• 소성∙가공
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• 제21권2호
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• pp.138-143
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• 2012

A polishing method using magnetorheological (MR) fluid has been developed as a new precision technique to obtain a fine surface. The process uses a MR fluid that consists of magnetic carbonyl iron (CI) particles, nonmagnetic polishing abrasives, water and stabilizers. But the CI particles in MR fluids cause a severe corrosion problem. When coated with Xanthan gum, the CI particles showed long-term stability in corrosive aqueous environment. The surface roughness obtained from the MR polishing process was evaluated. A series of experiments were performed on fused silica glass using prepared slurries and various process conditions, including different polishing times. Outstanding surface roughness of Ra=2.27nm was obtained on the fused silica glass. The present polishing method could be used to produce ultra-precision micro parts.

• Journal of Advanced Marine Engineering and Technology
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• 제30권2호
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• pp.311-318
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• 2006

In this study, the performance tests for single and dual micro processor configurations are performed to investigate how the accelerated OpenGL components and applications are dependent on processor configurations. At present, many major providers of the engineering graphics workstations have recommended that multiprocessors are better than single processor. However, we confirmed that the single processor configuration is more faster and more effective than competitive configurations and suggested the economic method to improve the performance of the engineering graphics workstations.

• 소성∙가공
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• 제14권3호
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• pp.277-281
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• 2005

LTCC(Low temperature co-fired ceramic) is being recognized as a significant packaging material of electrical devices for the advantages such as relatively low temperature being needed for process, low conductor resistance and high printing resolution. In the process of LTCC electrical devices, the punched via-hole quality is one of the most important factors on the performance of the device. However, its mechanism is very complicated and optimization of the process seems difficult. In this paper, to clarify the process, via-hole punching experiments were carried out and the punched holes were examined in terms of their burr formation. The effects of thickness of PET sheet, ceramic sheet and punch-to- die clearance on via-hole quality were also discussed. Optimum process conditions are proposed and a factor $\kappa$ is introduced to express effect of the process variables.

• 소성∙가공
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• 제21권5호
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• pp.319-323
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• 2012

In order to predict the internal void closing behavior in open die forging process, multiple scale modeling has been developed and applied. The huge size difference between ingot and inner void makes it almost impossible to simultaneously model the actual loading conditions and the void shape. Multiple scale modeling is designed to integrate macro- and micro- models effectively and efficiently. The void closing behavior was simulated at 39 different locations in a large ingot during upsetting and cogging. The correlation between the closing behavior and variables such as effective plastic strain and maximum compressive strain was studied in order to find an efficient measure for predicting the soundness of the forging.

• 소성∙가공
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• 제17권3호
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• pp.161-169
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• 2008

In the present work, the two-back stress model is proposed and continuum damage mechanics (CDM) is incorporated into the plastic constitutive relation in order to describe the plastic deformation localization and the damage evolution in a deforming continuum body. Coupling between damage mechanics and isothermal rate independent plasticity is performed using the kinematic hardening rule, which in turn is formulated by combining the nonlinear Armstrong-Frederick rule and the Phillips rule. The numerical analyses are carried out within h deformation theory. It is noted that the damage evolution within a work piece accelerates the plastic deformation localization such that the material with lower hardening exponent results in a rapid shear band formation. Moreover, the results from the numerical analysis reflected closely with the micro-structures around the fractured regime. The effects of the various hardening parameters on deformation localization are also investigated. As the nonlinear strain rate description in the back stress evolution becomes dominant, the strain localization becomes intensified as well as the damage evolution.

• 소성∙가공
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• 제5권4호
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• pp.269-280
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• 1996

A new approach to die shape optimal design in extrusion is presented. The approach consists of a FEM analysis model to predict the value of the objective function a design model to relate the die profile with the design variables and a genetic algorithm based optimaization procedure. The approach was described in detail with emphasis on our modified micro genetic algorithm. Comparison with theoretical solutions was made to examine the validity of the predicted optimal die shapes. The approach was then applied to revealing the optimal die shapes with regard to various objective functions including those for which the design sensitivities can not be deter-mined analytically.

• 소성∙가공
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• 제24권2호
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• pp.83-88
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• 2015

For chromaticity correction, it is necessary to dispense high viscosity phosphor slurry since it greatly affects the performance of white LEDs. However, it is quite difficult to dispense high viscosity fluorescent materials. In the current study, micro-discharge electrostatic printing has been used for dispensing various high viscosity phosphor slurries. We have achieved dispersions of up to 50 µg using drop on demand (DOD) discharge experiments. The experiments were conducted with different combinations of process variables such as applied voltage, pneumatic pressure, and frequency.

• 한국전기전자재료학회논문지
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• 제16권12S호
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• pp.1237-1241
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• 2003

In this paper, we report a novel RF-MEMS packaging technology with lightweight, small size, and short electric path length. To achieve this goal, we used the ultra thin silicon substrate as a packaging substrate. The via holes lot vortical feed-through were fabricated on the thin silicon wafer by wet chemical processing. Then, via holes were filled and micro-bumps were fabricated by electroplating. The packaged RF device has a reflection loss under 22 〔㏈〕 and a insertion loss of -0.04∼-0.08 〔㏈〕. These measurements show that we could package the RF device without loss and interference by using the vertical feed-through. Specially, with the ultra thin silicon wafer we can realize of a device package that has low-cost, lightweight and small size. Also, we can extend a 3-D packaging structure by stacking assembled thin packages.

• 소성∙가공
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• 제5권1호
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• pp.18-26
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• 1996

In order to investigate the effect of pre-cooling of ingot on void closure in hot plate forging the internal strain and stress distributions are examined quantitatively by using ABAQUS. Simula-tions are carried out on a large slab ingot having the same temperature and the temperature gradient induced by air-cooling. It is shown that pre-cooling produces little effect on the strain behavior but remarkable effect on the hydrostatic stress at the central zone of ingot. The main factors for crushing micro-voids are the effective strain and the time integral of hydrostatic stress in the region surrounding the voids. Based on regression analysis it was found that the distortion of void can be expressed as a polynomial function of the two factors.

• 소성∙가공
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• 제12권4호
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• pp.388-393
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• 2003

Electrolytic polishing is the anodic dissolution process in the transpassive state. It removes non-metallic inclusions and improves mechanical and corrosion resistance of stainless steel. Electrolytic polishing is normally used to remove a very thin layer of material from the surface of a metal object. An electrolyte of phosphoric acid 50% in vol., sulfuric acid 20% in vol. and distilled water 30% in vol. has been used in this study. In the low current density region, there can be found plateau region and material removal process and leveling process occur successively. In this study, an electrochemical polishing process using pulse current is adopted as a new electrochemical polishing process. In electrochemical machining processes, it has been found that pulse electrochemical processes provide an attractive alternative to the electrochemical processes using continuous current. Hence, this study will discuss the electrochemical polishing processes in low current density region and pulse electrochemical polishing.