• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2000.07a
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• pp.569-572
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• 2000

This paper presents the optimized fabrication and thermal characteristics of micro-heaters for thermal MEMS applications using a SDB SOI substrate. The micro-heater is based on a thermal measurement principle and contains for thermal isolation regions a 10$\mu\textrm{m}$ thick silicon membrane with oxide-filled trenches in the SOI membrane rim. The micro-heater was fabricated with Pt-RTD(Resistance Thermometer Device)on the same substrate by using MgO as medium layer. The thermal characteristics of the micro-heater with the SOI membrane is 280$^{\circ}C$ at input Power 0.9 W; for the SOI membrane with 10 trenches, it is 580$^{\circ}C$ due to reduction of the external thermal loss. Therefore, the micro-heater with trenches in SOI membrane rim provides a powerful and versatile alternative technology for improving the performance of micro thermal sensors and actuators.

• The Transactions of the Korean Institute of Electrical Engineers C
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• v.49 no.6
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• pp.367-374
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• 2000

This paper presents a method to fabricate freestanding structures by (100) silicon anisotropic etching and nickel electroless plating. The electroless plating process is simpler than the electroplating, and provides good coating uniformity and improved mechanical properties. Furthermore, the (100) silicon anisotropic etching in KOH solution with being aligned to <100> direction provides vertical (100) sidewalls on etched (100) surface. In this paper, the effects of the nickel electroless plating condition on the properties of electroless plated metal structures are investigated to apply fabrication of micro structures and then various micro structures are fabricated by nickel electroless plating. And then, the structures are released by silicon anisotropic etching in KOH solution with a large gap between the structure and the substrate. The fabricated cantilever structures are $210\mum$. wide, $5\mum$. thick and $15\mum$. over the silicon substrate, and the comb structure has the comb electrodes which are $4\mum$. wide and $4.3\mum$. thick separated by$1\mum$. It is released by silicon anisotropic etching in KOH solution. The gap between the structure and the substrate is $2.5\mum$.

• The Journal of Korean Institute of Electromagnetic Engineering and Science
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• v.30 no.1
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• pp.23-27
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• 2019

In this paper, we propose a micro vibro tomography(MVT) method, that can be used to visualize two-dimensional cross-sectional images and micro-vibration tomographic images in real time in a non-contact and non-destructive manner. The proposed method is based on the optical coherence tomography(OCT) technique, with an additionally customized image processing algorithm. The proposed method can detect the micro-motions or vibrations in sample structures by measuring the phase shift variations in the sample structures. In this study, we show the potential capabilities of the proposed MVT system for measuring the micro-vibrations generated when sound waves in a frequency range of 2~5 kHz are applied to an $80-{\mu}m$ thick latex phantom, which mimics the changes in physical structure of the human tympanic membrane while hearing. Additionally, three-dimensional volumetric images of the MVT method were recorded to observe the surface morphological changes in the surface of the phantom sample which mimics the human tympanic membrane while hearing.

• Journal of Sensor Science and Technology
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• v.7 no.1
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• pp.73-82
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• 1998

In silicon surface micro-machining, the newly developed GPE(gas-phase etching) process was verified as a very effective method for the release of highly compliant micro-structures. The developed GPE system with anhydrous HF gas and $CH_{3}OH$ vapor was characterized and the selective etching properties of sacrificial layers to release silicon micro-structures were discussed. P-doped polysilicon and SOI(silicon on insulator) substrate were used as a structural layer and TEOS(tetraethyorthdsilicate) oxide, thermal oxide and LTO(low temperature oxide) as a sacrificial layer. Compared with conventional wet-release, we successfully fabricated micro-structures with virtually no process-induced striction and residual product.

• Transactions on Electrical and Electronic Materials
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• v.7 no.4
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• pp.157-162
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• 2006

Chemical-mechanical polishing (CMP), one of the dominant technology for ULSI planarization, is used to flatten the micro electro-mechanical systems (MEMS) structures. The objective of this paper is to achieve good planarization of the deposited film and to improve deposition efficiency of subsequent layer structures by using surface-micromachining process in MEMS technology. Planarization characteristic of poly-Si film deposited on thin oxide layer with MEMS structures is evaluated with different slurries. Patterns used for this research have shapes of square, density, line, hole, pillar, and micro engine part. Advantages of CMP process for MEMS structures are observed respectively by using the test patterns with structures larger than 1 urn line width. Preliminary tests for material selectivity of poly-Si and oxide are conducted with two types of silica slurries: $ILD1300^{TM}\;and\;Nalco2371^{TM}$. And then, the experiments were conducted based on the pretest. A selectivity and pH adjustment of slurry affected largely step heights of MEMS structures. These results would be anticipated as an important bridge stone to manufacture MEMS CMP slurry.

• Journal of the Korea institute for structural maintenance and inspection
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• v.4 no.1
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• pp.121-129
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• 2000

In general. service life of the sea-shore concrete structures is largely influenced by the corrosion of reinforcing steel due to the chloride contamination, and the penetration of chloride ions into concrete is governed by concrete condition state as a micro-structure. In this study, characteristics of chloride diffusion in concrete are analyzed in accordance with the mixing properties and durability of concrete, by considering the facts that micro-structure of concrete varies with the mixing properties and can indirectly be analyzed by using the durability test. In order to predict the service life of existing concrete structures, chloride diffusion equation for the concrete structures under various service conditions and the major parameters used in that equation are formulated as the mathematical models. Based on the results of chloride diffusion analysis in accordance with the mixing properties and durability of concrete and mathematical models formulated in this study, a prediction system is developed to predict the corrosion initiation of reinforcing steel in the sea-shore concrete structures.

• Proceedings of the Korean Society of Precision Engineering Conference
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• 2005.06a
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• pp.615-618
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• 2005

All over the world, many kinds of micro-actuators were already developed for various applications. The actuators are using various principles such as electromagnetic, piezoelectric and thermopneumatic etc. The most of the micro-actuators have been made using 2D based MEMS technology. In these actuators, it is difficult to drive 3-dimensional motion. This characteristic gives the limit of actuator application. However, micro-stereolithography technology has made it possible to fabricate freeform three-dimensional microstructures. In this technology, 2-dimensional micro-shape layer is cumulated on the other layers. This layer-by-layer process is the main principle to fabricate 3-dimensioal micro-structures. In this research, a micro-bellows actuator that is vertically moving was developed using the micro-stereolithography technology. When pressure was applied into the bellows, a non-contact actuating motion is generated. For actuation experiment, syringe pump and laser interferometer were used for applying pressure and measuring the displacement. Several hundreds micro-scale actuation was observed. And, to demonstrate the feasibility of proposed actuation principle, in this research, a micro-gripper was developed using half-bellows structure.

• Proceedings of the KSME Conference
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• 2001.06e
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• pp.169-174
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• 2001

This paper reports on the development of high aspect ratio structure and 3-D integrated process for MEMS-based micro gas turbines. To manufacture high aspect ratio structures, Deep Reactive Ion Etching (DRIE) process have been developed and optimized. Specially, in this study, structures with aspect ratios greater than 10 were fabricated. Also, wafer direct bonding and Infra-Red (IR) camera bonding inspection systems have been developed. Moreover, using glass/silicon wafer direct bonding, we optimized the 3-D integrated process.

• Transactions of the Korean Society of Mechanical Engineers A
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• v.30 no.7 s.250
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• pp.849-856
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• 2006

In this paper, fabric composite draping on hemisphere moulds were studied to find out the deformation behaviour of micro-tow structures of fabrics during draping and thermoforming. Aluminium and PVC foams were used to fabricate the hemisphere moulds for draping tests. In order to observe the local tow deformation pattern during the draping several specimens for microscopic observation were sectioned from the draped hemisphere structures. The effect of forming condition and mould properties on tow deformation was investigated by the microscopic observation of the tow parameters such as crimp angle. Normalization scheme was performed to compare tow parameter variations with different forming conditions. Stress-strain .elations of two different PVC foams (HT70 and HT110) were tested to investigate the effect of foam property on the micro-tow deformation during forming.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2006.11a
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• pp.376-377
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• 2006

Chemical Mechanical Planarization (CMP) has emerged as an enabling technology for the manufacturing of multi-level metal interconnects used in high-density Integrated Circuits (IC). Recently, multi-level structures have been also widely used m the MEMS device such as micro engines, pressure sensors, micromechanical fluid pumps, micro mirrors and micro lenses. Especially, among the thin films available in IC technologies, polysilicon has probably found the widest range of uses in silicon technology based MEMS. This paper presents the characteristic of polysilicon CMP for multi-level MEMS structures. Two-step CMP process verifies that is possible to decrease dishing amount with two type of slurries characteristics. This approach is attractive because two-step CMP process can be decreased dishing amount considerably more then just one CMP process.