• Journal of the Korean Recycled Construction Resources Institute
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• v.10 no.3
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• pp.269-275
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• 2022

In this study, the setting time and compressive strength of cement paste composites applied with nano-micro pozzolanic binders were experimental analyzed. The pozzolanic binder was reduced initial and final setting time and the compressive strength was increased. Micro silica was effective in decrease the initial setting and final setting time and impressing the compressive strength. When two or more cement binders were used, the using of silica fume and a small amount of nano silica at reduced the setting time to 62-64 % to OPC cement and the compressive strength was increased to 117 %. A small amount of mixing the nano silica was effect to pore filling and pozzolanic activation. However, the addition of a chemical admixture should be considered when mixing table design because pozzolanic binders high specific surface area causes a decrease in cement composites flow.

• International Journal of Precision Engineering and Manufacturing
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• v.7 no.4
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• pp.3-7
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• 2006

Confocal scanning microscopy is a measurement technique used to observe micrometer and sub-micrometer features due to its high resolution, nondestructive properties, and 3D surface profiling capabilities. The design, implementation, and performance test of a confocal scanning microscopy system are presented in this paper. A short-wavelength laser (405 nm) and an objective lens with a high numerical aperture (0.95) were used to achieve the desired high resolution, while the x- and y-axis scans were implemented using an acousto-optic deflector and galvanomirror, respectively. An objective lens with a piezo-actuator was used to scan the z-axis. A spatial resolution of less than 138 nm was achieved, along with successful 3D surface reconstructions.

• KSTLE International Journal
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• v.5 no.2
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• pp.37-43
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• 2004

Abstract : Nano/micro-scale friction properties were investigated on Si (100) and three self-assembled monolayers (SAMs) (PFOTC, DMDM, DPDM) coated on Si-wafer by chemical vapor deposition technique. Experiments were conducted at ambient temperature(24$pm$1$circ$C) and humidity(45$pm$5%). Friction at nano-scale was measured using Atomic Force Microscopy (AFM) in the range of 0-40nN normal loads. In both Si-wafer and SAMs, friction increased linearly as a function of applied normal load. Results showed that friction was affected by the inherent adhesion in Ssi-wafer, and in the case of SAMs the physical/chemical structures had a major influence. Coefficient of friction of these test samples at the micro-scale was also energies. In order to study the effect of contact area on coefficient of friction at the micro-scale, friction was measured for Si-wafer and DPDM against Soda Lime balls (Duke Scientiffic Corporation) of different radii (0.25 mm, 0.5 mm and 1 mm) at different applied normal loads (1500, 3000 and 4800 mN). Results showed that Si-wafer had higher coefficient of friction than DPDM. Further, unlike that in the case of DPDM, friction in Si-wafer was severely influenced by its wear. SEM evidences showed that solid-solid adhesion was the wear mechanism in Si-wafer.

• Transactions on Electrical and Electronic Materials
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• v.16 no.5
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• pp.260-263
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• 2015

Epoxy/micro-sized alumina composite was prepared and the effects of alumina content on the electrical and mechanical properties were investigated in order to develop an insulation material for gas insulated switchgear (GIS). Nano-sized alumina (average particle size: 30 μm) was also incorporated into the epoxy/micro-sized alumina composite. An electrical insulation breakdown strength test was carried out in sphere-sphere electrodes and the data were estimated by Weibull statistical analysis. Tensile strength was measured at a crosshead speed of 10 mm/min using a universal testing machine. Alumina content was varied from 0 wt% to 70 wt%.). As micro-sized alumina content increased, insulation breakdown strength increased until 40 wt% alumina content and decreased after that content. The tensile strength of a neat epoxy system was 82.2 MPa and that value for 60 wt% alumina content was 91.8 MPa, which was 111.7% higher than inthe neat epoxy system. The insulation breakdown strength of micro-sized alumina (60 wt%)/nano-sized alumina (1 phr) glycerol diglycidyl ether (GDE) (1 phr) composite was 54.2 MPa, which was 116% higher than the strength of the system without nano-sized alumina.

• Bulletin of the Korean Chemical Society
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• v.26 no.10
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• pp.1539-1542
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• 2005

We have introduced polyelectrolyte micro-patterning technique employing agarose plane stamp and a hard substrate having microscale features on its surface. With this method, chemically micropatterned surfaces with both positive and negative functionalities were successfully embedded in well-defined microstructures, and selective impartment of charge functionalities was confirmed by patterning bead bearing surface charge. Furthermore, this technique allows highly sensitive immobilization of protein onto targeted surface simply by endowing functionalities, which extends the potential of its use as a tool for high-throughput protein microarray and proteomics. Because plane agarose stamp is free of structures on its surface, there is no concern for pattern collapse, and the combination of agarose plane stamp with patterned substrate is more suited for selective protein patterning compared with adopting surface-patterned agarose stamp with flat substrate. Our technique using agarose plane stamp and a substrate having microscale features on its surface suggests a range of possible applications, including the micropatterning of biofunctionalized copolymer having polyelectrolyte block, immobilization of micro- and nanoparticle with biofunctionalities such as biotin and streptavidine, and establishing optoelectronic microstructures with micro-beads on various surfaces.

• Tribology and Lubricants
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• v.38 no.3
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• pp.93-100
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• 2022

Micro-light emitting diode (micro-LED) displays offer numerous advantages such as high brightness, fast response, and low power consumption. Hence, they are spotlighted as the next-generation display. However, defective LEDs may be created due to non-uniform contact loads or LED alignment errors. Therefore, a repair process involving the replacement of defective LEDs with favorable ones is necessitated. The general repair process involves the removal of defective micro-LEDs, interconnection material transfer, as well as new micro-LED transfer and bonding. However, micro-LEDs are difficult to repair since their size decreases to a few tens of micron in width and less than 10 ㎛ in thickness. The conventional nozzle-type dispenser for fluxes and the conventional vacuum chuck for LEDs are not applicable to the micro-LED repair process. In this study, transfer conditions are determined using a micro stamp for repairing micro-LEDs. Results show that the aging time should be set to within 60 min, based on measuring the aging time of the flux. Additionally, the micro-LEDs are subjected to a compression test, and the result shows that they should be transferred under 18.4 MPa. Finally, the I-V curves of micro-LEDs processed by the laser and hot plate reflows are measured to compare the electrical properties of the micro-LEDs based on the reflow methods. It was confirmed that the micro-LEDs processed by the laser reflow show similar electrical performance with that processed by the hot plate reflow. The results can provide guidance for the repair of micro-LEDs using micro stamps.

• Proceedings of the Korean Society of Machine Tool Engineers Conference
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• 2005.05a
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• pp.48-53
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• 2005

The world, coming into the 21st century, is preparing a new revolution called a knowledge-based society after the industrial society. The interest of the world is concentrated on information technology, nano-technology and biotechnology. In particular, the nano-technology of which study was originally started from an alternative for overcoming semiconductor micro-technology. It can be applied to most industry subject such as electronics, information and communication, machinery, chemistry, bioengineering, energy, etc. They are emerging into the technology that can change civilization of human beings. Specially, ultra precision machining is quickly applied to nano-technology in the field of machinery. Lately, with rapid development of electronics industry and optic industry, there are needs for super precision finishing of various core parts required in such related apparatuses. This paper handles stability of a super precision micro cutting machine that is a core unit of such a super precision finisher, and analyzes the results depending on the hinge type and material change, using FEM analysis. By reviewing the stability, it is possible to achieve the effect of basic data collection for unit control and to reduce trials and errors in unit design and manufacturing.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2010.06a
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• pp.99-99
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• 2010

Polymer nanocomposite has been attracting much attention as a new insulation material, since homogeneous dispersion of nm-sized inorganic fillers can improve various properties significantly. In this paper, various kinds of epoxy based nanocomposites were made and AC breakdown strength of Nano-TiO2 and micro-silica filler mixture of epoxy based composites were studied by sphere to sphere electrode. Moreover, nano- and micro-filler combinations were adopted as an approach toward practical application of nanocomposite insulation materials. Nano-TiO2 particle size is about 10nm and composites ratio was resin (100) : hardener (82) : accelerator (1.5). AC breakdown test was performed at room temperature (25 [$^{\circ}C$], 80 [$^{\circ}C$] and 100 [$^{\circ}C$] in the vicinity of Tg (90[$^{\circ}C$]). And thermal conductivity were measured by ASTM-D5470.

• Journal of the Korean Society for Precision Engineering
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• v.24 no.5
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• pp.89-96
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• 2007

Inkjet printing has become one of the most attractive manufacturing techniques in industry. Especially inkjet printing technology will soon be part of the PCB (Printed Circuit Board) fabrication processes. Traditional printing on PCB includes screen printing and photolithography. These technologies involve high costs, time-consuming procedures and several process steps. However, by inkjet technology manufacturing time and production costs can be reduced, and procedures can be more efficient. PCB manufacturers therefore willingly accept this inkjet technology to the PCB industry, and are quickly shifting from conventional to inkjet printing. To produce the printed circuit board by the inkjet technology, it must be harmonized with conductive nano ink, printing process, system, and inkjet printhead. In this study, micro patterning of conductive line has been investigated using the piezoelectric printhead driven by a bipolar voltage signal is used to dispense 20-40 ${\mu}m$ diameter droplets and silver nano ink which consists of 1 to 50 nm silver particles that are homogeneously suspended in an organic carrier. To fabricate a conductive line used in PCB with high precision, a printed line width was calculated and compared with printing results.

• Transactions of the Korean Society of Mechanical Engineers A
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• v.27 no.10
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• pp.1754-1761
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• 2003

The atomic force microscopy (AFM) based lithographic technique has been used directly to machine material surface and fabricate nano components in MEMS (micro electro mechanical system). In this paper, three-dimensional molecular dynamics (MD) simulations have been conducted to evaluate the characteristic of deformation process at atomistic scale for nano-lithography process. Effects of specific combinations of crystal orientations and cutting directions on the nature of atomistic deformation were investigated. The interatomic force between diamond tool and workpiece of copper material was assumed to be derived from the Morse potential function. The variation of tool geometry and cutting depth was also evaluated and the effect on machinability was investigated. The result of the simulation shows that crystal plane and cutting direction significantly influenced the variation of the cutting forces and the nature of deformation ahead of the tool as well as the surface deformation of the machined surface.