• 한국정밀공학회:학술대회논문집
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• 한국정밀공학회 2000년도 춘계학술대회 논문집
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• pp.1051-1054
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• 2000

We developed the micro CSF (celebrospinal fluid) shunt valve with surface and bulk micromachining technology in polymer MEMS. This micro CSF shunt valve was formed with four micro check valves to have a membrane connected to the anchor with the four bridges. The up-down movement of the membrane made the CSF on & off and the valve characteristic such as open pressure was controlled by the thickness and shape of the bridge and the membrane. The membrane, anchor and bridge layer were made of the $O_2$ RIE (reactive ion etching) patterned Parylene thin film to be about 5~10 microns in thickness on the silicon wafer. The dimension of the rectangular nozzle is 0.2＊0.2 $\textrm{mm}^2$ and the membrane 0.45 mm in diameter. The bridge width is designed variously from 0.04 mm to 0.12 mm to control the valve characteristics. To protect the membrane and bridge in the CSF flow, we developed the packaging system for the CSF micro shunt valve with the deep RIE of the silicon wafer. Using this package, we can control the gap size between the membrane and the nozzle, and protect the bridge not to be broken in the flow. The total dimension of the assembled system is 2.5＊2.5 $\textrm{mm}^2$ in square, 0.8 mm in height. We could precisely control the burst pressure and low rate of the valve varing the design parameters, and develop the whole CSF shunt system using this polymer MEMS fabricated CSF shunt valve.

• 대한전자공학회논문지SD
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• 제40권8호
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• pp.543-548
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• 2003

본 논문에서는 큰 회전각을 갖는 2축 자유도 마이크로 미러를 제안하고 제작하였다. 이러한 마이크로 미러는 N×N 대용량 광 크로스 커넥트 스위치(optical cross-connect switch)를 구현하는 데 필수적인 요소이다. 스위치의 용량을 증가시키기 위해서는 각각의 마이크로 미러의 회전각을 크게 해야 한다. 이 미러가 큰 각도로 회전하기 위해서는 상부 전극인 미러 판과 하부전극 사이에 충분한 공간이 확보 되어야 한다. 제안된 구조는 기판미세 가공법 (bulk micromachining)을 이용하여 상부전극인 미러와 하부전극을 각각 다른 기판에 제작한 후, 두 기판을 접합함으로써 쉽게 미러의 회전 공간을 확보하였다. 따라서 미러의 회전공간 확보를 위한 별도의 구동기(actuator)를 도입할 필요가 없었다. 제작된 마이크로 미러의 성능을 측정한 결과를 살펴보면, x축과 y축 방향으로의 회전각은 각각 ±5.5°와 ±8.4°였으며, 이 때의 풀인 (pull-in)전압은 각각 380 V와 275 V였다. 이러한 회전각의 성능은 전 세계적으로 지금까지 보고된 연구결과 중에서 가장 우수한 결과이다.

• 한국진공학회:학술대회논문집
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• 한국진공학회 2011년도 제40회 동계학술대회 초록집
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• pp.68-68
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• 2011

As feature size is smaller, new technology are needed in semiconductor factory such as gap-fill technology for sub 100nm, development of ALD equipment for Cu barrier/seed, oxide trench etcher technology for 25 nm and beyond, development of high throughput Cu CMP equipment for 30nm and development of poly etcher for 25 nm and so on. We are focus on gap-fill technology for sub-30nm. There are many problems, which are leaning, over-hang, void, micro-pore, delaminate, thickness limitation, squeeze-in, squeeze-out and thinning phenomenon in sub-30 nm gap fill. New gap-fill processes, which are viscous oxide-SOD (spin on dielectric), O3-TEOS, NF3 Based HDP and Flowable oxide have been attempting to overcome these problems. Some groups investigated SOD process. Because gap-fill performance of SOD is best and process parameter is simple. Nevertheless these advantages, SOD processes have some problems. First, material cost is high. Second, density of SOD is too low. Therefore annealing and curing process certainly necessary to get hard density film. On the other hand, film density by Flowable oxide process is higher than film density by SOD process. Therefore, we are focus on Flowable oxide. In this work, dielectric film were deposited by PECVD with TSA(Trisilylamine - N(SiH3)3) and NH3. To get flow-ability, the effect of plasma treatment was investigated as function of O2 plasma power. QMS (quadruple mass spectrometry) and FTIR was used to analysis mechanism. Gap-filling performance and flow ability was confirmed by various patterns.

• 한국콘텐츠학회논문지
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• 제13권9호
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• pp.400-409
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• 2013

본 연구에서는 한국 운전자의 특성을 고려한 회전교차로 진입 임계간격을 조사하여 이를 기반으로 다양한 교통조건 및 다지 회전교차로에 대하여 그 효과를 분석하였다. 회전교차로의 임계간격은 4지, 5지, 6지, 그리고 7지에 대하여 현장조사를 수행하였으며, Raff의 추정기법을 이용하여 임계간격을 도출하였다. 도출된 임계간격은 모의실험을 위한 정산 및 통계적 검증과정을 거쳤으며, 이를 기반으로 다양한 조건에서 회전교차로 운영분석을 수행하였다. 그 결과 운영 교통량 및 회전비율 등에 따른 다지 회전교차로의 설계요소인 내접원 직경을 서비스수준별로 제시하였다. 이는 향후 회전교차로 설계지침에 반영할 수 있을 것으로 사료된다.

• 아태비즈니스연구
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• 제15권1호
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• pp.239-256
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• 2024

Purpose - The purpose of this study was to examine the main determinants of the gap between housing demand and house affordability. Design/methodology/approach - This study used the micro-level data of 60,043 households from Korea Housing-Finance Corporation by covering the period 2011 to 2022. Findings - First, the trend of general housing demand showed a higher figure in the future demand than in current demand. And such a tendency showed in all types of households, a relative young, low income, and single households. In the case of current housing demand, it has increased by 2022 from the beginning of 2013, while the future demand has rapidly increased from 2020. Second, although the house affordability showed a higher figure in current housing demand by 2019, its trend changed to be higher in future housing demand from 2020 by a rapid decreasing affordbility in current demand. In the case of young householders, the current house affordability was higher than that of future. The figure of low income householders was below 1 point in both periods, and house affordability of single householders showed a similar level in both periods. which showed over 1 point. Third, financial regulation on housing markets induced th widening of the gap between housing demand and house affordability, and such a trend is much atronger in the future(potential) gap of demand and affordability. More specifically, the strengthen financial regulation leaded to the widening of the gap in all types of households, a relative young, low income, and single households. Research implications or Originality - The effect of financial regulation is necessary to consider under the features of each households.

• 한국산학기술학회논문지
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• 제15권9호
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• pp.5758-5762
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• 2014

정전기적으로 구동되는 마이크로 소자는 센서 및 엑츄에이터 산업 분야에서 널리 활용되고 있다. 정전기적으로 구동되는 마이크로 소자 구조체는 수 마이크로미터 이하의 전극 사이 간격으로서 정전기적인 부착 현상에 의한 고장이 발생 한다. 본 연구에서는 마이크로 소자의 부착 현상을 개선하기위하여 전극의 길이와 면적을 달리한 마이크로 소자의 구조체를 제작하고, 원자 층 증착방법에 의한 알루미나 코팅 전과 후의 마이크로 소자의 풀인 전압(pull-in voltage)을 측정 비교 분석 하였다. 마이크로 소자의 상부 전극 길이 변화에서는 알루미나 코팅 후에 풀인 전압의 상승이 관찰되었고 전극면적이 클수록 풀인 전압 상승이 관찰되었다. 정전기적으로 구동되는 마이크로 소자의 부착 현상을 개선하기위한 방안으로 본 연구에서 적용된 알루미나 코팅 방법은 효과적인 방법이다.

• 한국정밀공학회:학술대회논문집
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• 한국정밀공학회 2006년도 춘계학술대회 논문집
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• pp.499-500
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• 2006

The electrode wear in micro-EDM significantly deteriorates the machining accuracy. In this regard, electrode wear needs to be compensated in-process to improve the product quality. Therefore, there are substantial amount of research about electrode wear. In this study a control method for micro-EDM using discharge pulse counting is proposed. The method is based on the assumption that the removed workpiece volume is proportional to the number of discharge pulses, which is verified from experimental results analyzing geometrically machined volume according to various number of discharges. Especially, the method has an advantage that electrode wear does not need to be concerned. The proposed method is implemented to an actual micro-EDM system using high speed data acquisition board, simple counting algorithm with 3 axis motion system. As a result, it is demonstrated that the volume of hole machined by EDM drilling can be accurately estimated using the number of discharge pulses. In EDM milling process a micro groove without depth variation caused by electrode wear could be machined using the developed control method. Consequently, it is shown that machining accuracy in drilling and milling processes can be improved by using process control based on the number of discharge pulses.

• Journal of applied mathematics & informatics
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• 제25권1_2호
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• pp.315-327
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• 2007

Mathematical aspects of the electromagnetic surface-wave propagation are examined for the dielectric core consisting of multiple sub-layers, which are embedded in the gap between the two bounding cladding metals. For this purpose, the linear problem with a partial differential wave equation is formulated into a nonlinear eigenvalue problem. The resulting eigenvalue is found to exist only for a certain combination of the material densities and the number of the multiple sub-layers. The implications of several limiting cases are discussed in terms of electromagnetic characteristics.

• 대한기계학회:학술대회논문집
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• 대한기계학회 2001년도 추계학술대회논문집B
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• pp.952-957
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• 2001

The objectives of this investigation were to obtain an excellent spray by cavitation under the low injection pressure. When cavitation occurs in the nozzle hole, the atomization of the liquid jet enhanced considerably. In this experiments, a acrylic nozzle made the gap and installed the bypass in the nozzle hole was used to enhance the atomization of the liquid jet at the low injection pressure. The liquid flow in the nozzle hole was photographed by a transmitted light using a micro flash. The spray angle was measured macroscope images of PMAS and the Sauter mean diameter was measured PDA system. To measure the pressure of the nozzle hole, pressure transducer was used. The results of this study indicated that enhanced atomization of the liquid jet at the low injection pressure was obtained by making the gap and installing the bypass at the single hole nozzle.

• 동력기계공학회지
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• 제5권2호
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• pp.36-42
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• 2001

This paper deals with finite element analyses of residual stresses causing popping up which are induced in micromachining processes of a microaccelerometer sensors. The paddle of the micro accelerometer sensor is designed symmetric with respect to the direction of the beam. After heating the tunnel gap up to 100 degree and get it through the cooling process and the additional beam up to 80 degree and get it through the cooling process. We learn the thermal internal stresses of each shape and compare the results with each other, after heating the tunnel gap up to 400 degree during the Pt deposition process. Finally we find the optimal shape which is able to minimize the internal stresses of microaccelerometer sensor. We want to seek after the real cause of this pop up phenomenon and diminish this by change manufacturing processes of microaccelerometer sensor by electrostatic force.