• 제목/요약/키워드: Micro Pattern Machining

검색결과 109건 처리시간 0.018초

방전가공면을 복제한 실리콘수지 표면의 발수특성연구 (Hydrophobic Characteristics of a Silicone Resin Surface Produced by Replicating an Electric Discharge Machined Surface)

  • 김영훈;홍석관;이상용;이성희;김권희;강정진
    • 소성∙가공
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    • 제22권1호
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    • pp.23-29
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    • 2013
  • In this study, a micro/nano-random-pattern-structure surface was machined by electric discharge machining (EDM) followed by replicating the EDM surface with a silicone elastomer having low energy and greater hydrophobicity. The variation of hydrophobicity was of prime interest and was examined as a function of the surface roughness of the replicated silicone elastomer. The hydrophobicity was evaluated by the water contact angle (WCA) measured on the relevant surface. For the experiments, the original surfaces were machined by die sinking electric discharge machining (DS-EDM) and wire cutting electric discharge machining (WC-EDM). The ranges of surface roughness were Ra $0.8{\sim}19{\mu}m$ for the DS-EDM and Ra $0.5{\sim}4.7{\mu}m$ for the WC-EDM. In order to fabricate a hydrophobic surface, the EDM surfaces were directly replicated using a liquid-state silicone elastomer, which was thermally cured. The measured WCA on the replicated surfaces for DS-EDM was in the range of $115{\sim}130^{\circ}$ and for WC-EDM the WCA was in the range of $123{\sim}150^{\circ}$. Additionally, the dynamic hydrophobicity was evaluated by measuring an advancing and a receding WCA on the replicated silicone elastomer surfaces.

롤금형의 동적밸런스 보정을 통한 미세패턴 형상정밀도 향상 (Improving Dimensional Accuracy of Micropatterns by Compensating Dynamic Balance of a Roll Mold)

  • 이동윤;홍상현;송기형;강은구;이석우
    • 대한기계학회논문집A
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    • 제35권1호
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    • pp.33-37
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    • 2011
  • 디스플레이, 광학, 에너지 분야 부품의 미세형상화, 대면적화, 저가격화 요구에 대응하기 위하여 대면적 롤금형의 미세형상 가공기술개발에 대한 필요성이 대두되고 있다. 롤금형은 기존의 평판금형에 비해서 금형의 납기가 빠르고, 대면적화에 용이하며, 연속성형이 가능하다는 장점을 갖고 있다. 본 연구는 롤금형에 미세형상을 가공할 때 발생하는 형상오차의 원인을 규명하는 것을 목적으로 하고 있으며, 가공 현장에서 개선 가능한 요소로서 롤금형의 동적밸런싱 보정방안을 제시하고 있다. 기존보다 정밀한 동적밸런싱 보정을 통하여 롤금형의 질량불평형이 최대 90%까지 감소되었고, 롤금형의 진동량이 0.044 mm/sec (RMS)에서 0.004mm/sec (RMS)로 감소하였으며, 결과적으로 미세패턴의 형상정밀도가 개선되는 것을 확인할 수 있었다.

나노초 레이저 가공을 활용한 초소수 표면 특성을 가지는 사출 금형에 관한 연구 (A Study on the Injection Mold with Superhydrophobic Surface Properties Using Nanosecond Laser Machining)

  • 박정래;김혜진;박지영;성시명;홍서연;송기혁
    • Design & Manufacturing
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    • 제17권3호
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    • pp.48-54
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    • 2023
  • In this study, an injection mold with ultra-small surface properties was manufactured using nanosecond laser processing. A superhydrophobic characteristic analysis was performed on the PET specimen manufactured through this. To this end, a hydrophobic pattern was defined using the Cassie-Baxter model. The defined features were selected with a spot diameter of 25um and pitch spacing of 30um and 35um. As a result of the basic experiment, it was confirmed that the fine pattern shape had an aspect ratio of 1:1 when the pitch interval was 35um and 20 iterations. Through the determined processing conditions, a hydrophobic pattern was implemented on the core surface of KP4. A specimen with a hydrophobic pattern was produced through injection molding. The height of the molded hydrophobic pattern is 20 ㎛ less than the depth of the core and the contact angle measurement results are 92.1°. This is a contact angle smaller than the superhydrophobic criterion. Molding analysis was performed to analyze the cause of this, and it was analyzed that the molding was not molded due to the lack of pressure in the injection machine.

사파이어 웨이퍼의 기계-화학적인 연마 가공특성에 관한 연구 (Chemo-Mechanical Polishing Process of Sapphire Wafers for GaN Semiconductor Thin Film Growth)

  • 신귀수;황성원;서남섭;김근주
    • 대한기계학회논문집A
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    • 제28권1호
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    • pp.85-91
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    • 2004
  • The sapphire wafers for blue light emitting devices were manufactured by the implementation of the surface machining technology based on micro-tribology. This process has been performed by chemical and mechanical polishing process. The sapphire crystalline wafers were characterized by double crystal X-ray diffraction. The sample quality of sapphire crystalline wafer at surfaces has a full width at half maximum of 89 arcsec. The surfaces of sapphire wafer were mechanically affected by residual stress during the polishing process. The wave pattern of optical interference of sapphire wafer implies higher abrasion rate in the edge of the wafer than its center from the Newton's ring.

UV 임프린팅을 통한 프레넬 렌즈 제작 시 미세 복제 특성에 관한 연구 (Micro replication quality of Fresnel lens using UV imprinting process)

  • 임지석;김병욱;강신일
    • 정보저장시스템학회논문집
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    • 제6권1호
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    • pp.37-40
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    • 2010
  • Fresnel lens is a kind of refractive optical lens with various advantages. It has nearly flat shaped optical lens that has small mass. Fresnel lens has number of applications in the compact optical systems. Recently, demands of high quality Fresnel lens for small size optical systems such as illumination units, compact imaging systems, display units, information storage systems, optical detecting units had increased rapidly. Conventional manufacturing process of high quality Fresnel lens is direct machining. However, it is not suitable for mass production because of high cost and long cycle time. Replication method can provide cost effective mass production process. However, there are various issues about replication of Fresnel lens. Fresnel lens has number of sharp blade shape prism. In the replication process, this blade shape causes defects that can affect optical efficiency. In this study, replication processes; injection molding process and UV imprinting process, were developed and evaluated using Fresnel lens that has maximum pattern height of $250\;{\mu}m$ and aspect ratio of 1.5.

인공지능(AI)을 활용한 미세패턴 불량도 자동화 검사 시스템 (Automated Inspection System for Micro-pattern Defection Using Artificial Intelligence)

  • 이관수;김재우;조수찬;신보성
    • 한국산업융합학회 논문집
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    • 제24권6_2호
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    • pp.729-735
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    • 2021
  • Recently Artificial Intelligence(AI) has been developed and used in various fields. Especially AI recognition technology can perceive and distinguish images so it should plays a significant role in quality inspection process. For stability of autonomous driving technology, semiconductors inside automobiles must be protected from external electromagnetic wave(EM wave). As a shield film, a thin polymeric material with hole shaped micro-patterns created by a laser processing could be used for the protection. The shielding efficiency of the film can be increased by the hole structure with appropriate pitch and size. However, since the sensitivity of micro-machining for some parameters, the shape of every single hole can not be same, even it is possible to make defective patterns during process. And it is absolutely time consuming way to inspect all patterns by just using optical microscope. In this paper, we introduce a AI inspection system which is based on web site AI tool. And we evaluate the usefulness of AI model by calculate Area Under ROC curve(Receiver Operating Characteristics). The AI system can classify the micro-patterns into normal or abnormal ones displaying the text of the result on real-time images and save them as image files respectively. Furthermore, pressing the running button, the Hardware of robot arm with two Arduino motors move the film on the optical microscopy stage in order for raster scanning. So this AI system can inspect the entire micro-patterns of a film automatically. If our system could collect much more identified data, it is believed that this system should be a more precise and accurate process for the efficiency of the AI inspection. Also this one could be applied to image-based inspection process of other products.

빔 위치 관련 제어인자가 집속이온빔 패턴 증착공정에 미치는 영향 (The Influence of Parameters Controlling Beam Position On-Sample During Deposition Patterning Process with Focused Ion Beam)

  • 김준현;송춘삼;김윤제
    • 대한기계학회논문집A
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    • 제32권3호
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    • pp.209-216
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    • 2008
  • The application of focused ion beam (FIB) depends on the optimal interaction of the operation parameters between operating parameters which control beam and samples on the stage during the FIB deposition process. This deposition process was investigated systematically in C precursor gas. Under the fine beam conditions (30kV, 40nm beam size, etc), the effect of considered process parameters - dwell time, beam overlap, incident beam angle to tilted surface, minimum frame time and pattern size were investigated from deposition results by the design of experiment. For the process analysis, influence of the parameters on FIB-CVD process was examined with respect to dimensions and constructed shapes of single and multi- patterns. Throughout the single patterning process, optimal conditions were selected. Multi-patterning deposition were presented to show the effect of on-stage parameters. The analysis have provided the sequent beam scan method and the aspect-ratio had the most significant influence for the multi-patterning deposition in the FIB processing. The bitmapped scan method was more efficient than the one-by-one scan type method for obtaining high aspect-ratio (Width/Height > 1) patterns.

멤브레인 구조 제작은 위한 단결정 실리콘의 이방성 습식 식각 (Anisotropic Wet Etching of Single Crystal Silicon for Formation of Membrane Structure)

  • 조남인;강창민
    • 반도체디스플레이기술학회지
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    • 제2권4호
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    • pp.37-40
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    • 2003
  • 반도체 장비의 기능성과 신뢰성을 높이기 위하여 부품의 제조기술은 점차 마이크로 머신 기술을 요구하고 있다. 마이크로머신 기술 중 hot junction이 위치하는 멤브레인 구조는 각종 센서와 히터의 미세부품에서 가장 이용도가 큰 구조이다. 실험에서는 마이크로머신의 기본 구조인 멤브레인 형태를 만들기 위해 KOH 용액과 TMAH 용액으로 단결정 실리콘을 이방성 습식식각 하였다. 실험결과, 식각액의 온도와 농도, 마스크 패턴과 웨이퍼의 결정성의 일치 등을 고려해야 하며, 식각 속도는 KOH 농도 및 온도에 따라 크게 변함을 알 수 있었다. KOH 용액은 30 wt% 80~$90^{\circ}C$ 온도 범위에서 가장 좋은 특성을 나타냈다. 한편, TMAH용액이 실리콘을 식각하는 용액으로 관심을 끄는 것은 단결정에서 상대적으로 $SiO_2$ 박막을 마스크로 사용할 수 있을 뿐 아니라 $SiO_2$ 박막을 마스크로 사용할 수 있을 뿐 아니라 다른 식각액보다 찌꺼기가 적다는 장점 때문이다. 그러나, 다른 용액에 비해 가격이 고가이며 식각 속도가 낮다는 것이 실용적인 측면에서 큰 단점이다. 실험결과를 종합적으로 고려할 때 KOH 용액 농도 30wt%와 온도 $90^{\circ}C$가 마이크로머신 기술에 의한 멤브레인 구조 제작에서 적합한 공정조건이라고 할 수 있다.

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Mg-Ca 합금의 전기화학적 특성에 미치는 Ca 첨가량 및 열처리의 영향 (The Influence of Heat Treatment and Ca contents on the Electrochemical Characteristics of Mg-Ca Alloys)

  • 이상희;정동석;박병옥;김용길;정하국;김혜성
    • 열처리공학회지
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    • 제17권3호
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    • pp.173-179
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    • 2004
  • In this study, the influence of heat treatment and Ca contents on the electrochemical behavior was investigated. Mg-Ca alloys, i.e., Mg-0.22wt%Ca, Mg-0.56wt%Ca, Mg-1.31wt%Ca are prepared by ingot metallurgy. As-cast Mg-Ca alloys exhibited better electrochemical properties than pure Mg. Especially, Mg-0.22wt%Ca alloy improves its anode efficiency up to 62% and lowers the OCP up to -1.72VSCE. Microstructure and XRD patterns of Mg-Ca alloys show that additive Ca element is mainly solid-solutioned. While, the others show the microstructure and XRD pattern with large $Mg_2Ca$ at grain boundary. To assess the effect of heat treatment on the as-cast Mg-alloy, the specimens were heat treated at $200^{\circ}C$ for 2 hours under $CO_2$ gas atmosphere. Although corrosion properties of Mg-Ca alloys are somewhat deteriorated by heat treatment at $200^{\circ}C$ Mg-0.22wt%Ca alloy with uniformly distributed nano-sized $Mg_2Ca$ phase in ${\alpha}$-Mg matrix show still better corrosion properties than pure Mg specimen.