• 한국전기전자재료학회:학술대회논문집
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• 한국전기전자재료학회 2009년도 추계학술대회 논문집
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• pp.276-276
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• 2009

Solar cells has been studied mainly the high efficiency and lower prices. Using recycling wafer as a way to realize their money in it, there is a way to manufacture a solar cell substrate. How to play the recycling wafer, CMP(Chemical Mechanical Polishing) and remelting process is the complex and the expensive equipment. However, using the Micro-Blaster, the process easier, and cheaper prices. Micro-Blaster confirmed that the remaining amount of material left after the process recycling wafer surface.

• 한국정밀공학회:학술대회논문집
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• 한국정밀공학회 2003년도 춘계학술대회 논문집
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• pp.46-49
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• 2003

Microsystem technology (MST) which originated from semiconductor processes has been widely spreaded into tile other industry such as sensors, micro fluidics and displays. The MST, however. has been troubled in spreading with its high cost and material limitations. So, in this paper, new process for micromolding technology using silicone rubber mold was introduced. Silicone rubber mold, which was fabricated by vacuum casting. can be transferred a master pattern to a final product with the same shape but different materials. In order to verify the possibility of application of silicone rubber mold to the MST, its transferability was evaluated. and then it applied to the fabrications of polishing pad and PDP barrier ribs.

• 한국정밀공학회지
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• 제18권3호
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• pp.169-174
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• 2001

We proposed a new fabrication method using electrochemical process for microshafts. This method is a kind of atomic removal process by chemical reaction. Therefore, it is possible to make thin and long shafts regardless of the stiffness of materials. Because shaping process is simply switched to polishing process by varying process conditions, we can precisely fabricate microshafts with very smooth surface. We also fabricated a very thin shaft with the diameter as small as 10$\mu$m and a microshaft with high aspect ratio.

• 대한기계학회논문집A
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• 제27권8호
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• pp.1380-1387
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• 2003

Microsystem technology (MST) which originated from semiconductor processes has been widely spreaded into the other industry such as sensors, micro fluidics and displays. The MST, however, has been troubled in spreading with its high cost and material limitations. So, in this paper, new process for micromolding technology using silicone rubber mold was introduced. Silicone rubber mold, which was fabricated by vacuum casting, can be transferred a master pattern to a final product with the same shape but different materials. In order to verify the possibility of application of silicone rubber mold to the MST, its transferability was evaluated, and then it applied to the fabrications of polishing pad and PDP barrier ribs.

• 한국정밀공학회:학술대회논문집
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• 한국정밀공학회 2002년도 추계학술대회 논문집
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• pp.206-209
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• 2002

The fixed abrasive pad(FAP) has been introduced in chemical mechanical polishing(CMP) field recently. In comparison with the general CMP which uses the slurry including abrasives, FAP takes advantage of planarity. resulting from decreasing pattern selectivity and defects such as dishing due to the reduction of abrasive concentration especially. This paper introduces the manufacturing technique of $Al_2$O$_3$-FAP using hydrophilic polymers with swelling characteristic in water and explains the self.texturing phenomenon. It also focuses on the chemical effects on tungsten film and the FAP is evaluated on the removal rate as a function of chemicals such as oxidizer, catalyst, and acid. The removal rate is achieved up to 1000A1min as about 70 percents of the general one. In the future. the research has a plan of the advanced FAP and chemicals in tungsten CMP considering micro-scratch, life-time, and within wafer non-uniformity.

• 한국전기전자재료학회:학술대회논문집
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• 한국전기전자재료학회 2003년도 춘계학술대회 논문집 기술교육전문연구회
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• pp.31-34
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• 2003

The sapphire wafers for blue light emitting devices were manufactured by the implementation of the surface machining technology based on micro-tribology. This process has been performed by chemical and mechanical polishing(CMP) process. The sapphire crystalline wafers were characterized by double crystal X-ray diffraction. The sample quality of sapphire crystalline wafer at surfaces has a full width at half maximum 89 arcses. The surfaces of sapphire wafers were mechanically affected by residual stress and surface default. Sapphire wafers's waveness has higher abrasion rate in the edge of the wafer than its center due to Newton's Ring interference.

• 한국정밀공학회지
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• 제21권7호
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• pp.22-29
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• 2004

As a result of high integration of semiconductor device, the global planarization of multi-layer structures is necessary. So the chemical mechanical polishing(CMP) is widely applied to manufacturing the dielectric layer and metal line in the semiconductor device. CMP process is under influence of polisher, pad, slurry, and process itself, etc. In comparison with the general CMP which uses the slurry including abrasives, fixed abrasive pad takes advantage of planarity, resulting from decreasing pattern selectivity and defects such as dishing & erosion due to the reduction of abrasive concentration especially. This paper introduces the manufacturing technique of fixed abrasive pad using hydrophilic polymers with swelling characteristic in water and explains the self-conditioning phenomenon. And the tungsten CMP using fixed abrasive pad achieved the good conclusion in terms of the removal rate, non-uniformity, surface roughness, material selectivity, micro-scratch free contemporary with the pad life-time.

• 한국정밀공학회지
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• 제30권6호
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• pp.644-649
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• 2013

Today, there are lots of progresses in the field of lens researches, especially in the microlens fabrication. Unlike normal lenses, microlens has been widely used as a role of improving the performance of photonic devices which increase the optical precision, and also used in the fields of the display. In this paper, polymer microlenses with $300{\mu}m$ diameter were replicated through hot-embossing from nickel mold which was fabricated by micro-EDM. After hot-embossing process, the polymer microlenses have a rough surface due to the crater formed by micro-EDM process, which is projected onto the surface of the lenses. The surface of polymer microlenses was polished using solvent vapor to improve the surface roughness of the microlenses without changing their shape. In the experiment, the surface roughness was improved with the processing time and vapor temperature. Also, the roughness improvement was greatly affected by the solubility difference between polymer and solvent.

• 대한소아치과학회지
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• 제42권1호
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• pp.53-61
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• 2015

소아치과 임상에서 기성금속관 수복은 매우 높은 활용성과 사용빈도에도 불구하고 완벽하고 정밀한 수복이 쉽지 않은 항목으로 판단된다. 불량한 변연 적합, 변연부 치태 침착, 인접 영구치의 맹출 장애, 접착제 소실 및 이차 우식, 부적절한 지대치 삭제, 교합면 천공 등이 임상적으로 흔히 관찰되는 문제점들이다. 본 연구는 기성금속관이 장착된 상태로 발치된 유구치를 대상으로 수복 상태를 평가해 봄으로써, 빈번한 결함과 착오들을 찾아낼 목적으로 시도되었다. 부산대학교 치과병원 소아치과에서 발치된 기성금속관 수복 유구치 97개를 대상으로 육안적 평가와 micro-computed tomography(micro-CT) 영상을 분석하였다. 변연 적합도, 접착제 소실, 이차우식, 교모성 천공, 변연부 연마 결함, 선반(ledge) 형성 등의 항목으로 수복상태를 평가하여, 다음과 같은 결과를 얻었다. 조사항목들을 대상치아 기준으로 보았을 때, 접착제 소실이 가장 빈번하였으며(98%), 뒤를 이어 이차우식(42.3%), 변연부 연마 결함(41.2%), 선반(ledge) 형성(29.9%), 교모성 천공(17.5%)의 순으로 나타났다. 변연 간격이 클수록 접착제 소실이 증가하는 경향을 보였고, 접착재 소실은 변연 간격 및 이차 우식과 유의한 상관성을 보였다. 평균 변연간격은 $0.31{\pm}0.26mm$ 였으며, 상악 제2 유구치에서 가장 크게 나타났다. 변연이 백악법랑경계 상방에 위치하는 경우가 가장 많았고, 변연이 치관 상방에 위치할수록 변연 간격은 작게 나타났다(p < 0.05).

• 한국전기전자재료학회논문지
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• 제20권9호
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• pp.749-755
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• 2007

Recently, novel MEMS probe cards can support reliable wafer level chip test with high density probing capacity. However, manufacturing cost and process complexity are crucial weak points for low cost mass production. To overcome these limitations, we have developed micro spring structured MEMS probe card. For fabrication of micro spring module, a wire bonder and electrolytic polished gold wires are used. In this case, stringent tension force control is essential to guarantee the low level contact resistance of micro spring for reliable probing performance. For this, relation between tension force of fabricated probe card and contact resistance is characterized. Compare to conventional probe cards, developed MEMS probe card requires fewer fabrication steps and it can be manufactured with lower cost than other MEMS probe cards. Also, due to the small contact scratch patterns, we expect that it can be applied to bumping types chip test which require higher probing density.