• Journal of Institute of Control, Robotics and Systems
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• v.15 no.9
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• pp.916-921
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• 2009

The technology to inspect and measure an inner structure of micro parts has become an important tool in the semi-conductor industrial field with the development of automation and precision manufacturing. Especially, the inspection skill on the inside of highly integrated electronic device becomes a key role in detecting defects of a completely assembled product. X-ray inspection technology has been focused as a main method to inspect the inside structure. However, there has been insufficient research done on the customized inspection technology for the flip-chip assembly due to the interior connecting part of flip chip which connects the die and PCB electrically through balls positioned on the die. In this study, therefore, it is implemented to detect shape error of flip chip bonding without damaging chips using an x-ray inspection system. At this time, it is able to monitor the solder bump shape by introducing an edge-extracting algorithm (exponential approximation function) according to the attenuating characteristic and detect shape error compared with CAD data. Additionally, the bonding error of solder bumps is automatically detectable by acquiring numerical size information at the extracted solder bump edges.

• Corrosion Science and Technology
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• v.10 no.2
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• pp.60-64
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• 2011

Lean duplex stainless steels have been developed in Korea for the purpose of being used in the seawater systems of industry. There are also many important seawater systems in nuclear power plants. These systems supply seawater to cooling water condenser tubes, heat exchanger tubes, related pipes and chlorine injection systems. The flow velocity of some part of seawater systems in nuclear power plants is high and damages of components from corrosion are severe. The considered lean duplex stainless steels are STS329LD (20.3Cr-2.2Ni-1.4Mo) and STS329J3L (22.4Cr-5.7Ni-3Mo) and PRENs of them are 29.4 and 37.3 respectively. Physical, mechanical and micro-structural properties of them are evaluated, and electrochemical corrosion resistance is measured quantitatively in NaCl solution. Critical Pitting Temperatures (CPT)s are measured on these alloys and pit depths are evaluated using laser microscope. Long period field tests on these alloys are now being performed, and some results are going to be presented in the following study.

• Korean Journal of Materials Research
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• v.12 no.5
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• pp.398-406
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• 2002

VAR process is required to control its various operating parameters. Heat transfer simulation has been accomplished to understand development of solidification micro and macro-structures during VAR process in Ti alloys. Optimum VAR process parameters could be also estimated in this study. It was found that macro-structures were closely related to the shape and depth of liquid pool, and solidification parameters, such as temperature gradient, heat flux, solid fraction. The cooling rates were higher at bottom, top, and center part respectively. As cooling rates increased, the $\alpha$ phase decreased in length, width and fraction. In order to evaluate which parameter affects the result of heat transfer calculation most sensitively, the sensitivities of input parameters to the simulation result were examined. The pool depth and cooling rate showed more sensitive to the temperature of the molten metal, heat transfer coefficient, and liquidus respectively. Also, these thermal properties became more sensitive at higher temperatures.

• The Journal of the Korea institute of electronic communication sciences
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• v.7 no.1
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• pp.9-14
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• 2012

In this study, the diplexer used a separator or a combine of signals was designed and its characteristics were investigated. The diplexer consists of two fixed tuned bandpass filter such as low pass filter(LPF) and high pass filter(HPF) sharing a common part and was simulated. The diplexer with micro-strip structure was fabricated. The LPF of diplexer has insertion loss of -0.4 dB, return loss of -30 dB and 1.6 GHz cut-off frequency and HPF has insertion loss of -0.8 dB, return loss of -30 dB and 1.9 GHz cut-off frequency, respectively.

• Journal of the Korean institute of surface engineering
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• v.42 no.4
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• pp.173-178
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• 2009

DLC film was synthesized on plastic injection mold(SKD11, $30\;mm\;{\times}\;19\;mm\;{\times}\;0.5\;mm$) and Si(100) wafer for 2 h at $130^{\circ}C$ under 6 mTorr using hybrid method of rf sputtering and ion source. The obtained film was analysed by Raman spectroscopy, AFM, TEM, Nano indenter and scratch tester, etc. The film was defined as an amorphous phase. In the Raman spectrum, broad peak of $sp^2$-bonded carbon attributed to graphite at $1550\;cm^{-1}$ were observed, and the ratio of ID($sp^3$ diamond intensity)/IG($sp^2$ graphite intensity) was approximately 0.54. The adhesion of DLC film was more than 80 N with scratch tester when $0.2\;{\mu}m$ thickness Cr was coated as interlayer. The micro-hardness was distributed at 35~37 GPa. The friction coefficient was 0.02~0.07, and surface roughness(Ra) was 0.34~1.64 nm. The lifetime of DLC coated plastic injection mold using as a connector part in computer was more than 2 times of non-coated mold.

• The KIPS Transactions:PartC
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• v.9C no.6
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• pp.927-934
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• 2002

In order to provide various multimedia services in a wireless network, the call admission control for wireless channels should be resolved at the time of call setup and handoff by moving mobile terminal. In this paper. we propose a reliable DCAC( Distributed Call Admission Control)scheme using virtual cluster concept. The proposed DCAC scheme considers the state of $1^{st}$ and $2^{nd}$ adjacent cells to provide a reliable call handling. The proposed scheme is analyzed by simulations and mathematical methods.

• Journal of Korean Institute of Industrial Engineers
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• v.39 no.3
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• pp.149-155
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• 2013

Electric discharging machining (EDM) is commonly adopted to machine the precise and tiny part when it is difficult to meet the productivity and the tolerance by the conventional cutting method. The die-sinking EDM method works well to machine the micro-parts and the perpendicular wall of die and mould, whereas EDM drilling, called super drill, is excellent to machine the deep and narrow hole regardless the material hardness and the hole location. However, the electrode wear is rapid compared to the conventional cutting tool and makes it difficult to control the electrode feeding and to machine precisely. This paper presents an efficient method to estimate the electrode wear using hole pass-through experiment while the stochastic method is used to compensate for the estimation model. To validate the proposed method, the commercial EDM drill machine is used. The experiment result shows that the electrode wear amount can be predicted very precisely.

• Proceedings of the Korean Society for Technology of Plasticity Conference
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• 2005.05a
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• pp.329-332
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• 2005

Cross rolling process is one of incremental forming processes to form an axi-symmetric shaped metal component. It can be classified into two types according to the shape of dies, which are a drum type (roll type) and a plate type (straight type). It can also be classified into a wedge type and a ramp type processes according to deformation characteristics of a material. The ramp type die is applied to plate type cross rolling process in cold forming process for forming of teeth of gear or bolt, while the wedge type die is generally utilized to drum type and plate type cross rolling processes in hot forming process. A shape of the ramp type die is usually same as final shape of a product at every section of a progressing direction, while the shape of the wedge type die has different shapes in a progressing direction. In this paper, a rolling of neck part in a ball stud component has been carried out using the plate type cross rolling process with a ramp shaped die. Forming characteristics have been performed using finite element analysis in order to obtain a proper preform for the ramp type plate cross rolling process.

• Journal of the Mineralogical Society of Korea
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• v.3 no.1
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• pp.44-57
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• 1990

Mineralogy of clay(Napseok) deposits in Yangsan area has been studied by the methods of field investigation and laboratory works including the polarizing microscopy, X-ray diffraction, infrared spectroscopy, thermal analysis, chemical analysis by electron micro-probe and atomic absorption spectrophotometer, and electron microscopy(SEM and TEM). The Napseok ores in both the Cheonbulsan and Yongcheon deposits consist mainly of sericite, pyrophyllite and quartz, with more or less tourmaline. The high temperature minerals such as corundum and dumortierite are found in the Cheonbulsan deposit, but not in the Yongcheon deposits. Dickite, nacrite, and halloysite are found in the Yongcheon deposit, but not in the Cheonbulsan deposit. The Napseok ores of the Yukwang deposit consist of sericite posits in the Yangsan area. Occurrence, chemistry and structural features of important minerals are described. Mineralogical data of sericite such as intensity raios and chemistry also support that the Napseok deposits of both the Chenobulsan and Yongcheon mines were formed at the higher temperature than those of the Yukwang mine. Presence of sericite-dickite-pyrophyllite ores in the Yongcheon deposit also suggests the lower temperautre than in the Cheonbulsan deposit.

• Journal of the Korean Society for Precision Engineering
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• v.17 no.1
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• pp.145-152
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• 2000

X-ray diffraction method detects change of crystal lattice distance under material surface using diffraction angle 2$\theta$. This technique can be applied to the behavior on slip band and micro crack due to material degradation. The relation between half-value breadth and number of cycle has three stages which constitute rapid decrease in initial number of cycles, slight decrease in middle number of cycles and rapid decrease in final number of cycles. The ratio of half-value breadth takes a constant value on B/B$_{0}$-N diagram with loading condition except early part of fatigue life. The ratio of half-value breadth B/B$_{0}$ with respect to number of cycle to failure N$_{f}$ has linear behavior on B/B$_{0}$-log N$_{f}$ diagram. Therefore, in this paper the estimation of fatigue life by average gradient method has much less estimated mean error than the estimation of fatigue life by log B/B$_{0}$-log N/N$_{f}$ relation.elation.ation.