• The Transactions of the Korean Institute of Electrical Engineers C
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• v.55 no.5
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• pp.278-285
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• 2006

A micro hotplate for micro gas sensor was fabricated by MEMS technology. In order to heat up the gas sensing material to a target temperature, a micro hotplate was built on the gas sensor. The sensing material was deposited on the heater and electrodes, and did not contact with the silicon base to minimize the heat loss to the silicon base. The electric power to heat up the gas sensor was measured. The temperature distribution of micro gas sensor was analyzed by a CFD program. The predicted electric power to heat up th sensing material showed a good agreement with the measured data. The design of micro gas sensor could be modified to increase the temperature uniformity and to decrease the electric power consumption by optimizing the layout of micro hotplate and electrodes.

• Journal of the Korea Academia-Industrial cooperation Society
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• v.5 no.2
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• pp.132-136
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• 2004

A flat type $NO_2$ micro gas sensor was fabricated by MEMS technology. In order to heat up gas sensing material such as $WO_3$ to a target temperature, a micro hotplate was built on the gas sensor. The temperature distribution of micro gas sensor was analyzed by a CFD program, FLUENT. The results showed that the temperature of silicon wafer base was almost similar to that of the room temperature, which indicates that the heat generated at the micro hotplate heated up effectively the sensing material and its thermal isolation was kept. The uniformity of temperature on the sensing material can be improved by modifying the shape of micro hotplate.

• Transactions on Electrical and Electronic Materials
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• v.17 no.4
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• pp.189-195
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• 2016

Micro Hotplate (MHP) is the key component in micro-sensors, particularly gas sensors. Indeed, in metal oxide gas sensors MOX, micro-heater is used as a hotplate in order to control the temperature of the sensing layer which should be in the requisite temperature range over the heater area, so as to detect the resistive changes as a function of varying concentration of different gases. Hence, their design is a very important aspect. In this paper, we have presented the design and simulation results of a meander micro heater based on three different materials - platinum, titanium and tungsten. The dielectric membrane size is 1.4 mm × 1.6 mm with a thickness of 1.4 μm. Above the membrane, a meander heating film was deposed with a thickness of 100 nm. In order to optimize the geometry, a comparative study by simulating two different heater thicknesses, then two inter track widths has also been presented. Power consumption and temperature distribution were determined in the micro heater´s structure over a supply voltage of 5, 6, and 7 V.

• ETRI Journal
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• v.30 no.4
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• pp.516-525
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• 2008

This paper proposes a compact, energy-efficient, and smart gas sensor platform technology for ubiquitous sensor network (USN) applications. The compact design of the platform is realized by employing silicon-on-insulator (SOI) technology. The sensing element is fully integrated with SOI CMOS circuits for signal processing and communication. Also, the micro-hotplate operates at high temperatures with extremely low power consumption, which is important for USN applications. ZnO nanowires are synthesized onto the micro-hotplate by a simple hydrothermal process and are patterned by a lift-off to form the gas sensor. The sensor was operated at $200^{\circ}C$ and showed a good response to 100 ppb $NO_2$ gas.

• Proceedings of the Korean Vacuum Society Conference
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• 2012.08a
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• pp.380-381
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• 2012

Bioinspired sea urchin-like structures were fabricated on silicon by inductively coupled plasma (ICP) etching using lens-like shape hexagonally patterned photoresist (PR) patterns and subsequent metal-assisted chemical etching (MaCE) [1]. The lens-like shape PR patterns with a diameter of 2 ${\mu}m$ were formed by conventional lithography method followed by thermal reflow process of PR patterns on a hotplate at $170^{\circ}C$ for 40 s. ICP etching process was carried out in an SF6 plasma ambient using an optimum etching conditions such as radio-frequency power of 50 W, ICP power of 25 W, SF6 flow rate of 30 sccm, process pressure of 10 mTorr, and etching time of 150 s in order to produce micron structure with tapered etch profile. 15 nm thick Ag film was evaporated on the samples using e-beam evaporator with a deposition rate of 0.05 nm/s. To form Ag nanoparticles (NPs), the samples were thermally treated (thermally dewetted) in a rapid thermal annealing system at $500^{\circ}C$ for 1 min in a nitrogen environment. The Ag thickness and thermal dewetting conditions were carefully chosen to obtain isolated Ag NPs. To fabricate needle-like nanostructures on both the micron structure (i.e., sea urchin-like structures) and flat surface of silicon, MaCE process, which is based on the strong catalytic activity of metal, was performed in a chemical etchant (HNO3: HF: H2O = 4: 1: 20) using Ag NPs at room temperature for 1 min. Finally, the residual Ag NPs were removed by immersion in a HNO3 solution. The fabricated structures after each process steps are shown in figure 1. It is well-known that the hierarchical micro- and nanostructures have efficient light harvesting properties [2-3]. Therefore, this fabrication technique for production of sea urchin-like structures is applicable to improve the performance of light harvesting devices.

• Journal of Sensor Science and Technology
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• v.5 no.5
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• pp.69-77
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• 1996

In this paper, we fabricated the micro hotplate which consisted of a thin film heater(Pt/Cr bilayers) sandwiched with the thermal oxide and E-beam evaporated oxide. And we studied the electrical and the structural properties of Pt/Cr bilayers due to annealing temperature. When we compared the temperature measured from type k thermocouples with the temperature acquired from I.R. thermo-vision system according to the variations of emissivity, the emissivity of I-beam evaporated oxide was 0.5. The sheet resistance of Pt/Cr bilayers didn't depend on the Cr layer thickness, and it was considered as the existence of CrO between the Pt and the Cr layer. When the annealing temperature was increased from $500^{\circ}C$ to $700^{\circ}C$, the out-diffusions of Cr were increased(which was confirmed by AES depth profile) and the grain size of Pt(220) phase was enlarged also(analyzed by XRD and SEM photographs). From the results of XRD analysis and AES depth profile, the Pt/Cr bilayers annealed at $500^{\circ}C$ were more stable than any other cases in structural properties.