Design and fabrication of wafer scale microlens array for image sensor using UV-imprinting

UV 임프린팅을 이용한 이미지 센서용 웨이퍼 스케일 마이크로렌즈 어레이 설계 및 제작

  • 김호관 (연세대학교 대학원 기계공학과) ;
  • 김석민 (연세대학교 대학원 기계공학과) ;
  • 임지석 (연세대학교 대학원 기계공학과) ;
  • 강신일 (연세대학교 대학원 기계공학과)
  • Published : 2007.10.11

Abstract

A microlens array has been required to improve light conversion efficiency in image sensors. A microlens array can be usually fabricated by photoresist reflow, hot-embossing, micro injection molding, and UV-imprinting. Among these processes, a UV-imprinting, which is operated at room temperature with relatively low applied pressure, can be a desirable process to integrate microlens array on image sensors, because this process provides the components with low thermal expansion, enhanced stability, and low birefringence, furthermore, it is more suitable for mass production of high quality microlens array. In this study, to analyze the optical properties of the wafer scale microlens array integrated image sensor, another wafer scale simulated image sensor chip array was designed and fabricated. An aspherical square microlens was designed and integrated on a simulated image sensor chip array using a UV-imprinting process. Finally, the optical performances were measured and analyzed.

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