• 한국금형공학회:학술대회논문집
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• 한국금형공학회 2008년도 하계 학술대회
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• pp.51-54
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• 2008

Drill process is usually used to manufacture a industry about processing, Therefore, the burr problem is very significant, The burrs took place when drill process. And then, sometimes, the burrs are often caused of some problems during automatic such as no good quality products and having good surface roughness products. And also, this paper had some experiments using magnesium. Specially, the magnesium is one of the non-ferromagnetic materials. Magnesium has attracted a lot of interest for using the industry. They offer a possible alternative to steel and aluminum in automotive and aero industries to satisfy the lightweight requirement. also, magnesium has good specific strength and absorbs vibration in occurring working process. So, it has good quality of product processing. And then, it is one of the lightest materials being used to electronic product's cases and automotive because of lightweight and miniaturization. But this material has not widely used all of the industry due to its natural property. If the magnesium is contacted water, it will cause the exploration. But, nowadays many of people study magnesium to safe their experiment and to widely use this industry.

• 한국자기학회:학술대회 개요집
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• 한국자기학회 2013년도 자성 및 자성재료 국제학술대회
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• pp.95-95
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• 2013

The NdFeB magnet can be classified into the sintered magnet and bonded magnet. The former has superior magnet characteristics but the degree of freedom in shape is highly restricted, whereas the latter has a high degree of freedom, but its magnet characteristics are inferior to the former. When a NdFeB magnet is used at the elevated temperature, part of Nd must be replaced with a high priced Dy to increase its coercive force. For these reasons, a Dy free and high performance NdFeB bonded magnet is desired strongly. The author successfully developed a Dy free NdFeB anisotropic bonded magnet based on discovery of new phenomena called as d-HDDR reaction and its mass production process such as a thermally balanced hydrogen reaction furnace, micro capsuled powder, compression molding / injection molding under magnetic field, magnetic die and so on. Applied to DC brush seat motor for automotive use, the motor has become 50% small in size and weight. The commercialization of a half sized motor for automotive use has been realized up to the market share of 30%. At present, its commercialization is extending to various types of motors such as power tool, ABS motor, wiper motor, window motor, electric bike power motor, and compressor motor. It is expected that the applications will be increasingly enlarged to EV motor, wind generator, EPS motor, washing machine, and glass cutting machine. This innovative technology has realized Dy free high performance magnet and mudt make big contribution to not only rare element strategies but also energy conservation.

• 한국신뢰성학회지:신뢰성응용연구
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• 제7권1호
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• pp.23-29
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• 2007

Probe card is a test component which is to classify the known good die with electrical contact before the packaging in the ATE (automatic testing equipment). Conventional probe tip was mostly needle type, it has been difficult to meet with conventional type, because of decreasing chip size, pad to pad pitch and pads size increasingly. For that reason, probe cards using MEMS (micro electro mechanical system) technology have been developed for various semiconductor chips. In this paper, Area Array type MEMS Probe tip was designed,, fabricated, and characterized its mechanical and electrical properties. The authors found that good electrical characteristics under $1{\Omega}$ were acquired with gold (Au) and aluminium (Al) pad contact test over 0.5gf and 4gf respectively. And, contact resistance variation under $0.1{\Omega}$ were achieved with 100,000 times of repetition test. And, insertion loss (IS) for high frequency operation was ascertained over 300MHz at -3dB loss.

• 한국소성가공학회:학술대회논문집
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• 한국소성가공학회 2004년도 제3회 금형가공 심포지엄
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• pp.260-265
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• 2004

LTCC(Low temperature co-fired ceramic) is being recognized as a significant packaging material of electrical devices for the advantages such as relatively low temperature being needed for process, low conductor resistance and high printing resolution. In the process of LTCC electrical devices, the punched via-hole quality is one of the most important factors on the performance of the device. However, its mechanism is very complicated and optimization of the process seems difficult. In this paper, to clarify the process, via-hole punching experiments were carried out and the punched holes were examined in terms of their burr formation. The effects of thickness of PET sheet and ceramic sheet and punch-to-die clearance on via-hole quality were also discussed. Optimum process conditions are proposed and a factor k is introduced to express effect of the process variables.

• 한국레이저가공학회지
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• 제18권2호
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• pp.1-4
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• 2015

This study is related to the surface hardening treatment to spheroidal graphite cast iron for die by using high power diode laser. Laser device used in this experiment is capable of real-time laser power control. This is because the infrared temperature sensor (two color pyrometer) attached to the optical system measures the surface temperature of specimen and adjusts the laser power in real time. The surface treatment was carried out with the change of heat treatment temperature at the beam travel speed 3 mm/sec. Hardened width and depth was measured and hardened zone was analyzed by micro vickers hardness test in order to research the optimum condition of heat treatment. The changes in microstructure of the hardened zone also was examined. As a result of hardness measurement and observations on microstructure of hardened zone, hardness increased over three times as compared with base metal because the martensite was formed on the matrix structure.

• 전자공학회논문지SC
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• 제40권1호
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• pp.19-29
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• 2003

본 논문에서는 기존의 방법과는 달리 4 단계의 보정 기법을 적용하여 미세한 적외선 (infrared : IR) 신호를 검출해내는 비냉각 적외선 센서 어레이를 위한 CMOS 신호 검출회로를 제안한다. 제안하는 신호 검출회로는 11 비트의 A/D 변환기 (analog-to digital converter : ADC)와 7 비트의 D/A 변환기(digital to-analog converter : DAC), 그리고 자동 이득 조절 회로 (automatic gain control circuit : AGC)로 구성되며, 비냉각 센서 어레이를 동작시키는 DC 바이어스 전류 성분, 화소간의 특성 차이에 의한 변화 성분과 자체 발열 (self-heating)에 의한 변화 성분을 포함하는 적외선 센서 어레이의 출력 신호로부터 미세한 적외선 신호 성분만을 선택적으로 얻어낸다. 제안하는 A/D 변환기에서는 병합 캐패시터 스위칭(merged-capacitor switching : MCS) 기법을 적용하여 면적 및 전력 소모를 최소화하였으며, D/A 변환기에서는 출력단에 높은 선형성을 가지는 전류 반복기를 사용하여 화소간의 특성 차이에 의한 변화 성분과 자체 발열에 의한 변화 성분을 보정할 수 있도록 하였다. 시제품으로 제작된 신호 검출회로는 1.2 um double-poly double-metal CMOS 공정을 사용하였으며, 4.5 V 전원전압에서 110 ㎽의 전력을 소모한다. 제작된 시제품으로부터 측정된 검출회로의 differential nonlinearity (DNL)와 integral nonlinearity (INL)는 A/D 변환기의 경우 11 비트의 해상도에서 ±0.9 LSB와 ±1.8 LSB이며, D/A 변환기의 경우 7비트의 해상도에서 ±0.1 LSB와 ±0.1 LSB이다.

• Design & Manufacturing
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• 제15권2호
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• pp.11-16
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• 2021

Recently, three-dimensional (3D) cell culture systems, which are superior to conventional two-dimensional (2D) vascular systems that mimic the in vivo environment, are being actively studied to reproduce drug responses and cell differentiation in organisms. Conventional two-dimensional cell culture methods (scaffold-based and non-scaffold-based) have a limited cell growth rate because the culture cannot supply the culture medium as consistently as microvessels. To solve this problem, we would like to propose a 3D culture system with an environment similar to living cells by continuously supplying the culture medium to the bottom of the 3D cell support. The 3D culture system is a structure in which microvascular structures are combined under a scaffold (agar, collagen, etc.) where cells can settle and grow. First, we have manufactured molds for the formation of four types of microvessel-mimicking chips: width / height ①100 ㎛ / 100 ㎛, ②100 ㎛ / 50 ㎛, ③ 150 ㎛ / 100 ㎛, and ④ 200 ㎛ / 100 ㎛. By injection molding, four types of microfluidic chips were made with GPPS (general purpose polystyrene), and a 100㎛-thick PDMS (polydimethylsiloxane) film was attached to the top of each microfluidic chip. As a result of observing the flow of the culture medium in the microchannel, it was confirmed that when the aspect ratio (height/width) of the microchannel is 1.5 or more, the fluid flows from the inlet to the outlet without a backflow phenomenon. In addition, the culture efficiency experiments of colorectal cancer cells (SW490) were performed in a 3D culture system in which PDMS films with different pore diameters (1/25/45 ㎛) were combined on a microfluidic chip. As a result, it was found that the cell growth rate increased up to 1.3 times and the cell death rate decreased by 71% as a result of the 3D culture system having a hole membrane with a diameter of 10 ㎛ or more compared to the conventional commercial. Based on the results of this study, it is possible to expand and build various 3D cell culture systems that can maximize cell culture efficiency by cell type by adjusting the shape of the microchannel, the size of the film hole, and the flow rate of the inlet.

• Design & Manufacturing
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• 제13권4호
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• pp.10-16
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• 2019

Semiconductor chip is bonded to the substrate by melting solder bumps. In general, the chip bonding is applied by a Reflow process or a Thermo-Compression(TC) bonding process. In this paper, we introduce a Laser Assisted Thermo-Compression bonding (LATCB) process to improve the anxiety of the existing process(Reflow, TC bonding). In the LATCB process, the chip is bonded to the substrate by irradiating a laser with a uniform energy density in the same area as the chip to melt only the solder bumps and press the chip with a Transparent Compression Module (TCM). The TCM consists of a fused silica header for penetrating the laser and pressurizing the chip, and a piezoelectric actuator (P.A.) coupled to both ends of the header for micro displacement control of the header. In addition, TCM is a structure that can pressurize the chip and deliver it to the chip and solder bumps without losing the energy of the laser. Fused silica, which is brittle, is vulnerable to deformation, so the header may be damaged when an external force is applied for pressurization or a displacement differenced is caused by piezoelectric actuators at both ends. On the other hand, in order to avoid interference between the header and the adjacent chip when pressing the chip using the TCM, the header has a notch at the bottom, and breakage due to stress concentration of the notch is expected. In this study, the thickness and notch length that the header does not break when the external force (500 N) is applied to both ends of the header are optimized using structural analysis and Coulomb-Mohr failure theory. In addition, the maximum displacement difference of the P.A.s at both ends where no break occurred in the header was derived. As a result, the thickness of the header is 11 mm, and the maximum displacement difference between both ends is 8 um.

• Design & Manufacturing
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• 제11권2호
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• pp.51-56
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• 2017

Nitinol, a shape memory alloy (SMA), is manufactured from titanium and nickel and it used in various fields such as electrical applications, micro sensors. It is also recommended as a material in medical for implant because it has excellent organic compatibility. Nitinol is intended to be inserted into the human body, products require a high-quality surface and low residual stress. To overcome this problems, explore electrolyte polishing (EP) is being explored that may be appropriate for use with nitinol. EP is a particularly useful machining method because, as a non contact machining method, it produces neither machining heat nor internal stress in the machined materials. Sandpaper polishing is also useful machining method because, as a contact machining method, it can easily good surface roughness in the machined materials. The electrolyte polishing (EP) process has an effect of improving the surface roughness as well as the film polishing process, but has a characteristic that the residual stress is hardly generated because the work hardened layer is not formed on the processed surface. The sandpaper polishing process has the effect of improving the surface roughness but the residual stress remains in the surface. We experimented with three conditions of polishing process. First condition is the conventional polishing. Second condition is the electrochemical polishing(EP). And Last condition is a mixing process with the conventional polishing and the EP. Surface roughness and residual stress of the nitinol before a polishing process were $0.474{\mu}mRa$, -45.38MPa. Surface roughness and residual stress of the nitinol after mixing process of the conventional polishing and the EP were $1.071{\mu}mRa$, -143.157MPa. Surface roughness and residual stress of the nitinol after conventional polishing were $0.385{\mu}mRa$ and -205.15MPa. Surface roughness and residual stress of sandpaper and EP nitinol were $1.071{\mu}mRa$, -143.157MPa. The result shows that the EP process is a residual stress free process that eliminates the residual stress on the surface while eliminating the deformed layer remaining on the surface through composite surface machining rather than single surface machining. The EP process can be used for biomaterials such as nitinol and be applied to polishing of wafers and various fields.

• Design & Manufacturing
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• 제13권2호
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• pp.30-36
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• 2019

Traditional cell culture(2-dimensional) is the method that provide a nutrient and environment on a flat surface to cultivate cells into a single layer. Since the cell characteristics of 2D culture method is different from the characteristics of the cells cultured in the body, attempts to cultivate the cells in an environment similar to the body environment are actively proceeding in the industry, academy, and research institutes. In this study, we will develop a technology to fabricate micro-structures capable of culturing cells on surfaces with various curvatures, surface shapes, and characteristics. In order to fabricate the hemispheric plastic structure(thickness $50{\mu}m$), plastic preform mold (hereinafter as "preform mold") corresponding to the hemisphere was first prepared by injection molding in order to fabricate a two - layer structure to be combined with a flat plastic film. Then, thermoplastic polymer dissolved in an organic solvent was solidified on a preform mold. As a preliminary study, we proposed injection molding conditions that can minimize X/Y/Z axis deflection value. The effects of the following conditions on the preform mold were analyzed through injection molding CAE, [(1) coolant inlet temperature, (2) injection time, (3) packing pressure, (4) volume-pressure (V/P). As a result, the injection molding process conditions (cooling water inlet temperature, injection time, holding pressure condition (V / P conversion point and holding pressure size)) which can minimize the deformation amount of the preform mold were derived through CAE without applying the experimental design method. Also, the derived injection molding process conditions were applied during actual injection molding and the degree of deformation of the formed preform mold was compared with the analysis results. It is expected that plastic film having various shapes in addition to hemispherical shape using the preform mold produced through this study will be useful for the molding preform molding technology and cast molding technology.