• Proceedings of the KSME Conference
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• 2004.11a
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• pp.1231-1235
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• 2004

The needs of micro scale thermal detecting technique are increasing in biology and chemical industry. For example, Thermal finger print, Micro PCR(polymer chain reaction), ${\mu}TAS$ and so on. To satisfy these needs, we developed a DTSA(Diode Temperature Sensor Array) for detecting and controlling the temperature on small surface. The DTSA is fabricated by using VLSI technique. It consists of 32 ${\times}$ 32 array of diodes (1,024 diodes) for temperature detection and 8 heaters for temperature control on a 8mm ${\times}$ 8mm surface area. The working principle of temperature detection is that the forward voltage drop across a silicon diode is approximately proportional to the inverse of the absolute temperature of diode. And eight heaters ($1K{\Omega}$) made of poly-silicon are added onto a silicon wafer and controlled individually to maintain a uniform temperature distribution across the DTSA. Flip chip packaging used for easy connection of the DTSA. The circuitry for scanning and controlling DTSA are also developed

• Journal of the Semiconductor & Display Technology
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• v.12 no.4
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• pp.39-44
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• 2013

In the semiconductor heat-treatment process, the temperature uniformity determines the film quality of a wafer. This film quality effects on the overall yield rate. The heat transfer of the wafer surface in the heat-treatment process equipment is occurred by convection and radiation complexly. Because of this, there is the nonlinearity between the wafer temperature and reactor. Therefore, the accurate prediction of temperature on the wafer surface is difficult without the direct measurement. The thermal camera and the T/C wafer are general ways to confirm the temperature uniformity on the heat-treatment process. As above ways have limit to measure the temperature in the precise domain under the micro-scale. In this study, we developed the thin film type temperature sensor using the MEMS technology to establish the system which can measure the temperature under the micro-scale. We combined the experiment and numerical analysis to verify and calibrate the system. Finally, we measured the temperature on the wafer surface on the semiconductor process using the developed system, and confirmed the temperature variation by comparison with the commercial T/C wafer.

• Journal of Sensor Science and Technology
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• v.32 no.5
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• pp.280-284
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• 2023

In this study, a prototype micro-scale photomask and microfluidic channel mold were fabricated using the thermal shrinkage of the polymer. A polystyrene (PS) sheet was used as the heat-shrink polymer, and the patterns of the photomask and microchannel are interdigitated electrodes. Patterns were formed on the PS sheets using a commercial laser printer. The contraction ratio of the PS sheet was approximately 60% at a temperature of 150 ℃, and the transmittance was reduced by approximately 0% at a wavelength of 365 nm. The microfluidic channel had a round shape. The proposed technique is simple, facile, and inexpensive for fabricating a micro-scale photomask and microfluidic channel mold and does not involve the use of any harmful materials. Thus, this technique is well-suited for fabricating diverse micro-scale patterns and channels for prototype devices, including sensors.

• Smart Structures and Systems
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• v.18 no.5
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• pp.1029-1062
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• 2016

In this research, the nonlinear free vibration analysis of boron-nitride micro ribbon (BNMR) on the Pasternak elastic foundation under electrical, mechanical and thermal loadings using modified strain gradient theory (MSGT) is studied. Employing the von $K{\acute{a}}rm{\acute{a}}n$ nonlinear geometry theory, the nonlinear equations of motion for the graphene micro ribbon (GMR) using Euler-Bernoulli beam model with considering attached mass and size effects based on Hamilton's principle is obtained. These equations are converted into the nonlinear ordinary differential equations by elimination of the time variable using Kantorovich time-averaging method. To determine nonlinear frequency of GMR under various boundary conditions, and considering mass effect, differential quadrature element method (DQEM) is used. Based on modified strain MSGT, the results of the current model are compared with the obtained results by classical and modified couple stress theories (CT and MCST). Furthermore, the effect of various parameters such as material length scale parameter, attached mass, temperature change, piezoelectric coefficient, two parameters of elastic foundations on the natural frequencies of BNMR is investigated. The results show that for all boundary conditions, by increasing the mass intensity in a fixed position, the linear and nonlinear natural frequency of the GMR reduces. In addition, with increasing of material length scale parameter, the frequency ratio decreases. This results can be used to design and control nano/micro devices and nano electronics to avoid resonance phenomenon.

• Journal of ILASS-Korea
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• v.7 no.2
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• pp.1-6
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• 2002

It is necessary to develope a high frequency diode laser sensor system based on the absorption spectroscopy for the measurement of temperature of the spray flame. DFB diode laser operating near $2.0{\mu}m$ was used to scan over selected $H_2O$ transitions near $1.9{\mu}m\;and\;2.2{\mu}m$, respectively. The measurement sensitivity at wide range of sweep frequency was evaluated using multi-pass cell containing $CO_2$ gas. This diode laser absorption sensor with high temporal resolution up to 10kHz was applied to measure the gas temperature in the spray flame region of liquid-gas 2-phase counter flow flame. The successful demonstration of time series temperature measurement in the spray flame gives us motivation of trying to establish non-intrusive temperature measurement method in the practical spray flame.

• Journal of the Institute of Electronics Engineers of Korea SD
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• v.42 no.11
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• pp.1-8
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• 2005

In this paper, we present design and prototyping of a low-cost, integrated multi-functional micro health sensor chip that can be used or embedded in widely consumer devices, such as cell phone and PDA, for monitoring environmental condition including air pressure, temperature and humidity. This research's scope includes basic individual sensor study, architecture for integrating sensors on a chip, fabrication process compatibility and test/evaluation of prototype sensors. The results show that the integrated TPH sensor has good characteristics of ${\pm}\;1\%FS$ of linearity and hysteresis for pressure sensor and temperature sensor and of ${\pm}\;5\%FS$ of linearity and hysteresis But if we use 3rd order approximation for humidity sensor, full scale error becomes much smaller and this will be one of our future study.

• Proceedings of the Korean Society for Technology of Plasticity Conference
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• 2007.10a
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• pp.100-103
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• 2007

A microlens array has been required to improve light conversion efficiency in image sensors. A microlens array can be usually fabricated by photoresist reflow, hot-embossing, micro injection molding, and UV-imprinting. Among these processes, a UV-imprinting, which is operated at room temperature with relatively low applied pressure, can be a desirable process to integrate microlens array on image sensors, because this process provides the components with low thermal expansion, enhanced stability, and low birefringence, furthermore, it is more suitable for mass production of high quality microlens array. In this study, to analyze the optical properties of the wafer scale microlens array integrated image sensor, another wafer scale simulated image sensor chip array was designed and fabricated. An aspherical square microlens was designed and integrated on a simulated image sensor chip array using a UV-imprinting process. Finally, the optical performances were measured and analyzed.

• Proceedings of the Korean Society of Precision Engineering Conference
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• 2002.10a
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• pp.1033-1036
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• 2002

Wafer bonding methods such as fusion and anodic bonding suffer from high temperature treatment, long processing time, and possible damage to the micro-scale sensor or actuators. In the localized bonding process, beating was conducted locally while the whole wafer is maintained at a relatively low temperature. But previous research of localized heating has some problems, such as non-uniform soldering due to non-uniform heating and micro crack formation on the glass capsule by thermal stress effect. To address this non-uniformity problem, a new heater configuration is being proposed. By keeping several points on the heater strip at calculated and constant potential, more uniform heating, hence more reliable wafer bonding could be achieved. The proposed scheme has been successfully demonstrated, and the result shows that it will be very useful in hermetic packaging. Less than 0.2 ㎫ contact Pressure were used for bonding with 150 ㎃ current input for 50${\mu}{\textrm}{m}$ width, 2${\mu}{\textrm}{m}$ height and 8mm $\times$ 8mm, 5mm$\times$5mm, 3mm $\times$ 3mm sized phosphorus-doped poly-silicon micro heater. The temperature can be raised at the bonding region to 80$0^{\circ}C$, and it was enough to achieve a strong and reliable bonding in 3minutes. The IR camera test results show improved uniformity in heat distribution compared with conventional micro heaters. For gross leak check, IPA (Isopropanol Alcohol) was used. Since IPA has better wetability than water, it can easily penetrate small openings, and is more suitable for gross leak check. The pass ratio of bonded dies was 70%, for conventional localized heating, and 85% for newly developed FP scheme. The bonding strength was more than 30㎫ for FP scheme packaging, which shows that FP scheme can be a good candidate for micro scale hermetic packaging.

• Current Optics and Photonics
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• v.4 no.4
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• pp.293-301
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• 2020

In this paper we propose and theoretically analyze a monolithic multiparametric sensor consisting of a superstructure of surface-relief waveguide Bragg gratings (WBGs), a micro-machined diaphragm, and a cantilever beam. Diaphragms of two different configurations, namely circular and square, are designed and analyzed separately for pressure measurement. The square diaphragm is then selected for further study, since it shows relatively higher sensitivity compared to the circular one, as it incurs more induced stress when any pressure is applied. The cantilever beam with a proof mass is designed to enhance the sensitivity for acceleration measurement. A unique mathematical method using coupled-mode theory and the transfer-matrix method is developed to design and analyze the shift in the Bragg wavelength of the superstructure configuration of the gratings, due to simultaneously applied pressure and acceleration. The effect of temperature on the wavelength shift is compensated by introducing another Bragg grating in the superstructure configuration. The measured sensitivities for pressure and acceleration are found to be 0.21 pm/Pa and 6.49 nm/g respectively.

• Proceedings of the Korean Society of Precision Engineering Conference
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• 2002.05a
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• pp.378-391
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• 2002

A 250mm stroke aerostatic stage, which detects position with laser scale and is driven by linear motor, is made and analyzed positioning error in 20$\pm$ 0.5 $^{\circ}C$ controlled atmosphere, aiming at investigating positioning characteristic of ultra-precision stage. We prove this aerostatic stage has a 10nm micro step resolution by experiment. By means of analyzing laser interferometer system, the scale of measuring error is about 0.2-0.4$\mu\textrm{m}$ according to refractive index error from missing the temperature change. To improve laser interferometer system, compensate refractive index error using measuring data from thermocouple. And, confirm 0.10$\mu\textrm{m}$ repeatability and 0.13 $\mu\textrm{m}$ positioning accuracy using the compensating refractive index. Also, we confirm 0.07 ${\mu}{\textrm}{m}$ repeatability of the stage using capacitive displacement sensor.