resist patterning using a chrome mask, bulk-etching and copper-nickel sputtering using a shadow mask are applied to make heat flux sensors, which are calibrated in the convection-type heat flux calibration facility. The sensitivity of the device varies with thermal-resistance layer, and hence can be used to measure the heat flux in heat-transfer phenomena.

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