• Journal of the Korean Society of Manufacturing Process Engineers
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• v.20 no.1
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• pp.103-109
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• 2021

Fine chips generated by machining have an impact on machine failure and quality of machined products, it is necessary to remove the chips, so the microchip collection and removal device by rotating conveyor belt with neodymium permanent magnets was developed. In this research, to solve the problem for reducing the existing microchips in the tank, a micro-chip removal device by rotating conveyor belt with neodymium permanent magnets developed. In the development of micro-chip removal device, 3D CATIA modeling was used, and the flow analysis and the electromagnetic force analysis were performed with COMSOL Multiphysics program. To evaluate the performance of the prototypes produced, design of experiments (DOE) is used to obtain the effect of neodymium conveyor movement speed on chip removal for the ANOVA analysis of recovered powders. An experiment was conducted to investigate the effect of the conveyor feed rate on the chip removal performance in detail. As a result of the experiment, it was confirmed that the slower the feeding speed of the fine chip removing device, the more efficient the chip removal.

• Biotechnology and Bioprocess Engineering:BBE
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• v.9 no.2
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• pp.86-92
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• 2004

In this paper miniaturized disposable micro/nanofluidic components applicable to bio chip, chemical analyzer and biomedical monitoring system, such as blood analysis, micro dosing system and cell experiment, etc are reported. This system includes various microfluidic components including a micropump, micromixer, DNA purification chip and single-cell assay chip. For low voltage and low power operation, a surface tension-driven micropump is presented, as well as a micromixer, which was implemented using MEMS technology, for efficient liquid mixing is also introduced. As bio-reactors, DNA purification and single-cell assay devices, for the extraction of pure DNA from liquid mixture or blood and for cellular engineering or high-throughput screening, respectively, are presented.

• Journal of Sensor Science and Technology
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• v.20 no.3
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• pp.187-192
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• 2011

Abrasive blaster is similar to sand blaster, and effectively removes hard and brittle materials. Exiting abrasive blaster has applied to rough working such as deburring and rough finishing. As the need for machining of ceramics, semiconductor, electronic devices and LCD are increasing, micro abrasive blaster was developed, and became the inevitable technique to micromachining. This paper describes the performance of the micro blaster in MEMS process of glass and succeed in domestically producing complete micro blaster. Diameter of hole and width of line in this etching is 100 ${\mu}m$ ~ 1000 ${\mu}m$. Experimental results showed good performance in micro channel and hole in glass wafer. Therefore, this micro blaster could be effectively applied to the micro machining of semiconductor, micro PCR chip.

• Journal of the Korean Society of Manufacturing Process Engineers
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• v.18 no.1
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• pp.101-108
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• 2019

In this study, the hole-cavity resonance technology and the micro pore stainless chip sintering technology were fused to develop silencers with excellent noise attenuation performance even at fluid pressures exceeding 30 bar for the first time at home and abroad. As a result of this study, the noise attenuation performance was greatly improved as reflection, loss, and resonance were made to occur thousands of times simultaneously when fluids pass through the sintered micro pore stainless steel chip sound absorber. The noise of the gas emitted from the bomb without the silencer was shown to be 125dB. And noise test conducted after installation of the silencer showed the noise of 67dB. Given the study results, the amount of noise was greatly reduced in the sintered silencer.

• Proceedings of the Korean Society of Precision Engineering Conference
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• 2002.05a
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• pp.910-913
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• 2002

Recently, the sensor and actuator are developed with EAP(Electro Active Polymer). Common used of they is close at hand, the bio chip and Lab on a chip are researched. For developed bio and micro system, a researcher applies semiconductor fabrication or make it by his hand. But, this method takes long time and a tolerance is large So they are problem of common used. So In this paper we propose the new inject ion molder and micro mold. The micro mold is different from exist ing mold. In this paper, the fabration of micro mold is introduced to inject.

• ETRI Journal
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• v.36 no.3
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• pp.343-351
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• 2014

For the fine-pitch application of flip-chip bonding with semiconductor packaging, fluxing and hybrid underfills were developed. A micro-encapsulated catalyst was adopted to control the chemical reaction at room and processing temperatures. From the experiments with a differential scanning calorimetry and viscometer, the chemical reaction and viscosity changes were quantitatively characterized, and the optimum type and amount of micro-encapsulated catalyst were determined to obtain the best pot life from a commercial viewpoint. It is expected that fluxing and hybrid underfills will be applied to fine-pitch flip-chip bonding processes and be highly reliable.

• Proceedings of the Korean Society of Precision Engineering Conference
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• 2003.06a
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• pp.604-607
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• 2003

This study investigates the micro-cutting of cemented carbides using PCD(polycrystalline diamond) and PCBN(polycrystalline cubic boron nitride) cutting tools are performed with SEM direct observation method. The purpose of this study is to make clear the cutting mechanism of cemented carbides and the fracture of WC particles at the plastic deformation zone in orthogonal micro-cutting. And also to achieve systematic understanding, the effect of machining parameter on chip formation and machined surface was investigated, including cutting speed. depth of cut and various tool rake angle.

• Proceedings of the KIPE Conference
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• 2002.07a
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• pp.451-454
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• 2002

In this paper, studied on the one-chip design of low cost for the micro-stepping drive having 5-phase Pentagon Type winding. Micro-stepping method in order to eliminate effectively the resonant phenomena and to Increase the positional resolution. This paper proposed trapezoidal current wave- form for current control and provided design- method by using only one-chip of low cost. Therefore the drive will be simple and small size. Also the drive will have a lot of advantage at commercial business. Finally the above study has been implemented on the VHDL. Simulation has been performed to verify the PWM for micro-stepping drive.

• Journal of the Korean Society for Precision Engineering
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• v.13 no.12
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• pp.46-53
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• 1996

Micro drilling is one of the most important machining types and its necessity becomes more and more increasing in the whole field of industry. Micro drilling, however, has few the case of practical application, because it requests high techniques : manufacturing micro drill, treating chip, producting precise hole shape and progressing machining effeciency. Micro drilling has a technical problem: drill breakage from the lack of drill rigdity and the interuption of chip. It is, therefore, essential to select the proper cutting conditions and the step fed for the method solving the lack of rigidity and the interruption of chip. Especially, step feed is very efficient to avoid the breakage of drill, but bring about reducing of cutting efficiency. The study on step feed must be requested more than the present in the near future. The purpose of this paper is to investigate experimentally about cutting conditions which affect on tools and round errors and to estimate about the effect of step feed as well as optimal step feed size to solve the breakage of drill.

• Journal of the Microelectronics and Packaging Society
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• v.10 no.4
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• pp.53-60
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• 2003

CCD(Charge-Coupled Device) wafers, with a layer of micro lenses on top, usually are not passivated with dielectric films. Micro lenses, in general, are made of polymer material, which usually has a large affinity for particles generated in the various chip fabrication processes, most notably the wafer sawing for chip-dicing. The particles deposited on the micro lens layer either seriously attenuate or deflect the incoming light and often lead to CCD failure. In this study we introduce new type of saws which would significantly reduce the particle-related problems found in conventional type of saws. In the new saws, the positions and diverging angles of side and center nozzles have been optimized so as to flush the particles effectively. In addition, an independent nozzle is added for the sole purpose of flushing the generated particles. The test results show that, with the new saws. the ratio of the particle-related CCD chip failures has been dropped drastically from 9.1% to 0.63%.