• Proceedings of the Korean Society of Precision Engineering Conference
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• 2000.05a
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• pp.1051-1054
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• 2000

We developed the micro CSF (celebrospinal fluid) shunt valve with surface and bulk micromachining technology in polymer MEMS. This micro CSF shunt valve was formed with four micro check valves to have a membrane connected to the anchor with the four bridges. The up-down movement of the membrane made the CSF on & off and the valve characteristic such as open pressure was controlled by the thickness and shape of the bridge and the membrane. The membrane, anchor and bridge layer were made of the $O_2$ RIE (reactive ion etching) patterned Parylene thin film to be about 5~10 microns in thickness on the silicon wafer. The dimension of the rectangular nozzle is 0.2＊0.2 $\textrm{mm}^2$ and the membrane 0.45 mm in diameter. The bridge width is designed variously from 0.04 mm to 0.12 mm to control the valve characteristics. To protect the membrane and bridge in the CSF flow, we developed the packaging system for the CSF micro shunt valve with the deep RIE of the silicon wafer. Using this package, we can control the gap size between the membrane and the nozzle, and protect the bridge not to be broken in the flow. The total dimension of the assembled system is 2.5＊2.5 $\textrm{mm}^2$ in square, 0.8 mm in height. We could precisely control the burst pressure and low rate of the valve varing the design parameters, and develop the whole CSF shunt system using this polymer MEMS fabricated CSF shunt valve.

• Journal of the Institute of Electronics Engineers of Korea SD
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• v.40 no.8
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• pp.543-548
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• 2003

In this paper, we have proposed and fabricated a two-axis rotational micro-mirror with large tilt angle. Such a micro-mirror is a key element for N$\times$N high capacity optical cross-connect switches. The micro-mirror is required to have large tilt angle to increase the capacity of the cross-connect switches. For larger micro-mirror tilt angle between the grounded mirror plate and the bottom electrode is to be large enough to provide space for the tilting of the mirror. For our proposed structure, the gap was produced in such a way that the grounded mirror plate and the bottom electrode were made separately in different substrates by using the bulk micromachining technology, and combined later by employing self-align technique. As a result, a large tilt angle has been achieved without using additional actuators. The measured tilt angles were as large as $\pm$5.5$^{\circ}$ and $\pm$8.4$^{\circ}$ in the x and y direction respectively, and the pull-in voltages for the two directions were 380 V and 275 V respectively. Finally the fabricated mirror was successfully utilized to steer the optical beam. To our knowledge, our micro-mirror has the best performance among the micro-mirrors reported internationally so far.

• Proceedings of the Korean Vacuum Society Conference
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• 2011.02a
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• pp.68-68
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• 2011

As feature size is smaller, new technology are needed in semiconductor factory such as gap-fill technology for sub 100nm, development of ALD equipment for Cu barrier/seed, oxide trench etcher technology for 25 nm and beyond, development of high throughput Cu CMP equipment for 30nm and development of poly etcher for 25 nm and so on. We are focus on gap-fill technology for sub-30nm. There are many problems, which are leaning, over-hang, void, micro-pore, delaminate, thickness limitation, squeeze-in, squeeze-out and thinning phenomenon in sub-30 nm gap fill. New gap-fill processes, which are viscous oxide-SOD (spin on dielectric), O3-TEOS, NF3 Based HDP and Flowable oxide have been attempting to overcome these problems. Some groups investigated SOD process. Because gap-fill performance of SOD is best and process parameter is simple. Nevertheless these advantages, SOD processes have some problems. First, material cost is high. Second, density of SOD is too low. Therefore annealing and curing process certainly necessary to get hard density film. On the other hand, film density by Flowable oxide process is higher than film density by SOD process. Therefore, we are focus on Flowable oxide. In this work, dielectric film were deposited by PECVD with TSA(Trisilylamine - N(SiH3)3) and NH3. To get flow-ability, the effect of plasma treatment was investigated as function of O2 plasma power. QMS (quadruple mass spectrometry) and FTIR was used to analysis mechanism. Gap-filling performance and flow ability was confirmed by various patterns.

• The Journal of the Korea Contents Association
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• v.13 no.9
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• pp.400-409
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• 2013

In this paper, considering the characteristics of the driver at roundabouts by investigating the critical gap acceptance on various traffic conditions, multi-legged roundabouts were evaluated. The gap acceptance and rejection of 4-legged, 5-legged, 6-legged, and 7-legged roundabout were surveyed on real fields, and the critical gap acceptance was estimated using Raff's methods. Derived the critical gap acceptance was processed calibration and validation for micro-simulation, and then multi-legged roundabouts under variable conditions such as variations of traffic volume, turning ratio, and size of inscribed circle diameter were evaluated to verify operating conditions of roundabouts. As the results, according to the operating traffic volume and turning ratio, the inscribed circle diameters were proposed at each level of service. These inscribed circle diameters were able to reflect the guideline of geometric design for multi-legged roundabouts.

• Asia-Pacific Journal of Business
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• v.15 no.1
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• pp.239-256
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• 2024

Purpose - The purpose of this study was to examine the main determinants of the gap between housing demand and house affordability. Design/methodology/approach - This study used the micro-level data of 60,043 households from Korea Housing-Finance Corporation by covering the period 2011 to 2022. Findings - First, the trend of general housing demand showed a higher figure in the future demand than in current demand. And such a tendency showed in all types of households, a relative young, low income, and single households. In the case of current housing demand, it has increased by 2022 from the beginning of 2013, while the future demand has rapidly increased from 2020. Second, although the house affordability showed a higher figure in current housing demand by 2019, its trend changed to be higher in future housing demand from 2020 by a rapid decreasing affordbility in current demand. In the case of young householders, the current house affordability was higher than that of future. The figure of low income householders was below 1 point in both periods, and house affordability of single householders showed a similar level in both periods. which showed over 1 point. Third, financial regulation on housing markets induced th widening of the gap between housing demand and house affordability, and such a trend is much atronger in the future(potential) gap of demand and affordability. More specifically, the strengthen financial regulation leaded to the widening of the gap in all types of households, a relative young, low income, and single households. Research implications or Originality - The effect of financial regulation is necessary to consider under the features of each households.

• Journal of the Korea Academia-Industrial cooperation Society
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• v.15 no.9
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• pp.5758-5762
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• 2014

Electrostatically-actuated Micro device have been used widely in a variety of integrated sensors and actuators. Electrostatically-actuated micro devices with a gap of several micrometers or less between the electrodes have shown failure problems by electrostatic adhesion. To improve this adhesion phenomenon, micro devices of varying lengths and widths in electrodes were fabricated, and an alumina coating was then deposited using atomic layer deposition technology. The effects of improving adhesion phenomenon were compared by measuring the pull-in voltage before and after the coating process. The pull-in voltage increased with increasing length of the upper electrode after the coating. An increase in the electrode area results in an increase in the pull-in voltage after coating. The alumina coating method applied to improve the adhesion on an electrostatically-actuated micro device was observed as an effective method.

• Proceedings of the Korean Society of Precision Engineering Conference
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• 2006.05a
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• pp.499-500
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• 2006

The electrode wear in micro-EDM significantly deteriorates the machining accuracy. In this regard, electrode wear needs to be compensated in-process to improve the product quality. Therefore, there are substantial amount of research about electrode wear. In this study a control method for micro-EDM using discharge pulse counting is proposed. The method is based on the assumption that the removed workpiece volume is proportional to the number of discharge pulses, which is verified from experimental results analyzing geometrically machined volume according to various number of discharges. Especially, the method has an advantage that electrode wear does not need to be concerned. The proposed method is implemented to an actual micro-EDM system using high speed data acquisition board, simple counting algorithm with 3 axis motion system. As a result, it is demonstrated that the volume of hole machined by EDM drilling can be accurately estimated using the number of discharge pulses. In EDM milling process a micro groove without depth variation caused by electrode wear could be machined using the developed control method. Consequently, it is shown that machining accuracy in drilling and milling processes can be improved by using process control based on the number of discharge pulses.

• Journal of applied mathematics & informatics
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• v.25 no.1_2
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• pp.315-327
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• 2007

Mathematical aspects of the electromagnetic surface-wave propagation are examined for the dielectric core consisting of multiple sub-layers, which are embedded in the gap between the two bounding cladding metals. For this purpose, the linear problem with a partial differential wave equation is formulated into a nonlinear eigenvalue problem. The resulting eigenvalue is found to exist only for a certain combination of the material densities and the number of the multiple sub-layers. The implications of several limiting cases are discussed in terms of electromagnetic characteristics.

• Proceedings of the KSME Conference
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• 2001.11b
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• pp.952-957
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• 2001

The objectives of this investigation were to obtain an excellent spray by cavitation under the low injection pressure. When cavitation occurs in the nozzle hole, the atomization of the liquid jet enhanced considerably. In this experiments, a acrylic nozzle made the gap and installed the bypass in the nozzle hole was used to enhance the atomization of the liquid jet at the low injection pressure. The liquid flow in the nozzle hole was photographed by a transmitted light using a micro flash. The spray angle was measured macroscope images of PMAS and the Sauter mean diameter was measured PDA system. To measure the pressure of the nozzle hole, pressure transducer was used. The results of this study indicated that enhanced atomization of the liquid jet at the low injection pressure was obtained by making the gap and installing the bypass at the single hole nozzle.

• Journal of Power System Engineering
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• v.5 no.2
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• pp.36-42
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• 2001

This paper deals with finite element analyses of residual stresses causing popping up which are induced in micromachining processes of a microaccelerometer sensors. The paddle of the micro accelerometer sensor is designed symmetric with respect to the direction of the beam. After heating the tunnel gap up to 100 degree and get it through the cooling process and the additional beam up to 80 degree and get it through the cooling process. We learn the thermal internal stresses of each shape and compare the results with each other, after heating the tunnel gap up to 400 degree during the Pt deposition process. Finally we find the optimal shape which is able to minimize the internal stresses of microaccelerometer sensor. We want to seek after the real cause of this pop up phenomenon and diminish this by change manufacturing processes of microaccelerometer sensor by electrostatic force.